MEMS Actuated On Chip Water Cooling

Epoch of Entropy writes "Electronics Cooling has this article : "A Stanford research team is using MEMS technology to explore the lower bound volume for the heat sink. The technology combines two-phase convection in micromachined silicon heat sinks (microchannels) with a novel electroosmotic pump to achieve minimal heat sink volume at the chip backside. ...features a novel and compact electroosmotic pump, forced two-phase convection in the heat sink, and a remote heat rejecter." This translates into: We've figured out a way to put a water cooling system right on the CPU."

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[Playboy3k]

largo: I must over clock i must over clock it can be clock to amazing levels piro: calm down! Largo: it can be so l33t now that they water cool the chip its self Piro:How did u afford the chip and that watercooling kit Largo:Do not ask questions! Must overclock to be l33t