Building Chips Like LEGO
MattSparkes writes "It seems that 3D silicon chips, allowing designers to fit more components into a smaller space, could soon be made far easier to create with a little inspiration from a classic children's toy. "Silicon wafers covered with matching patterns of Lego-like teeth and holes could aid the development of 3D electronics, say UK researchers." Crucially, this technique can make use of existing machinery."
I hope the central portions of these chips have enough space to allow cooling to be achieved.
If the stack is open, then could the cooling actually be better than a single over the top method.
This could work like the fins inside double layered home radiators.
liqbase
The patents on Lego expired a few decades ago. They recently tried using trademark law as a work-around, by trademarking the arrangement of dots on the surface of their bricks, but it didn't stand up in court.
I am TheRaven on Soylent News
If you have silicon chips that fit together like little plastic children's toy blocks, that's perfectly fine. But if you mention the word Lego - even in internal company documents - you'll have a swarm of lawyers knocking at your door. (Yes, this has happened before).