TSMC and Global Foundries Plan Risky Process Jump As Intel Unveils 22nm SoC
MrSeb writes with news on the happenings with next generation fabrication processes. From the article: "... Intel's 22nm SoC unveil is important for a host of reasons. As process nodes shrink and more components move on-die, the characteristics of each new node have become particularly important. 22nm isn't a new node for Intel; it debuted the technology last year with Ivy Bridge, but SoCs are more complex than CPU designs and create their own set of challenges. Like its 22nm Ivy Bridge CPUs, the upcoming 22nm SoCs rely on Intel's Tri-Gate implementation of FinFET technology. According to Intel engineer Mark Bohr, the 3D transistor structure is the principle reason why the company's 22nm technology is as strong as it is. Earlier this year, we brought you news that Nvidia was deeply concerned about manufacturing economics and the relative strength of TSMC's sub-28nm planar roadmap. Morris Chang, TSMC's CEO, has since admitted that such concerns are valid, given that performance and power are only expected to increase by 20-25% as compared to 28nm. The challenge for both TSMC and GlobalFoundries is going to be how to match the performance of Intel's 22nm technology with their own 28nm products. 20nm looks like it won't be able to do so, which is why both companies are emphasizing their plans to move to 16nm/14nm ahead of schedule. There's some variation on which node comes next; both GlobalFoundries and Intel are talking up 14nm; TSMC is implying a quick jump to 16nm. Will it work? Unknown. TSMC and GlobalFoundries both have excellent engineers, but FinFET is a difficult technology to deploy. Ramping it up more quickly than expected while simultaneously bringing up a new process may be more difficult than either company anticipates."
I couldn't possibly comment because they'd fire me.
But it is rather awesome.
I should use this sig to advertise my book ISBN-13 : 978-1501515132.
Will it work? Unknown.
First?
In case anyone else was wondering, SoC stands for System on a Chip
"I don't need a compass to tell me which way the wind shines." - Mr. Furious, Mystery Men
who will redefine photolithography as "3D printing", so now they think that the toy printer they have at home will print out ICs??
If you read the announcements, you will weasel words like "14nm class". The bottom line is: these are not 14nm processes. It would be more accurate to call them 20nm with FinFets. Global Foundries process does reduce some parameters from their 20nm planer but there is nothing 14nm about it.
Where is the damn article?? I don't see any link to the actual article. Is this the new slashdot?
This is obviously unfair of Intel to be out innovating the rest of the market like this. We should curb it somehow
the Android UI without any lag?
They have more of a marketing issue because they are up against someone with better technology. Intel tends to be around a node ahead of everyone else because they invest massive amounts in to R&D, billions a year.
So it isn't like the telcos trying to market "moar Gzzzz!!!11" to consumers, it is that they are trying to figure out a way to catch Intel.
I couldn't possibly comment because they'd fire me.
But it is rather awesome.
Is that sarcasm? You can't comment means you won't add criticism or praise? I remember the HUGE cock-up that TSMC caused AMD when they went to the 5000 series GPUs. They had QC issues for all the rev.0 chips, and none of them would overclock. The 3 that I bought (sequentially) all needed super-cooling OR underclocking to perform consistently.
Maybe it's just me, but I'm extremely sceptical that TSMC will be able to pull this off properly.
- Nec Impar Pluribus, or so I'm told.
It took Intel 10 years to take FinFET from concept to production, yet TMSC are claiming they can do it in only 2 years. Is that even feasible? Even if it is, doesn't Intel have patents on the tech?
It's one of those things you should learn while graduating from teenage angst blogging to commercial website.