Another reason is that the material of the spreader must match the thermal coefficient of expansion of die as closely as possible. And these materials generally have medium thermal conductivities, which translates into higher temperature drop across them. So if you use the same material, either you get 1. higher heatsink thermal resistance if you use material of spreader for the heatsink OR 2. possibility of cracking of joint between spreader/heatsink and die ( which is of course far worse than reason #1)
You might also consider Zenwalk linux http://www.zenwalk.org/ which comes with lightweight Xfce desktop environment and latest versions of popular apps.
I think Apple got scared of having their software pirated in India, especially due to leakage of source code. Having on same hardware specs as Windows only aggrevates the concern.
I wonder how no one else has posted this before !
Slashdot Mirror
How about this one.. In Soviet Russia, you install keyloggers in government !
Another reason is that the material of the spreader must match the thermal coefficient of expansion of die as closely as possible. And these materials generally have medium thermal conductivities, which translates into higher temperature drop across them. So if you use the same material, either you get 1. higher heatsink thermal resistance if you use material of spreader for the heatsink OR 2. possibility of cracking of joint between spreader/heatsink and die ( which is of course far worse than reason #1)
You might also consider Zenwalk linux http://www.zenwalk.org/ which comes with lightweight Xfce desktop environment and latest versions of popular apps.
I think Apple got scared of having their software pirated in India, especially due to leakage of source code. Having on same hardware specs as Windows only aggrevates the concern. I wonder how no one else has posted this before !