Sun Unveils Direct chip-to-chip Interconnect

mfago writes "On Tuesday September 23, Sun researchers R. Drost, R. Hopkins and I. Sutherland will present the paper "Proximity Communication" at the CICC conference in San Jose. According to an article published in the NYTimes, this breakthrough may eventually allow chips arranged in a checkerboard pattern to communicate directly with each other at over a Terabit per second using arrays of capacitively coupled transmitters and recievers located on the chip edges. Perhaps the beginning of a solution to the lag between memory and interconnect speed versus cpu frequency?"

Comments

Re:IANAEE (I am not an electrical engineer)

[proj_2501]

Yeah, YOU try to coordinate redesigns for 4 different chip vendors, who are also redesigning their chips for EACH OF THEIR CUSTOMERS.

Re:FINALLY!

[javatips]

My EE instructor always said that they could improve performance by doing one simple thing: make the interconnects on the motherboard between the motherboard and RAM rounded instead of cornered. You could then increase bus speed as you wouldn't have magnetic loss at the corners like you do now.

I hope that you instructor applied for a patent for this... If he did, he will be rich soon just be licensing this incedible breakthrough in interconnecting chips.

The actual good consequence is that he will stop teaching soon. I hate crappy instructor who think they have great idea to make stuff better, but do nothing with it... Especially, easy to implement improvements. If what he said to you was not full of crap, you can be sure that someone would have implemented this!