The Truth About Last Year's Xbox 360 Recall
chrplace forwards an article in which Gartner's Brian Lewis offers his perspective on what led to last year's Xbox 360 recall. Lewis says it happened because Microsoft wanted to avoid an ASIC vendor. "Microsoft designed the graphic chip on its own, cut a traditional ASIC vendor out of the process, and went straight to Taiwan Semiconductor Manufacturing Co. Ltd., he explained. But in the end, by going cheap — hoping to save tens of millions of dollars in ASIC design costs, Microsoft ended up paying more than $1 billion for its Xbox 360 recall. To fix the problem, Microsoft went back to an unnamed ASIC vendor based in the United States and redesigned the chip, Lewis added. (Based on a previous report, the ASIC vendor is most likely the former ATI Technologies, now part of AMD.)"
Microsoft designed their own graphic chip and it crashed? I'm shocked... I tell you shocked!
it seems that every time some company tries to cut corners, it only ends up biting them in the a. my company does the same thing, and the kludgy results are nothing short of spectacular.
...hoping to save tens of millions of dollars in ASIC design costs, Microsoft ended up paying more than $1 billion for its Xbox 360 recall. I'm glad that I am not wealthy enough to be able to afford to be that incompetent.Shaking fists at ATI, yelling: "I'll design my own chip! With blackjack! And hookers! ... In fact ..."
I know /. does like to stick the boot into MSFT whenever possible, but in the last 2 hours there has been 3 front page stories, real stories, about the nasty behaviour of MSFT coming back to bite them in their fugly corporate ass.
Or is it all just a hoax?
Hope not.
"Be light, stinging, insolent and melancholy"
I had the miss-pleasure of working on a graphics ASIC with MicroSquish back around the late 90's on a project called Talisman.
Never, and I say NEVER let a bunch of software engineers try to design a hardware chip. This was the biggest CF I'd seen in all my years (30+) as a chip designer. That they did it again, and with such stupidity again is no friggin surprise.
It is not that software engineers should not be involved, of course they should but when they drive the architecture in complete void of any practical chip design constraints..... and continually refuse to listen to any reason from the hardware designers..... well as they say, garbage in, garbage out.
"TV, a medium as it is neither rare nor well done." Ernie Kovacs
ATI and Microsoft developed this chip together over a period of two years. The XBOX 360 GPU has been known since conception as an ATI GPU.
Furthermore, the recall was for overheating in general which -- though unquestionably affected by the GPU -- is a more comprehensive system design failure, not just a single component. (Look at the stability success they have had simply by reducing the size of the CPU.)
I'm looking forward to "Jasper", the code name for the next XBOX 360 mother board that will include a 65 nanometer graphics chip, smaller memory chips and HOPEFULLY a price reduction.
Microsoft didn't design the GPU, ATI did, and everyone knows ATI have always been fabless. TSMC are the manufacturer of the larger of the two dice that make up the Xenos/C1 design, and while that die has been revised since for a process node change, it doesn't even appear if that new revision has been used yet (despite it being finished by ATI a long time ago).
Lewis seems to be just plain wrong, which is kind of upsetting for "chief researcher" at a firm like Gartner, especially when the correct information is freely available.
While the cooling solution for the GPU is the likely cause of most of the failures, that's not necessarily the GPU's fault, or ATI's, especially for a fault so widespread.
- 'sup, G?
Consider: would you rather spend $10M on a platform that may flop and not make a dime
OR
Spend $1B on a platform that has made multi-billions.
Actually Goatse Troll is on topic for once! Red Ring of Death! Get it?
Make SELinux enforcing again!
The article is COMPLETE, UTTER bullshit.
Years before the xbox360 has been released ATI was already announced as the system parter for the GPU. No "secret unnamed ASIC vendor" anywhere.
The recall, again, was thermal problems.
Do you really think a completely different GPU by a completely different company could have been designed in a year _and_ totally compatible with the original one?
HI O WISE PRINCE. WHT TOOK U SO DAM LONG?
Funny I don't recall a recall only a 3 year warranty extension covering the RoD.
/. form allowing an article to spread false truths...
True to
News for Nerds.... Stuff that may or may not be true...
Look at Bunnie Huang's analysis.
The problem wasn't any chip at all. It wasn't even heat. The problem was the chips were not soldered to the board.
http://www.bunniestudios.com/blog/?p=223
Doesn't matter who designed or made the chips. If they aren't soldered down, they won't work. And that's what the problem was. That's why X-clamps (mostly) work.
Heat is semi-tangential. If the chip is soldered down, heat won't pop it off and if it isn't soldered, any kind of movement will break it loose, even when cold. This is how MS could ship you replacement units that were RRoD out of the box. They were fine before they were shipped and were broken loose during shipping.
Most of the problem appears to be solderability problems, not a problem with chip design or manufacturing.
http://lkml.org/lkml/2005/8/20/95
The General Hardware Failure error could be caused by cold soldering. The added mass of the CSP chips (including the GPU and CPU) resists heat flow that allows proper soldering of the lead-free solders underneath the motherboard.
Another General Hardware Failure is shown by the ring of light flashing one red light, and an error code E 74. This too renders the Xbox unusable.
The Nyko Intercooler has also been reported to have caused a general hardware failure in a number of consoles, as well as scorching of the power AC input.
An update patch released on November 1, 2006 was reported to "brick" consoles, rendering them useless.
In June 2008, the EE Times reports the problems may have started in a graphic chip. The last one is what this article is (mostly) about...
Also, for those who don't know who Bunny is, he is critical to the hacking of the original XBox... he was the one who first discovered that (an old version of) the Secret ROM was written to the boot flash, he was the first to sniff hypertransport to read the Secret ROM, and if I remember correctly, he was the one to discover where the Secret ROM was (Though after the secret rom in boot flash was discovered to be non-functional, which is another thing Bunny was responsible for, it was pretty obvious).
You missed Bunnie's point completely. When the motherboard rolls of the assembly line, they test the motherboards to ensure that the chips are properly soldered. The manufacture has ovens that monitor the temperature of the cpu/motherboard while the bga chip is melting. You have to make sure that the solder melts all the way, yet you don't want to damage the cpu. After that, they inspect the motherboard with x-rays to ensure that the soldered components are properly aligned and the soldered melted.
Bunnie's point is that the bga joints cracked over time. Different materials expand at different rates when they heat up, the coefficient of thermal expansion. The fiberglass motherboard expanded at different rates than the silicon/epoxy cpu and gpu. Since the Xbox overheated, and was poorly engineered (so Microsoft could beat the PS3 to the market), the motherboard warmed up, and expanded at a different rate than the cpu soldered to it. As a result, the solder joints were under stress, and thus cracked. You can see this in the red die that leaked between the solder pads when Bunnie pried of the cpu.
1) ATI is NOT in the United States. (Yes I know AMD/ATI blah blah) The main point to this is the fab plant and who owns it?
2) Microsoft did design the GPU in concept, but worked with some bright people from ATI and other GPU gurus for the specifics. People can make fun of MS design a GPU, but this isn't their first time around the block, and also gave them the intimate change of pairing GPU hardware and OS technologies.
Look at the PS3, in addition the 'cell' processor that 'didn't need' a GPU to the shipping PS3 with the 'cell' and full Geforce 7800 in it, and yet between the two technologies it still can't hold framerates or do anti-aliasing like the Microsoft designed XBox 360. (See recent games like GTAIV where it runs at lower resolutions on the PS3.) (And I won't even go into how slow Blu-Ray makes the device for a game player being significantly slower than DVD and why MS refused to put HD-DVD or Blu-ray in the console as the primary drive. Gamers hate load times and crap framerates.)
3) The 3 Rings of Death is about the Thermal sensor plate and flexing due to high heat. 99.9% of the time. (Also the 3 Rings does not always mean death, most units continue to work once they cool down, etc.) (Google It)
4) As for MS Saving Money for using a non US fab plant and then having to move back to one, sure this is possible, but technically there would be little to no difference UNLESS Microsoft also changed the specification of the chip between the move process. I don't care if the fab plat has Donkeys and a Mule pulling carts out front, the silicon is created according to specification, and you don't get much more exact than this level of specificatinos.
The real story here would more likely be the plastic/plate fab company that was creating the inner X plate/case holder that was warping and causing the 3 Ring problem, a) it was the real problem not the chip and b) would more likely fail specs easier than silicon.