MEMS Actuated On Chip Water Cooling

Epoch of Entropy writes "Electronics Cooling has this article : "A Stanford research team is using MEMS technology to explore the lower bound volume for the heat sink. The technology combines two-phase convection in micromachined silicon heat sinks (microchannels) with a novel electroosmotic pump to achieve minimal heat sink volume at the chip backside. ...features a novel and compact electroosmotic pump, forced two-phase convection in the heat sink, and a remote heat rejecter." This translates into: We've figured out a way to put a water cooling system right on the CPU."

Comments

U Gotz 2 h4v3 th3 Flow, Yo

[QuietRiot]

Be sure you filter your water well, or you could give your processor a stroke!