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IBM Heralds 3-D Chip Breakthrough

Posted by kdawson on from the more-moore dept.

David Kesmodel from WSJ writes to let us know about an IBM breakthrough: a practical three-dimensional semiconductor chip that can be stacked on top of another electronic device in a vertical configuration. Chip makers have worked for years to develop ways to connect one type of chip to another vertically to reduce size and power use. The IBM technique of "through-silicon vias" offers a thousand-fold reduction in connector length and a hundred-fold increase in connector density. The new chips may appear in cellphones and other communication devices as soon as next year. PhysOrg has more details.

9 of 99 comments (clear)

  1. What?????? by Xinef+Jyinaer · · Score: 5, Funny

    The chips didn't exist as 3-D objects prior to this? Infact, wouldn't a chip that only exists in two dimensions be much more difficult to make?

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    Some days I just get bored and Troll post all the memes I can think of...
    1. Re:What?????? by pintpusher · · Score: 3, Funny

      And then we could invest that saved space to make more space!!!!@!1!11!1

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      man, I feel like mold.
    2. Re:What?????? by Tiles · · Score: 2, Funny

      Why stick with three dimensions? Let's just skip three, and go straight to five! And add a moisturizing strip!

  2. Re:I wonder how they will cool this? by UnknowingFool · · Score: 3, Funny

    Tubes! Everything else seems to run on tubes.

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    Well, there's spam egg sausage and spam, that's not got much spam in it.
  3. They told us not to ask where they got it. by illegalcortex · · Score: 4, Funny

    It was scary stuff, radically advanced. It was shattered... didn't work. But it gave us ideas. It took us in new directions... things we would never have thought of. All this work is based on it.

  4. New Operating System Required For 3d chips by crea5e · · Score: 5, Funny

    LEG-OS. 64 block architecture. Also themeable for star wars and lord of the ring fanboys.

  5. I've seen this before... by Yvan256 · · Score: 3, Funny

    To further increase R&D of this new 3D chip technology, IBM will be launching a new company called Cyberdyne Systems Corporation.

  6. Re:I wonder how they will cool this? by polar+red · · Score: 2, Funny

    In Rod We Trust!

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    Yes, I'm left. You have a problem with that?
  7. Re:More information by Anonymous Coward · · Score: 2, Funny

    This will fail miserably. It will be hell to repair these things when the middle component breaks.