TSMC and Global Foundries Plan Risky Process Jump As Intel Unveils 22nm SoC
MrSeb writes with news on the happenings with next generation fabrication processes. From the article: "... Intel's 22nm SoC unveil is important for a host of reasons. As process nodes shrink and more components move on-die, the characteristics of each new node have become particularly important. 22nm isn't a new node for Intel; it debuted the technology last year with Ivy Bridge, but SoCs are more complex than CPU designs and create their own set of challenges. Like its 22nm Ivy Bridge CPUs, the upcoming 22nm SoCs rely on Intel's Tri-Gate implementation of FinFET technology. According to Intel engineer Mark Bohr, the 3D transistor structure is the principle reason why the company's 22nm technology is as strong as it is. Earlier this year, we brought you news that Nvidia was deeply concerned about manufacturing economics and the relative strength of TSMC's sub-28nm planar roadmap. Morris Chang, TSMC's CEO, has since admitted that such concerns are valid, given that performance and power are only expected to increase by 20-25% as compared to 28nm. The challenge for both TSMC and GlobalFoundries is going to be how to match the performance of Intel's 22nm technology with their own 28nm products. 20nm looks like it won't be able to do so, which is why both companies are emphasizing their plans to move to 16nm/14nm ahead of schedule. There's some variation on which node comes next; both GlobalFoundries and Intel are talking up 14nm; TSMC is implying a quick jump to 16nm. Will it work? Unknown. TSMC and GlobalFoundries both have excellent engineers, but FinFET is a difficult technology to deploy. Ramping it up more quickly than expected while simultaneously bringing up a new process may be more difficult than either company anticipates."
In case anyone else was wondering, SoC stands for System on a Chip
"I don't need a compass to tell me which way the wind shines." - Mr. Furious, Mystery Men
who will redefine photolithography as "3D printing", so now they think that the toy printer they have at home will print out ICs??
If you read the announcements, you will weasel words like "14nm class". The bottom line is: these are not 14nm processes. It would be more accurate to call them 20nm with FinFets. Global Foundries process does reduce some parameters from their 20nm planer but there is nothing 14nm about it.
BobaFET technology is going to totally own FinFET!
You heard it here first!
Mod me down, my New Earth Global Warmingist friends!
Where is the damn article?? I don't see any link to the actual article. Is this the new slashdot?
One one? There were multiple projects from multiple companies mentioned in the article.
I should use this sig to advertise my book ISBN-13 : 978-1501515132.
This is obviously unfair of Intel to be out innovating the rest of the market like this. We should curb it somehow
They have more of a marketing issue because they are up against someone with better technology. Intel tends to be around a node ahead of everyone else because they invest massive amounts in to R&D, billions a year.
So it isn't like the telcos trying to market "moar Gzzzz!!!11" to consumers, it is that they are trying to figure out a way to catch Intel.
I'm a bit scared of all this die shrinkage.
We have lots of perfectly working gear around here older than most of our offspring...
As transistor count goes up and feature size down can we expect more of our gear to start to go haywire over a shorter length of time or is there something baked into process steps to counteract or actually improve reliability?
Although you hail from the Willamette Valley in Oregon. There are limited silicon manufacturing employers in the region.
Of the three companies mentioned in posting TSMC, GloFlo, and Intel, perhaps we should see who is that area (as if we didn't know already)
You are an immigrant from the UK. You were recently started a job (Monday, May14th according to your journal, you did not post anonymously).
Shall I go on?
Apparently some moderators don't get any connection between Taiwan and Boba tea, Taiwan and TSMC, thrown in with an oblique starwars reference...
I thought that was worth a least a little bit of funny, but I don't have any mod-points.
Posting Anon, because the orginal poster doesn't seem to invite much karma...
I couldn't possibly comment because they'd fire me.
But it is rather awesome.
Is that sarcasm? You can't comment means you won't add criticism or praise? I remember the HUGE cock-up that TSMC caused AMD when they went to the 5000 series GPUs. They had QC issues for all the rev.0 chips, and none of them would overclock. The 3 that I bought (sequentially) all needed super-cooling OR underclocking to perform consistently.
Maybe it's just me, but I'm extremely sceptical that TSMC will be able to pull this off properly.
- Nec Impar Pluribus, or so I'm told.
It took Intel 10 years to take FinFET from concept to production, yet TMSC are claiming they can do it in only 2 years. Is that even feasible? Even if it is, doesn't Intel have patents on the tech?
Mostly it's that OP is an unmitigated ass.
So which one were you involved in? Or does your company consider it a trade secret that actual people are working on an announced R&D effort, and so you can't even confirm that you were working on anything? Hah.
Fortunately your concerns don't have any bearing on what the people actually developing these technologies think.
I'm a bit scared of all this die shrinkage.
We have lots of perfectly working gear around here older than most of our offspring...
As transistor count goes up and feature size down can we expect more of our gear to start to go haywire over a shorter length of time or is there something baked into process steps to counteract or actually improve reliability?
I'm not sure why this was modded down. Flash in particular has problems with smaller die sizes, and while lower longevity has certain economic benefits, environmentally it's a dead end.
The other thing is the 11-year solar cycle... if we develop some ultra-high density technology during the low ebb, we may find that half our electronics get frazzled during the solar maximum.
I'm a bit scared of all this die shrinkage.
I'm not sure why this was modded down.
Political correctness. Think about it for a second, you'll get it.
#fuckbeta #iamslashdot #dicemustdie
22nm die: I was in the pool! I was in the pool!
Get free satoshi (Bitcoin) and Dogecoins
It's one of those things you should learn while graduating from teenage angst blogging to commercial website.
Clearly I made the mistake of posting my throwaway comment that landed as the first post, so people responded to it.
So I will add more detail:
I don't develop process technology, but I get to design logic circuits on this technology and it is indeed rather awesome.
After 20 years of gradual and steady feature size reduction, the switch to 22nm and beyond appears feels like a step in improvement way beyond the normal gradual improvement. In that sense it is rather awesome, because things that were previously too expensive to contemplate now start to look cheap and easy.
I should use this sig to advertise my book ISBN-13 : 978-1501515132.
That was 2007. I've been on the same gig for a while now.
My job isn't a secret. It's quite public facing in some ways. But some things are not my secrets to give away, even though they are very nice things technologically speaking.
I should use this sig to advertise my book ISBN-13 : 978-1501515132.
I thought everyone who cared knew what I did. Google RdRand and RdSeed. That's my thing.
I should use this sig to advertise my book ISBN-13 : 978-1501515132.
More cosmic rays at the terrestrial surface during min than max.
Political correctness. Think about it for a second, you'll get it.
Having pored over it for quite some time, I can only assume it's some peculiarity of US English which I will need help to see.
"The other thing is the 11-year solar cycle... if we develop some ultra-high density technology during the low ebb, we may find that half our electronics get frazzled during the solar maximum."
Sounds like a story for a new bond movie or something.