IBM Heralds 3-D Chip Breakthrough

Posted by kdawson on Thursday April 12, 2007 @03:13AM from the more-moore dept.

David Kesmodel from WSJ writes to let us know about an IBM breakthrough: a practical three-dimensional semiconductor chip that can be stacked on top of another electronic device in a vertical configuration. Chip makers have worked for years to develop ways to connect one type of chip to another vertically to reduce size and power use. The IBM technique of "through-silicon vias" offers a thousand-fold reduction in connector length and a hundred-fold increase in connector density. The new chips may appear in cellphones and other communication devices as soon as next year. PhysOrg has more details.

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Re:They told us not to ask where they got it. by pla · 2007-04-12 03:42 · Score: 1, Troll

It was scary stuff, radically advanced

July 1947: A "weather balloon" crashes in Roswell, NM.

December 1947: Bell Labs' Bardeen, Brattain, and Shockley "invent" the transistor, using boron-doped silicon, which Bell Labs didn't have the equipment to produce at that time!

Spoooooooky. ;-)
Nice, but... by Yaa+101 · 2007-04-12 03:54 · Score: 0, Troll

If it got DRM then I say who cares?