Intel Designs Faster, 3D Transistor
lee1 writes "Intel has found a way to keep on the Moore's Law track by making smaller, faster and lower-power computer chips by building 3D transistors. They are already manufacturing microprocessors using this new design, called a FINFET (for fin field-effect transistor), which incorporates a small pillar, or fin, of silicon that sticks up above the surface of the chip. Intel said that it expected to be able to make chips that run as much as 37 percent faster in low-voltage applications and use as much as 50 percent less power. Products based on the new technology may appear some time later this year."
It needs to be about 20% cooler.
fins... so, frickin lasers nearby?
Is it possible to use that fin for cooling as well?
-- Cheers!
You'll still have to cough up an extra $200 for the privilege of using all the transistors in your Intel hardware though. Or maybe this will bring an end to them segregating things like HW virtualisation based on how deep the users' pockets are.
lots of blather about the 'next dimmension' of computer chips... 3d Inside or some such. Still, nice to see that moore's law still holds... at least for now...
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to heat dissipation?
they are not 3D, they are just thinner and deeper than the standard, we still dont see transistors on top of each other. the latice is still pretty much 2D. i ussually dont complain too much, but slash dot summaries are batting way below the mendoza line.
Millions of free accelerometers! (For high-G's anyway.)
For some reason when I read the summary (no, not TFA) I envisioned the "Get Perpendicular" video and now I have that damned song stuck in my head. Gee, thanks a lot, Slashdot.
D'oh - they should have thought of that much earlier! Get perpendicular - soon also available for SSDs. http://www.youtube.com/watch?v=-xPvD0Z9kz8
so.... the glasses go between he socket and the processor? .....sorry
if no glasses it performs like a regular 2D processor?
kudos
"a small pillar, or fin, of silicon that sticks up above the surface of the chip"
Like a Mesa transistor? http://en.wikipedia.org/wiki/Mesa_transistor#Mesa_transistor
Transistors USED to be fabricated this way, before the founders of Intel developed the Planar process.
What is indeed news is that intel is fielding them first.
Well, while it is nice a slashdot article has finally been written about FinFET's - there may already have been one, I just can't remember - these devices have been widely guessed to be a part of the 22 nm technology node for quite some time. (see: http://www.itrs.net/ and http://en.wikipedia.org/wiki/22_nanometer ).
They offer more effectivity for your gates as the field is not coming from one, but from 3 sides to the channel. That means a bit more scalability, but not much more. There is only a bit of improvement possible for the future in putting the gate below the channel as well (as hard as that may be, i, personally, don't think it would be worthwhile), so this won't save moore's law in the end.
It may not surprise you that they actually haven't been invented by intel, and are not new.
The term has been coined more than 10 years ago ( http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=823848 ) (find one of the free pdf's of this classic paper for yourself)
What is more interesting is how far down these transistors will scale in the extreme ultraviolet processes that are emerging right now.
What other trending marketing buzzwords can we apply to unrelated technology to get attention? Social Transistors? Transistors 2.0? Cloud Transistors? Tablet Transistors? iTransistor. What would truly be remarkable would be to develop a 2-dimensional transistor. Infinite layers of them with no height added to the die - and it'd still be slim enough to fit in a tablet!
What's next? A Twisted Transistor?
Haven't transistors always been 3D? You may draw them 2D in layout, but it's still a gate sitting on top of a channel with stacks of metal... it has L x W x H. I think that's called 3D. Silly Intel marketing.
Actually integrated transistors have been "planar" for the most part (although there have been "vfets" and other types of 3d channels in the past)...
In planar transistors, the field that chokes off the source/drain path has been mediated by a gate which is just on top of the channel on one plane. Imagine an iron on of a ironing board heating it up the board when you turn it on. Although the ironing board and the iron are both 3-dimensional objects, the interface in a "plane" and the heat diffuses across this plane. In this analogy with a planar transistor, the channel is dug into in the ironing board and the iron is the gate.
In finFET, the gate surrounds the channel on 3 side. Imagine now a tube on an ironing board and the iron has a notch cut in it so the iron surrounds the tube on three side. When you turn on the iron, heat diffuses across all around the notch instead of interfacing on 1 plane. This is "3D" or finFET instead of planar. In this analogy with a finFET transistor, the channel is the tube on the ironing board and the iron with a notch is the gate.
As you might imagine, the finFET architecture should have a better capability to turn on and off the channel since there is field is wrapping around the channel instead of just being applied to one side (okay that's simplification, but you get the idea).
Intel took, this finFET idea and added another twist with a "3", called tri-gate (or tri-channel depending on your point of view). This congolomeration of two independent ideas that both revolve around the number 3 is the kind of thing that drives marketing people to be silly ;^)
And for those that don't understand w/o a car analogy, imagine the difference in traction you get with bald tires on ice (planar where tire is the gate and ice is the channel), vs snow tires on dirt (finFET where the tire is the gate and dirt is the channel)...
3D? Aren't all transistors 3d? Along with every other physical item?
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Perhaps a better car analogy would be a planar transistor is a two-cylinder single-port injector engine and the intel 3d-tri-gate is a six-cylinder multiport injector engine...
Although this provides a superior transistor, there is a drawback from the IC designer's standpoint, if the illustrations are accurate. The designer of an IC with planar FETs can control both the width and the length of the active region. With these FinFETs, only the length is under the designer's control. Width is fixed (it's the vertical dimension in the illustrations). The only way to get stronger drive is to parallel transistors, whereas in planar design the transistor is simply made wider.
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It now makes much more sense that Apple is having Intel manufacture the next generation IOS chips. Based on information from Ars, the finFET shines at lower voltages. So Apple is going to be using Intel not just because they can manufacture smaller than everyone else, but also because the resulting chips will be faster or take less power than anyone else.
Faster *and* lower-powered, from *Intel* ?
Truly, the end is nigh.
What a depressingly stupid machine.
isn't this just a mulitgate finFet. That structure has been around for a long time.
don't cut it off www.mgmbill.org
Newsflash: AMD designs even faster, 4-D Transistor!
The technology for wafer-scale, multi-layer stacking already exists. The interesting thing is that he's also discovered that most of the heat and power requirements for chips are for external drivers, so you have all these border drivers on the CPU and Northbridge generating heat, and all the border drivers on the RAM generating heat. Stack them together, and you get rid of both, not to mention reducing the circuit path to microns. How would you like to see memory densities go up eightfold, while power consumption is cut by 90%? You'd think companies would be jumping all over that.
I have done work for the patent holder, and he's been unable to get any American companies interested until he commercializes it and makes it a big success, so they can grab his coat-tails. That includes Intel. http://www.tezzaron.com
Are there articles from nine, four, three, two, and one years ago predicting this breakthrough? To someone not in the business, this seems to have come out of the blue--already in production by the time the news breaks. How long have they been working on this?
Their they're doing there hair.
Answering myself: The idea started in 2002.
Their they're doing there hair.
Intel's 3D Transistors One Step Closer to Reality Posted by ScuttleMonkey on 15:15 Monday 12 June 2006 from the closing-your-leaks dept. http://slashdot.org/story/06/06/12/224207/Intels-3D-Transistors-One-Step-Closer-to-Reality
Their they're doing there hair.
Do you need special glasses to see them?