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Building Chips Like LEGO

Posted by Hemos on from the i-need-the-yellow-capacitor dept.

MattSparkes writes "It seems that 3D silicon chips, allowing designers to fit more components into a smaller space, could soon be made far easier to create with a little inspiration from a classic children's toy. "Silicon wafers covered with matching patterns of Lego-like teeth and holes could aid the development of 3D electronics, say UK researchers." Crucially, this technique can make use of existing machinery."

2 of 50 comments (clear)

  1. Coooling by LiquidCoooled · · Score: 5, Interesting

    I hope the central portions of these chips have enough space to allow cooling to be achieved.

    If the stack is open, then could the cooling actually be better than a single over the top method.
    This could work like the fins inside double layered home radiators.

    --
    liqbase :: faster than paper
  2. Re:Patents? by sunderland56 · · Score: 4, Interesting
    Never mind the patents - Lego is a trademark. The Danish toy manufacturer very strongly defends that trademark.


    If you have silicon chips that fit together like little plastic children's toy blocks, that's perfectly fine. But if you mention the word Lego - even in internal company documents - you'll have a swarm of lawyers knocking at your door. (Yes, this has happened before).