Toshiba To Test Sub-25nm NAND Flash
An anonymous reader writes "Toshiba plans to spend about $159.8 million this year to build a test production line for NAND flash memory chips of less than 25 nanometers. The company hopes to kick off mass production of the chip as early as 2012. The fabrication facility for this key NAND flash memory will be located at Yokkaichi, Mie Prefecture."
I thought microSD was small. I'm going to lose this stuff for sure!
Give me Classic Slashdot or give me death!
Not everyone (including me) understands what the benefit to consumers will be when less than 25nm production is possible. Does that mean 1TB flash memory cards for my camera? Same sizes as now but cheaper? What? Just an additional sentence giving a "once possible, this will mean blah blah blah blah blah". Simple as that. Of course, with an 'article' (actually just PC Mag parroting a Thoshiba presser...for pay I'd imagine) as crappy as the one linked to in the headline, I don't know that it really matters.
Over the last decade, I keep seeing these manufacturing processes grow ever smaller. I still remember when I bought my Athlon FX-55. 130nm process. Aw hell yeah. It's currently living the remainder of its life in one of my guest boxes. God that chip was such a waste of money, but I digress.
For those in the know, this ever shrinking manufacturing process tech: when will it stop? Where will it stop? 10nm? Sub-1nm?
Boot Windows, Linux, and ESX over the network for free.
Well, chips are 2D, so you also get to square that benefit.
32x32 = 1024 nm^2
25x25 = 625 nm^2
That's nearly 18 months of Moore's Law right there.
Is there a proposed ultimate limit for lithography before one has to jump to molecular electronics? 25nm is well below what anyone though practical a decade ago (since it's so many times smaller than easily produced optical wavelengths). Now it's closing in on the limit of easily produced x-rays.
while the resolution of the smallest resolvable element is shrinking, is the utilization of area increasing proportionally. That is are we densely filling the area with 25nm structures or is that simply the finest linear element and these are well separated?
A 1cm chip would have 1E15 resolvable points at 0.025 micron resolution. And then there is the vertical resolution to multiply that. I should think it would become prohibitively difficult to design something with so many possibilities.
Some drink at the fountain of knowledge. Others just gargle.
Personally, while I find it interesting, I'd like to know just how much extra data storage this would enable?
32nm to 25 nm would, what, increase the theoretical max density of flash by 64%? IE instead of getting a 16GB chip you'd get a 24GB one.
At the same price once you have all the details worked out, of course.
45nm to 25 nm by my figuring would allow 3.24 times as much storage in a given size of chip.
I don't read AC A human right
No, it has little to do with the NAND digital logic gate -- the other person who responded to you is totally wrong. NAND flash is a circuit topology where the flash transistors (bits) are arranged in long series chains, like this:
http://commons.wikimedia.org/wiki/File:Nand_flash_structure.svg
which is similar to the pull-down side of a NAND gate. NAND flash is very high-density but is read in blocks (you turn on the whole chain and then check one bit at a time). The other type of flash is NOR flash, which uses transistors in parallel:
http://commons.wikimedia.org/wiki/File:NOR_flash_layout.svg
This means you can read any bit individually without having to turn the others on. NOR flash is commonly used for program memory in microcontrollers, where you need fast random access to any bit. NAND flash is used when you need high capacity, as in memory cards or SSDs.
Visit the
The article is frustratingly light on details. There's nothing about what type of flash transistor they're using (there are several variants on the basic stacked-gate NMOS design as well as more wild types). They don't say whether they're actually shrinking the bits (which you don't have to do) or just the support circuitry. All it says is that Toshiba is making NAND flash in a new process node, probably 22nm.
My day job is working with embedded NOR flash. I'm not really a process or solid state physics guy, but I think I know enough to comment, unlike a lot of the people running their mouths. (Seriously, folks, if you don't know what you're talking about, *shut up*. Misinforming people with wild guesses is not helpful, no matter how much it strokes your ego.)
First off, the flash transistor itself is not 22nm long. It's probably at least ten times longer, if not more (obviously Toshiba's not giving exact numbers). When you go to a new process node you don't necessarily shrink every feature by 50%. The limiting factor in flash size isn't lithography (manufacturing), it's leakage.
Flash works by storing electrons on an isolated (floating) material sandwiched inside an NMOS transistor. If extra electrons are present, the transistor is forced off (0). If they aren't, the transistor can turn on (1). The problem is that over time the electrons leak out of the floating gate, eventually causing bits to flip. If you shrink the circuit enough you hit a point where you can't keep electrons in the gate for a reasonable amount of time. At that point, we'll need a new memory technology -- maybe FRAM, maybe something else. Whatever it is, I'm sure it's been researched already -- a lot of the major research papers for flash memory are 25+ years old.
Also, I said this elsewhere, but NAND flash is called NAND because the flash transistors (bits) are in series, like the NMOS transistors in a NAND gate. It isn't made out of logic gates or anything like that. Flash memory is analog, like DRAM -- you need special analog circuitry to read it and output a digital signal.
Visit the