MEMS Actuated On Chip Water Cooling

Epoch of Entropy writes "Electronics Cooling has this article : "A Stanford research team is using MEMS technology to explore the lower bound volume for the heat sink. The technology combines two-phase convection in micromachined silicon heat sinks (microchannels) with a novel electroosmotic pump to achieve minimal heat sink volume at the chip backside. ...features a novel and compact electroosmotic pump, forced two-phase convection in the heat sink, and a remote heat rejecter." This translates into: We've figured out a way to put a water cooling system right on the CPU."

Comments

on chip heat pipe?

[Hadlock]

that's what this sounds like to me...