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Breakthrough May Revolutionize Microchip Patterning
Stony Stevenson writes "US research engineers claim to have developed a low-cost technique that allows them to create ultra-small grooves on microchips as easily as 'making a sandwich'. The simple, low-cost technique results in the self-formation of periodic lines, or gratings, separated by as little as 60nm, or less than one ten-thousandth of a millimetre. From the article: 'The new 'fracture-induced structuring' process starts when a thin polymer film is painted onto a rigid plate, such as a silicon wafer. A second plate is then placed on top, creating a polymer 'sandwich' that is heated to ensure adhesion. Finally, the two plates are prised apart. As the film fractures, it automatically breaks into two complementary sets of nanoscale gratings, one on each plate. The distance between the lines, called the period, is four times the film thickness.'"
Generally I throw my sandwiches away when they get a film on them.
If they got clever, they could make a conductive film and get tracks at one times the films thickness ;)
As it stands I will only be impressed if they get fractures down to at least 2 times thickness.
liqbase
But you need to remember, the 45nm number comes from the marketing department.
The chips are groovy. Very groovy.
Evil people are out to get you.
Must be a sufficiently advanced technology then...
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A low cost replacement for current lithographic techniques at 60nm could certainly have a market niche.
But from what I understand of the article, this technique only creates a pattern of parallel stripes, with the spacing controlled by the film thickness. Presumably the direction is cotrolled by which edge you pry apart from. I don't see how that is useful for layout out a chip though.
The selling point of this "new" technology is "low cost". The lithography at sub 100nm is getting extreme pricey.
There is a spark in every single flame bait point.
Here's my notes on silicon semiconductor manufacturing, but this 'polymer sandwhich' method is entirely new to me. From what I can recall, manufacturing tactics usually include chemical etching with masks to make marks into the wafer or sometimes with specialized lasers. From the summary of the article, it looks like this latest process lets us do periodic lines via adding mechanical energy so that we fracture the plates. Ironic, since we usually try to avoid fracturing our wafers. ;)
I always love when summaries on /. have useless unit conversions to somehow make them more tangible.
I think people here can handle 60nm.
So this method is interesting, but the resolution of these gratings is only 60nm. Other experimental groups have achieved a resolution as small as 30nm (http://willson.cm.utexas.edu/research/index.php). ..and Intel is already producing chips at 45 (http://hardware.slashdot.org/article.pl?sid=07/08 /20/1611202/)
chillax137
Additionally, there are so many announcements like this that you have to see it on the market to believe it.
What are you going to wait out, exactly? Are you an executive at a chip-producing firm with the power to decide to use this?
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I agree the cost is high (for the FABs) but more to the point, while this is an interesting new manufacturing method, its not likely to be such a big advance, (for the chip industry) as the title to this news implies. Also I think that around about 2011, they are talking about having production 32nm fabrication. So within about 4 years from now, 32nm is going to seem very small, compared with this relatively large 60nm groves in the chip.
Where this technology sounds potentially very useful, is in maybe applications like sensors. As its nano-scale patterns can be applied to large surface areas. That could potentially be very interesting.
There are 10 kinds of people in the world... those who understand binary and those who don't.
The actual scientific paper can be found here (subscription required). This is a very neat idea, similar to buckling-induced experiments where similar nano-patterns can be produced quickly and easily in polymeric materials. The micrographs in the paper show remarkably clean and consistent structures, with well-defined periodicity and cross-section. From a scientific point alone, it's quite remarkable to see how one can harness a usually random process (fracture) to generate well-defined nanostructures.
That having been said, this technique suffers from a few limitations. Firstly, it will be difficult to scale this down to arbitrarily small features: polymer film stability becomes increasingly difficult as the film thickness is decreased, so this technique is unlikely to scale cleanly below the 60 nm they've already demonstrated. Also, this technique generates a large-area pattern, but it doesn't appear possible to control the registry of this pattern. So, this could perhaps be used as the first step in a mult-step chip patterning, but if you can't align subsequent patterns, it becomes useless for generating complex multi-layered structures for chips. (I can imagine ways to overcome this, but it wouldn't be easy.)
As such, I really don't think this is going to "revolutionize microchip patterning" as the headline implies. I don't think this will ever be used to generate smaller and smaller chips: the current challenges in the industry for next-generation processes are beyond what this technique can do. (Besides which, it doesn't integrate particularly well into the current photo-lithography infrastructures).
However, as a lower-cost alternative for fabricating nanostructures in the micron to 100 nm size regime, I could see this being useful. It's an easy way to create a large-area array of remarkably consistent patterns. It could be used to create optical gratings, or as a template for assembly of proteins (for diagnostics, etc.), or templates for magnetic domains (in hard-drives, etc.) and many other fields.
Well 'pricey' is a relative term... if you're talking about the setup-cost for a factory that produces IC wafers, then yes you're talking enormous investments before the first wafers run of the production line with decent yields. But from an end-user point of view, you can buy a $50 CPU or memory module these days that may contain several hundred million transistors. Something equivalent being non-existent or 10 times more expensive a few years back...
I'm wondering more about practical applications, and how long they will take to hit the market. For regular structures, all sorts of semiconductor memory comes to mind. Cheap flash memory? Affordable solid state drives with capacities equal or bigger than magnetic disks? For such applications production errors may not matter much. If the process is cheap, add enough redundant memory cells, decent bad cell/sector management, and the end result could be very useful.
Anyway, looks very promising. We'll see what comes of it...
The linked article has a picture of a breadboard covered in neat rows of ancient DIP chips (probably ALUs or memory). Then talks about a cool new technique for getting a 60nm grid on next-gen CPUs.
Why do they bother wasting bandwidth with such a useless stock picture? "Well, this involves microchips... Those look like microchips, I guess, so let's stick it in the article".
how is it a breakthrough you say...
Lets see...
They've come up with a similar (faster/cheaper) means of making something. The entire point of the article is that this new method is far easier and faster then old methods. Not to mention the fact alone that it's utilizing mechanical force to etch a chip which is unheard of... besides this could be very practical. Think about it, most companies don't need an overpriced chip with 45nm spaced etchings... but being able to buy many cheaper chips with a 60nm gap would be a great.
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I don't remember what the commonly used nm figure refers to (channel size?), could be that the 60nm lines here are for something else.
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But I think you are insightful. I am actually totally agree with you. But as the UV getting deeper and deeper, how far the photoresist based technology we can go? At 32nm or 25nm, how much roughness is tolerable? Can we expect such roughness from photo resist? I think there is going to be a change.
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I have no arms, you insensitive clod!
Rob
I could think of a couple of things. a CCD for cameras or a 'rail' area for moving data around. Also if you could get it going in different directions you could 'build' up different structures such as gates and sinks. You could also 'fill' in areas that are not useful or 'short' across other areas with another layer. Dont be like Kahn and think 2d be like Kirk think 3d...
I don't think it is as important for FAB plants as much as it is bringing influence from the small consumer into hardware. If the cost comes down enough we can take old designs or open designs and actually be able to produce relatively small quantities of modified hardware for cheap.
This would go hand in hand with the concept of OSS cause as OSS enthusiast's are intrigued by this kind of thing products like that completely OSS graphics board which never really took off would be much more attainable. With an interface like PCI-Express if the community would be able to design an 'open-board' concept, with multiple open sockets on the board its self, you would be able use the daughter board as an OSS motherboard and control it by use of an open interface.
Picture a PCI-E board with one controller on board and a handful of open PGA sockets. A company or group develops a physics, encryption, sound, graphics, firewall chip that gets installed on the board and you could access each one for its resources via the PCI bus. Each chip would likely be more expensive then the closed proprietary brothers but the market is there. Lets say your business has a project that is naturally lopsided in terms of processing, you could fabricate a processor to even it out, or make a self sufficient board utilizing the PCI bridge for nothing more then access to memory and VCC.
This would really be an eye opener as OSS could effect more then just the software market but the hardware market as well. You could have a board with optical, RJ45, DVI, DVB-S2 all on the same board and each socket could potentially have access to each port directly or via on board controller (similar to a north bridge) condensing a sound controller or a network controllers logic onto a 60nm process would be night and day compared to what we have, this could potentially lead the way to the entire machine being designed using this "sandwich" process.
Personally I think development along the lines of the killerNic type of hardware would revolutionize computing. Imagine owning a machine with multiple optical outs that you could use for networking or to hookup to a TOS-link device, the card would have its own processor running customized microcode. Maybe as a temporary storage device similar to flash drives but internal running of a 16x slot would bring efficiency of any system up 100 fold. Eventually all these separate ideas would distill into an open command set that could be implemented into a CPU type of application. A CPU with instructions built-in from the best of encryption, graphics, sound, filtering hell even regex. We could even vote on which registers should be included in the final design.
So you know one person out here thinks this is cool, maybe more will come of this.
A loop, by its nature, continues. If that didn't make sense, start reading this sentence again.
The trouble with technological breakthroughs is that they mostly benefit countries which place zero emphasis on such development but 100% emphasis on the pirating and subsequent marketing of such technology.
I doubt CPUs will have much competition from this technology, but how about memory based on some kind of crossbar design? Make one sheet vertical one sheet horizontal bond together with some exotic ingredient and voilà -- a high density ROM material. HD movies on a postage stamp.
Letter To Iran
Everybody seems to be looking at this for electronic chip production. I don't see that being usable at all with this. This seems more geared to producing optical diffraction gratings, sensors or maybe even use in solar cells. I.E. Take a normal photovoltaic cell, then put a thin film on top and use this to create a tuned diffraction grating on the surface that improves the solar cell effeciency. Same for optical sensors. I could also see potential uses in biological sensors.
I have one question. If the Japanese Ministry of Agriculture is not in charge of Gundam, then who is?
I suspect that it would cost a bit more for Intel to produce 60nm gratings using their 45nm process than using this "low tech" approach.
thats good but what does it allow/do?
It's not a break-through it's a break-apart, duh
I wonder if you pulled a disc-shaped sandwich apart from the center real fast would you get concentric circles like a fresnel lens.. if so then by varying the film thikness you could vary the wavelength of focused energy?
No, it does not. Not at all. It comes from the litho engineers that chose 45 nm as the minimum feature size, a physical constant of the manufacturing process. And it was chosen because it is half of 90 nm. The marketing department would have literally nothing to do with such a selection.
Never mistake "can" for "should".
You honestly believe that the marketing department didn't come down to the engineering department to suggest this figure?
"Lads, AMD is making 90nm chips right now, so they must be working on 45nm chips! If we can't compete we'll all be out of jobs. Now, can you make 45nm chips? Of course you can't! Will you be able to by the time we have to release them? Excellent!"
(Marketing manager writes down 'action point: leverage 45nm technologies for potential market capitalization'. In the background the lead engineer's head quietly explodes.)
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Surely your toaster and coffee maker don't need 32nm? Wouldn't it be great to have all the parts that aren't CPUs down to 60nm without the costs associated with 60nm lithography?
Let's see, drive electronics, sound processors, Ethernet controllers (the ones that aren't on your southbridge), microcontrollers, any kind of embedded chip... There are lots of things that aren't 65 nm yet, or even at 90nm, and some chips aren't 130nm for that matter. Wouldn't it be great to get things that are currently larger down to CPU-ish feature sizes?
Hell, Intel's 82598 dual-port 10 gigabit Ethernet controller is 90nm. If they could make it 60nm on the cheap, that'd be great.
Just think of all the things these specialty chip designers (the ones with SSL accelerators, AES on-chip, vector processors, Forth chips, Java chips, etc) could do if they could get down to 60nm at or near FPGA prototyping prices. Hell, the Via C7 getting down from 90nm to 60nm would be great. Companies like Transmeta might bounce back into chip production. ARM9 is currently at 130 and XScale is 180. Getting those down to sizes that match Intel and AMD's current or even last-gen products at far less cost could give us really powerful handhelds.
Then again, it may not!
-- Boycott Shell
Scaffold to grow tissue?
There is a spark in every single flame bait point.