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Breakthrough May Revolutionize Microchip Patterning
Stony Stevenson writes "US research engineers claim to have developed a low-cost technique that allows them to create ultra-small grooves on microchips as easily as 'making a sandwich'. The simple, low-cost technique results in the self-formation of periodic lines, or gratings, separated by as little as 60nm, or less than one ten-thousandth of a millimetre. From the article: 'The new 'fracture-induced structuring' process starts when a thin polymer film is painted onto a rigid plate, such as a silicon wafer. A second plate is then placed on top, creating a polymer 'sandwich' that is heated to ensure adhesion. Finally, the two plates are prised apart. As the film fractures, it automatically breaks into two complementary sets of nanoscale gratings, one on each plate. The distance between the lines, called the period, is four times the film thickness.'"
Generally I throw my sandwiches away when they get a film on them.
Must be a sufficiently advanced technology then...
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Here's my notes on silicon semiconductor manufacturing, but this 'polymer sandwhich' method is entirely new to me. From what I can recall, manufacturing tactics usually include chemical etching with masks to make marks into the wafer or sometimes with specialized lasers. From the summary of the article, it looks like this latest process lets us do periodic lines via adding mechanical energy so that we fracture the plates. Ironic, since we usually try to avoid fracturing our wafers. ;)