Building Chips Like LEGO
MattSparkes writes "It seems that 3D silicon chips, allowing designers to fit more components into a smaller space, could soon be made far easier to create with a little inspiration from a classic children's toy. "Silicon wafers covered with matching patterns of Lego-like teeth and holes could aid the development of 3D electronics, say UK researchers." Crucially, this technique can make use of existing machinery."
I hope the central portions of these chips have enough space to allow cooling to be achieved.
If the stack is open, then could the cooling actually be better than a single over the top method.
This could work like the fins inside double layered home radiators.
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