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Microsoft has announced a form of DirectX 12 that will support Windows 7. "Now before you get too excited, this is currently only enabled for World of Warcraft; and indeed it's not slated to be a general-purpose solution like DX12 on Win10," reports AnandTech. "Instead, Microsoft has stated that they are working with a few other developers to bring their DX12 games/backends to Windows 7 as well. As a consumer it's great to see them supporting their product ten years after it launched, but with the entire OS being put out to pasture in nine months, it seems like an odd time to be dedicating resources to bringing it new features." From the report: For some background, Microsoft's latest DirectX API was created to remove some of the CPU bottlenecks for gaming by allowing for developers to use low-level programming conventions to shift some of the pressure points away from the CPU. This was a response to single-threaded CPU performance plateauing, making complex graphical workloads increasingly CPU-bounded. There's many advantages to using this API over traditional DX11, especially for threading and draw calls. But, Microsoft made the decision long ago to only support DirectX 12 on Windows 10, with its WDDM 2.0 driver stack.

Today's announcement is a pretty big surprise on a number of levels. If Microsoft had wanted to back-port DX12 to Windows 7, you would have thought they'd have done it before Windows 7 entered its long-term servicing state. As it is, even free security patches for Windows 7 are set to end on January 14, 2020, which is well under a year away, and the company is actively trying to migrate users to Windows 10 to avoid having a huge swath of machines sitting in an unpatched state. In fact, they are about to add a pop-up notification to Windows 7 to let users know that they are running out of support very soon. So adding a big feature like DX12 now not only risks undermining their own efforts to migrate people away from Windows 7, but also adding a new feature well after Windows 7 entered long-term support. It's just bizarre.

Ian Cutress, reporting for AnandTech: AnandTech has seen documents and supporting information from multiple sources that show that Intel is planning to release a new high-end desktop processor, the Core i9-9990XE. These documents show that the processors will not be sold at retail; rather they will only be sold to system integrators, and then only through a closed online auction. This new processor will be the highest numbered processor in Intel's high-end desktop line. The current top processor is the i9-9980XE, an 18 core part with a base frequency of 3.5 GHz and a turbo frequency of 4.0 GHz. The i9-9990XE, on the other hand, is not simply the 9980XE with an increase in frequency. The Core i9-9990XE will be a 14 core processor, but with a base frequency of 4.0 GHz and a turbo frequency of 5.0 GHz. This makes it a super-binned 9940X.

Ian Cutress, reporting for AnandTech: AnandTech has seen documents and supporting information from multiple sources that show that Intel is planning to release a new high-end desktop processor, the Core i9-9990XE. These documents show that the processors will not be sold at retail; rather they will only be sold to system integrators, and then only through a closed online auction. This new processor will be the highest numbered processor in Intel's high-end desktop line. The current top processor is the i9-9980XE, an 18 core part with a base frequency of 3.5 GHz and a turbo frequency of 4.0 GHz. The i9-9990XE, on the other hand, is not simply the 9980XE with an increase in frequency. The Core i9-9990XE will be a 14 core processor, but with a base frequency of 4.0 GHz and a turbo frequency of 5.0 GHz. This makes it a super-binned 9940X.

An anonymous reader shares a report: AMD's early CES 2019 announcements brought us some updates on its laptop processors, which include a targeted attempt to capture some of the growing cheap Chromebook market, slightly faster mobile Ryzens and a promise to keep everyone's AMD laptop drivers up to date with the latest zero-day game-release optimizations. Sadly, the news didn't include the much-anticipated, high-performance 7-nanometer Navi GPUs or the rumored Ryzen 3000-series desktop CPUs -- hopefully, the company's just holding back that info for its CEO's keynote on Wednesday. For the first time, AMD has gained a little bit of traction in Chromebooks with some partner announcements at CES such as the HP Chromebook 14 AMD and the Acer Chromebook 315. The announcements are in conjunction with the new A4-9120C and its sibling, the A6-9220C, which have slower CPU and GPU clock speeds than the 15-watt full-fat versions. That allows AMD to match the 6-watt target power draw of Intel's competing Celeron and Pentium models. AMD claims somewhat better performance on both Chrome OS and Android apps, which is possible given that their clock speeds are still faster despite the drop. Further reading: AMD at CES 2019: Ryzen Mobile 3000-Series Launched, 2nd Gen Mobile at 15W and 35W, and Chromebooks.

Intel on Wednesday surprised a number of people when it shared not one roadmap on CPUs, but two. AnandTech: For the high performance Core architecture, Intel lists three new codenames over the next three years. To be very clear here, these are the codenames for the individual core microarchitecture, not the chip, which is an important departure from how Intel has previously done things. Sunny Cove, built on 10nm, will come to market in 2019 and offer increased single-threaded performance, new instructions, and 'improved scalability'.

Willow Cove looks like it will be a 2020 core design, most likely also on 10nm. Intel lists the highlights here as a cache redesign (which might mean L1/L2 adjustments), new transistor optimizations (manufacturing based), and additional security features, likely referring to further enhancements from new classes of side-channel attacks. Golden Cove rounds out the trio, and is firmly in that 2021 segment in the graph. Process node here is a question mark, but we're likely to see it on 10nm and or 7nm. Golden Cove is where Intel adds another slice of the serious pie onto its plate, with an increase in single threaded performance, a focus on AI performance, and potential networking and AI additions to the core design. Security features also look like they get a boost.

The lower-powered Atom microarchitecture roadmap is on a slower cadence than the Core microarchitecture, which is not surprising given its history. The upcoming microarchitecture for 2019 is called Tremont, which focuses on single threaded performance increases, battery life increases, and network server performance. Based on some of the designs later in this article, we think that this will be a 10nm design. Following Tremont will be Gracemont, which Intel lists as a 2021 product. Beyond this will be a future 'mont' core (and not month as listed in the image).

From a report: Originally planned to enter mass production in the second half of 2016, Intel's 10 nm process technology is still barely used by the company today. Currently the process is used to produce just a handful of CPUs, ahead of an expected ramp to high-volume manufacturing (HVM) only later in 2019. Without a doubt, Intel suffered delays on its 10 nm process by several years, significantly impacting the company's product lineup and its business. Now, as it turns out, Intel's 10 nm may be a short-living node as the company's 7 nm tech is on-track for introduction in accordance with its original schedule.

For a number of times Intel said that it set too aggressive scaling/transistor density targets for its 10 nm fabrication process, which is why its development ran into problems. Intel's 10 nm manufacturing tech relies exclusively on deep ultraviolet lithography (DUVL) with lasers operating on a 193 nm wavelength. To enable the fine feature sizes that Intel set out to achieve on 10 nm, the process had to make heavy usage of mutli-patterning. According to Intel, a problem of the process was precisely its heavy usage of multipatterning (quad-patterning to be more exact).

Micron is now producing its first LPDDR4X memory devices using its second-generation 10nm-class process technology. "The new memory devices offer standard LPDDR4X data transfer rates of up to 4.266 Gbps per pin and consumes less power than earlier LPDDR4 chips," reports AnandTech. From the report: Micron's LPDDR4X devices are made using the company's 1Y-nm fabrication tech and feature a 12 Gb capacity. The manufacturer says that its LPDDR4X memory chips consume 10% less power when compared to its LPDDR4-4266 products; this is because they feature a lower output driver voltage (I/O VDDQ), which the LPDDR4X standard reduces by 45%, from 1.1 V to 0.6 V. Micron's 12 Gb (1.5 GB) LPDDR4X devices feature a slightly lower capacity than competing 16 Gb (2 GB) LPDDR4X offerings, but they are also cheaper to manufacture. As a result, Micron can offer lower-cost quad-die 64-bit LPDDR4X-4266 packages with a 48 Gb (6 GB) capacity and a 34.1 GB/s bandwidth than some of its competitors.

Micron is planning to exercise a $1.5 billion option to buy Intel's 49% stake in the companies' IM Flash Technologies Joint Venture. "The option is exercisable on Jan. 1, 2019, and Micron says the deal will close six to 12 months after," reports TheStreet. From the report: In a statement, Intel suggests the timing of the deal's closing is at its discretion for up to a year after the option is exercised, while indicating it long expected Micron's decision. The companies have already made a pair of announcements this year that between them that signal the end of their age-old R&D partnership for developing non-volatile memory technologies. IMFT owns a manufacturing plant (fab) in Lehi, Utah that both produces NAND flash memory and is for now the sole manufacturer of 3D XPoint (pronounced 3D cross-point), a memory technology that Micron and Intel co-developed and announced to much fanfare in mid-2015. Intel, via its Optane product line, has a head-start on Micron in launching 3D XPoint-based products. However, Micron, via its QuantX brand, plans to launch its own 3D XPoint offerings in late 2019, using a second generation version of the technology.

What's so great about 3D XPoint? In a nutshell, it carves out a middle ground between DRAM (very fast, but not dense, relatively expensive and volatile, or unable to retain its data when power is lost) and NAND (cheap, dense and non-volatile, but relatively slow). Though more expensive than NAND -- particularly in these early days -- and not as fast as DRAM, 3D XPoint is much faster than NAND and much cheaper than DRAM, and like NAND is non-volatile. That opens up a lot of potential applications. Games can get a boost from using 3D XPoint solid-state drives (SSDs) for storage rather than conventional NAND SSDs, as could demanding workstation applications. Within data centers -- probably the largest market for the technology over the next few years -- 3D XPoint could improve the performance of demanding AI and high-performance computing (HPC) applications and enable larger deployments of high-speed, in-memory databases than what's possible using DRAM. And in both the PC/workstation and data center markets, 3D XPoint drives can work in tandem with slower types of storage to act as a high-speed cache for important or frequently-accessed data.

Micron is planning to exercise a $1.5 billion option to buy Intel's 49% stake in the companies' IM Flash Technologies Joint Venture. "The option is exercisable on Jan. 1, 2019, and Micron says the deal will close six to 12 months after," reports TheStreet. From the report: In a statement, Intel suggests the timing of the deal's closing is at its discretion for up to a year after the option is exercised, while indicating it long expected Micron's decision. The companies have already made a pair of announcements this year that between them that signal the end of their age-old R&D partnership for developing non-volatile memory technologies. IMFT owns a manufacturing plant (fab) in Lehi, Utah that both produces NAND flash memory and is for now the sole manufacturer of 3D XPoint (pronounced 3D cross-point), a memory technology that Micron and Intel co-developed and announced to much fanfare in mid-2015. Intel, via its Optane product line, has a head-start on Micron in launching 3D XPoint-based products. However, Micron, via its QuantX brand, plans to launch its own 3D XPoint offerings in late 2019, using a second generation version of the technology.

What's so great about 3D XPoint? In a nutshell, it carves out a middle ground between DRAM (very fast, but not dense, relatively expensive and volatile, or unable to retain its data when power is lost) and NAND (cheap, dense and non-volatile, but relatively slow). Though more expensive than NAND -- particularly in these early days -- and not as fast as DRAM, 3D XPoint is much faster than NAND and much cheaper than DRAM, and like NAND is non-volatile. That opens up a lot of potential applications. Games can get a boost from using 3D XPoint solid-state drives (SSDs) for storage rather than conventional NAND SSDs, as could demanding workstation applications. Within data centers -- probably the largest market for the technology over the next few years -- 3D XPoint could improve the performance of demanding AI and high-performance computing (HPC) applications and enable larger deployments of high-speed, in-memory databases than what's possible using DRAM. And in both the PC/workstation and data center markets, 3D XPoint drives can work in tandem with slower types of storage to act as a high-speed cache for important or frequently-accessed data.

Ian Cutress, writing for AnandTech: One of today's announcements threw up an interesting footnote worthy of further investigation. With its latest products, HP announced that their mainstream desktop platforms would be shipped with up to 32GB of memory, which was further expandable up to 128GB. Intel has confirmed to us, based on new memory entering the market, that there will be an adjustment to the memory support of the latest processors.

Normally mainstream processors only support 64GB, by virtue of two memory channels, two DIMMs per memory channel (2DPC), and the maximum size of a standard consumer UDIMM being 16GB of DDR4, meaning 4x16GB = 64GB. However the launch of two different technologies, both double height double capacity 32GB DDR4 modules from Zadak and G.Skill, as well as new 16Gb DDR4 chips coming from Samsung, means that technically in a consumer system with four memory slots, up to 128GB might be possible.

Last November, Razer unveiled a smartphone designed for gamers who value performance and power over bells and whistles like waterproofing and wireless charging. At an event Wednesday night, Razer took the wraps off its successor, aptly named Razer Phone 2, which sports a brighter, notch-less, 5.72-inch IGZO LCD display with a 2560x1440 resolution and HDR, wireless charging, IP67 water- and dust-resistance rating, and RGB lighting behind the Razer logo on the rear. Given the addition of waterproofing and wireless charging, the Razer Phone 2 appears to be much more well-rounded than its predecessor, making the decision all the more difficult when shopping for a premium, high-end smartphone. AnandTech reports: This display is rated at 645 nits peak, up to 50% higher than the previous Razer Phone, and also supports HDR. Razer states that the display also has wide color gamut, which turns out to be 98.4% of DCI-P3. Also on the front, it has two front facing speakers in identical positions to the previous generation, and it has a front facing camera and sensor (albeit with swapped positions). That front camera is an 8MP f/2.0 unit, capable of recording at 1080p60, a user-requested feature for streaming and selfie recording. The front of the device is Corning Gorilla Glass 5, an upgrade from GG3 in the last generation.

When we move to the rear, things change much more noticeably. Instead of the aluminum rear, Razer has a full Gorilla Glass 5 back, which helps enable Qi Wireless Charging, a much requested feature. This is alongside QuickCharge 4+ through a Type-C cable. On the rear we have the dual cameras, this time placed in the center just above the logo. This time around Razer has gone with a 20MP Sony IMX363 f/1.75 main camera with OIS, and an 8MP Sony IMX 351 f/2.6 telephoto camera to enable some extra zoom functionality. Below the cameras is the Razer logo, which has a full 16.8million color RGB LED underneath which users can adjust through the onboard Chroma software. The Razer Phone 2 is still very much power-focused, as it features Qualcomm's latest Snapdragon 845 CPU with a "vapor chamber cooling" which can allow the phone to draw 20-30% more power than other flagships. There's 8GB of LPDDR4X memory, 64GB of UFS storage with support for a microSD card, and a whopping 4,000mAh. Razer says their new smartphone will be priced at $799 and will start shipping in mid-November.

When Apple unveiled the iPhone Xs and Xs Max earlier today, it said they will contain the A12 Bionic chip -- the first smartphone processor to be made using 7nm manufacturing technology. But, as IEEE Spectrum points out, Huawei made the same claim late last month when it unveiled the Kirin 980 system on a chip. From the report: Apple's new A12 Bionic is made up of four CPU cores, six GPU cores, and an 8-core "neural engine" to handle machine learning tasks. According to Apple, the neural engine can perform 5 trillion operations per second -- an eight-fold boost -- and consumes one-tenth the energy of its previous incarnation. Of the GPU cores, two are designed for performance and are 15 percent faster than their predecessors. The other four are built for efficiency, with a 50 percent improvement on that metric. The system can decide which combination of the three types of cores will run a task most efficiently.

Huawei's chip, the Kirin 980, was unveiled at the IFA 2018 in Berlin on 31 August. It packs 6.9 billion transistors onto a one-square-centimeter chip. The company says it's the first chip to use processors based on Arm's Cortex-A76, which is 75 percent more powerful and 58 percent more efficient compared to its predecessors the A73 and A75. It has 8 cores, two big, high-performance ones based on the A76, two middle-performance ones that are also A76s, and four smaller, high-efficiency cores based on a Cortex-A55 design. The system runs on a variation of Arm's big.LITTLE architecture, in which immediate, intensive workloads are handled by the big processors while sustained background tasks are the job of the little ones. Kirin 980's GPU component is called the Mali-G76, and it offers a 46 percent performance boost and a 178 percent efficiency improvement from the previous generation. The chip also has a dual-core neural processing unit that more than doubles the number of images it can recognize to 4,500 images per minute. Apple will be the first to bring the 7nm chip in volume to market, as Huawei is expected to to start shipping its Mate 20 series phone (with the 7nm chip) a month or two later. Qualcomm also announced late last month that it's begun sampling its 7nm next-gen Snapdragon SoC. As IEEE Spectrum notes, the real winner is TSMC, which is making all three processors.

An anonymous reader quotes a report from TechCrunch: UL, the company behind the tablet and phone performance benchmark app 3DMark, has delisted new Huawei phones from its "Best Smartphone" leaderboard after AnandTech discovered the phone maker was boosting its performance to ace the app's test. The phones delisted were the P20, P20 Pro, Nova 3 and the Honor Play. "After testing the devices in our own lab and confirming that they breach our rules, we have decided to delist the affected models and remove them from our performance rankings," the company said in a statement.

For the Huawei case, the rules are actually a little fuzzy. Phones are permitted to adjust performance based on workload, which results in peaks or dips in performance for different apps, but they are not permitted to hard-code peaks in performance specifically for the benchmark app. Huawei reportedly claimed that the peak in performance seen during the run of the benchmark app was an intuitive jump determined by AI; however, when an unlabeled version of the benchmark test was run, the phones were unable to recognize it and, as a result, displayed lower performances. In other words, the phones aren't so smart after all.

IFA 2018 is here, and to go along with the wealth of new laptops that will presumably be announced over the next few days, Intel is taking the wraps off its latest 8th-Gen processors. There are three new Whiskey Lake U-series chips (Intel's midrange line for laptops), and, for the first time, there are three 8th-Gen Amber Lake Y-series processors. From a report: While Intel is still using the same underlying architecture as its previous processors -- making these new chips ostensibly an "8.5-Gen" lineup, at least where the U-series models are concerned -- the big change that the company is highlighting is integrated gigabit Wi-Fi support. Intel promises that this should result in dramatically faster internet speeds, especially apparent on the cheaper, midrange laptops that may not have been able to offer those kinds of speeds before. Also being added to the new Y-series and U-series chips is built-in support for virtual assistants like Cortana and Alexa. So you should expect to see the digital assistants cropping up on more laptops in the near future. Further reading: Intel Launches Whiskey Lake-U and Amber Lake-Y: New MacBook CPUs?

GlobalFoundries has made a major strategy shift announcement. The contract maker of semiconductors says it is ceasing development of bleeding edge manufacturing technologies and stop all work on its 7LP (7 nm) fabrication processes, which will not be used for any client. From a report: Instead, the company will focus on specialized process technologies for clients in emerging high-growth markets. These technologies will initially be based on the company's 14LPP/12LP platform and will include RF, embedded memory, and low power features. Because of the strategy shift, GF will cut 5% of its staff as well as renegotiate its WSA and IP-related deals with AMD and IBM.

GlobalFoundries was on track to tape out its clients' first chips made using its 7 nm process technology in the fourth quarter of this year, but "a few weeks ago" the company decided to take a drastic strategical turn, says Gary Patton. The CTO stressed that the decision was made not based on technical issues that the company faced, but on a careful consideration of business opportunities the company had with its 7LP platform as well as financial concerns. On the heels of this announcement, AMD said today that it will move all of its 7nm production on both CPUs and GPUs to TSMC.

An anonymous reader shares a report: Ever since Meltdown and Spectre were disclosed, Intel's various customers have been asking how long it would take for hardware fixes to these problems to ship. The fixes will deploy with Cascade Lake, Intel's next server platform due later this year, but the company is finally lifting the lid on some of those improvements and security enhancements at Hot Chips this week.

One major concern? Putting back the performance that previous solutions have lost as a result of Meltdown and Spectre. It's hard to quantify exactly what this looks like, because the impact tends to be extremely workload-dependent. But Intel's guidance has been in the 5-10 percent range, depending on workload and platform, and with the understanding that older CPUs were sometimes hit harder than newer ones. Intel wasn't willing to speak to exactly what kind of uplift users should expect, but Lisa Spelman, VP of Intel's Data Center Group, told AnandTech that the new hardware solutions would have an "impact" on the performance hit from mitigation, and that overall performance would improve at the platform level regardless. Variant 1 will still require software-level protections, while Variant 2 (that's the "classic" Spectre attack) will require a mixture of hardware and software protection. Variant 3 (Meltdown) will be blocked in hardware, 3a (discovered by ARM) patched via firmware, with Variant 5 (Foreshadow) also patched in hardware.

With PC makers like Asus and HP beginning to design laptops and tablets around ARM chips, ARM itself has decided to emerge from the shadows and unroll its roadmap to challenge Intel through at least 2020, PCWorld writes. From a report, which details ARM's announcement Thursday: ARM's now-public roadmap represents its first processors that are designed for the PC space. ARM, taking aim at the dominant player, claims its chips will equal and potentially even surpass Intel's in single-threaded performance. ARM is unveiling two new chip architectures: Deimos, a 7nm architecture to debut in 2019, and Hercules, a 5nm design for 2020. There's a catch, of course: Many Windows apps aren't natively written for the ARM instruction set, forcing them to pay a performance penalty via emulation. Comparing itself to Intel is a brightly-colored signpost that ARM remains committed to the PC market, however.

ARM-powered PCs like the Asus NovaGo offer game-changing battery life -- but the performance suffers, for two reasons: One, because the computing power of ARM's cores has lagged behind those of the Intel Core family; and two, because any apps that the ARM chip can't process natively have to be emulated. ARM can't do much about Microsoft's development path, but it can increase its own performance. Finally, if you were concerned that ARM PCs will be a flash in the pan, the answer is no, apparently not. Further reading: ARM Reveals First Public CPU Roadmap - Targeting Intel Performance (PC Perspective); and ARM Unveils Client CPU Performance Roadmap Through 2020 - Taking Intel Head On (AnandTech).

An anonymous reader shares a report: AMD has cornered the x86 console market with its handy semi-custom mix of processors and graphics. While we slowly await the next generation of consoles from Microsoft and Sony, today AMD and Zhongshan Subor announced that a custom chip has been made for a new gaming PC and an upcoming console for the Chinese market.

The announcement states that a custom chip has been created for Subor that is based on four Zen cores running at 3.0 GHz and 24 compute units of Vega running at 1.3 GHz. The chip is supported by 8GB of GDDR5 memory, which the press release states is also embedded onto the chip, however it is likely to actually be on the package instead. [...] Assuming that this custom chip is a single chip design, with CPU and GPU, this means that AMD is handily gaining custom contracts and designing custom chip designs for its customers, even for consoles that won't have the mass western appeal such as the Xbox or Playstation.

In macOS 10.14 Mojave, which Apple unveiled on Monday, the company is deprecating OpenGL and OpenCL technologies in its desktop operating system. In an announcement post to developers, the company wrote: Apps built using OpenGL and OpenCL will continue to run in macOS 10.14, but these legacy technologies are deprecated in macOS 10.14. Games and graphics-intensive apps that use OpenGL should now adopt Metal. Similarly, apps that use OpenCL for computational tasks should now adopt Metal and Metal Performance Shaders. PCGamer reports that several developers have expressed disappointment over the decision. AnandTech reports that the company is doing away with OpenGL and OpenCL in iOS and its other operating systems as well.

MojoKid writes: Last week, Arm showed off its new Machine Learning Processor design, but today it has lifted the veil on its next-generation Cortex and Mali CPU, GPU, and VPU architectures, destined for 2019 smartphones and mobile devices. The Arm Cortex-A76 CPU, Mali-G76 GPU, and Mali-V76 VPU designs all step up performance and efficiency over previous generation designs, though there are architectural and layout changes and more advanced manufacturing processes.

Arm believes its A76 core, which can be clocked at 3GHz+ when produced on a 7nm process, can perform within 10 percent of an Intel Skylake core within the same thermal constraints, but at approximately half the footprint. The Mali-G76 improves density and energy efficiency by 30 percent over the previous generation G72, while providing a 2.7x uplift in machine learning workloads. And the Mali-V76 VPU improves on the recently announced V52 by adding support for 8K UltraHD content, among many other improvements.

Intel announced the availability of its long-awaited Optane DIMMs Wednesday, bringing 3D XPoint memory onto the DDR4 memory bus. From a report: The modules that have been known under the Apache Pass codename will be branded as Optane DC Persistent Memory, to contrast with Optane DC SSDs, and not to be confused with the consumer-oriented Optane Memory caching SSDs. The new Optane DC Persistent Memory modules will be initially available in three capacities: 128GB, 256GB and 512GB per module. This implies that they are probably still based on the same 128Gb 3D XPoint memory dies used in all other Optane products so far. The modules are pin-compatible with standard DDR4 DIMMs and will be supported by the next generation of Intel's Xeon server platforms.

Billly Gates writes: Windows 10 build 1803 has come out this month, but with some problems. AnandTech has a deep-dive with the review examing many new features including the much better support for Linux. WSL (Windows Subsystem for Linux) now has native Curt and Tar from the command prompt as well as a utility to convert Unix to Windows pathnames called WSLpath.exe which is documented here. In addition it was mentioned on Slashdot in the past about OpenSSH being ported natively to Win32 in certain early builds. It now seems the reason was for Linux interoperability with this Spring Update 2. Unix sockets mean you can run Kali Linux on Windows 10 for penetration testing or run an Apache server in the background with full Linux networking support. Deemons now run in the background even with the command prompt closed. [...]

An anonymous reader quotes a report from AnandTech: Today Qualcomm announces a new entry to the Snapdragon lineup with the first 700-series SoC platform. The Snapdragon 710 is a direct successor to the Snapdragon 660 but comes with a new branding more worthy of the increased performance characteristics of the SoC. The big IP blocks found on the Snapdragon 710 are very much derivatives of what's found on the flagship Snapdragon 845. On the CPU side we see the same 2.2GHz maximum clock on the big cores, but the Kryo 360 Cortex A75 based CPUs are microarchitectural upgrade over last year's A72 based Kryo 260. The little cores are also based on the newer Cortex A55's and are clocked at up to 1.7GHz. The performance improvements are quoted as an overall 20% uplift in SPECint2000 and 25% faster performance in Octane and Kraken versus the SD660. The SoC now also uses the new system cache first introduced in the Snapdragon 845 -- although I'm expecting a smaller, yet unconfirmed 1MB size in the SD710. The 700-series SoC platform sports the new 600 series Adreno GPUs. They have an expected frequency of around 750MHz and up to 35% higher performance versus the Adreno 512 in the SD660.

"In terms of connectivity the new SoC implements an X15 modem which is capable of UE Category 15 in the downstream with up to 800Mbps in 4x carrier aggregation and up to UE Category 7 in the upload with up to 2x CA and 256 QAM," reports AnandTech. "The new chipset now also offers 2x2 802.11ac digital backend for Wi-Fi -- however it'll still need an external discrete analog RF frontend."

Artem Tashkinov writes: A Chinese retailer has started selling a laptop featuring Intel's first 10nm CPU the Intel Core i3 8121U. Intel promised to start producing 10nm CPUs in 2016 but the rollout has been postponed almost until the second half of 2018. It's worth noting that this CPU does not have integrated graphics enabled and features only two cores.

AnandTech opines: "This machine listed online means that we can confirm that Intel is indeed shipping 10nm components into the consumer market. Shipping a low-end dual core processor with disabled graphics doesn't inspire confidence, especially as it is labelled under the 8th gen designation, and not something new and shiny under the 9th gen -- although Intel did state in a recent earnings call that serious 10nm volume and revenue is now a 2019 target. These parts are, for better or worse, helping Intel generate some systems with the new technology. We've never before seen Intel commercially use low-end processors to introduce a new manufacturing process, although this might be the norm from now on."

HTC has begun to ramp up marketing campaign for its next major smartphone release, teasing that they will be making a proper announcement on May 23rd. From a report: In an email sent to the press this morning and posted on their website, HTC posted a photo of neatly laid out phone components, with the text "Coming Soon... A phone that is more than the sum of its specs." The photo and the announcement give a May 23rd date for more details. AnandTech has added an update to the story, (Via DaringFireball ): As pointed out by a reader, these aren't new components. Or even components of an HTC phone. Rather they're a disassembled iPhone 6...

HTC has begun to ramp up marketing campaign for its next major smartphone release, teasing that they will be making a proper announcement on May 23rd. From a report: In an email sent to the press this morning and posted on their website, HTC posted a photo of neatly laid out phone components, with the text "Coming Soon... A phone that is more than the sum of its specs." The photo and the announcement give a May 23rd date for more details. AnandTech has added an update to the story, (Via DaringFireball ): As pointed out by a reader, these aren't new components. Or even components of an HTC phone. Rather they're a disassembled iPhone 6...

hyperclocker shares a report from AnandTech: Samsung has announced the third generation of their high-end consumer NVMe SSDs. The new 970 PRO and 970 EVO M.2 NVMe SSDs use a newer controller and Samsung's latest 64-layer 3D NAND flash memory. The outgoing 960 PRO and 960 EVO were first announced in September 2016 and shipped that fall, so they have had a fairly long run as Samsung's flagship consumer SSDs. Compared to its predecessor, the 970 EVO promises a small improvement in sequential read speed, and a more substantial boost to sequential write speed for all but the smallest 250GB model. Peak random access performance is also substantially improved, but again the 250GB model gets left out, and is actually rated as slower than the 960 EVO 250GB. The warranty on the EVO has been extended from three years to five years, and the write endurance ratings have been increased by 50% to retain almost the same drive writes per day rating.

The 970 PRO's performance specs aren't too different from the 970 EVO. Many of the ratings are the same, and the ones that differ are mostly better by just 3-11% for the PRO. There are just two major exceptions to this. First, the PRO doesn't rely on SLC write caching so it can maintain its write speed far longer than the EVO. Second, the rated write endurance of the 970 PRO is twice that of the EVO, going from just over 0.3 Drive Writes Per Day to 0.6 DWPD. Neither of these are an important factor for ordinary consumer use cases, but they help the 970 PRO retain some shine as a premium product.

bigwophh writes from a report via HotHardware: NVIDIA CEO Jensen Huang took to the stage at GTC today to unveil a number of GPU-powered innovations for machine learning, including a new AI supercomputer and an updated version of the company's powerful Tesla V100 GPU that now sports a hefty 32GB of on-board HBM2 memory. A follow-on to last year's DGX-1 AI supercomputer, the new NVIDIA DGX-2 can be equipped with double the number of Tesla V100 processing modules for double the GPU horsepower. The DGX-2 can also have four times the available memory space, thanks to the updated Tesla V100's larger 32GB of memory. NVIDIA's new NVSwitch technology is a fully crossbar GPU interconnect fabric that allows NVIDIA's platform to scale to up to 16 GPUs and utilize their memory space contiguously, where the previous DGX-1 NVIDIA platform was limited to 8 total GPU complexes and associated memory. NVIDIA claims NVSwitch is five times faster than the fastest PCI Express switch and offers an aggregate 2.4TB per second of bandwidth. A new Quadro card was also announced. Called the Quadro GV100, it too is being powered by Volta. The Quadro GV100 packs 32GB of memory and supports NVIDIA's recently announced RTX real-time ray tracing technology.

The Galaxy S9 and S9+, the flagship smartphones from the South Korean electronics manufacturer Samsung are powered by company's homegrown Exynos 9810 SoC (in most markets) or Qualcomm's Snapdragon 845 SoC. In its review of Samsung Galaxy S9, AnandTech comments on the differences it observed on the S9 model powered by Samsung's own SoC and the variant with Qualcomm's processor. From the review: Finally, the biggest story for the Galaxy S9 is its big contrast in terms of SoC hardware. Ever since we first heard about the Exynos 9810 we had very large expectations and we knew there would be some tangible differences between Exynos and Snapdragon variants. The expectations couldn't be more shattered than the results we got. While the Snapdragon 845 variant of the Galaxy S9 performed largely as advertised and as we had been told to expect by Qualcomm, the Exynos 9810 failed to live up to its hype in real-world scenarios. Effectively, the Exynos 9810 variant and as evidenced by all the data we collected, is the slower variant of the two. The root cause here has been identified as the extremely conservative scheduler and DVFS mechanisms which essentially nullify any advantage the new M3 cores have in synthetic benchmarks.

In 3D benchmarks, the Exynos 9810 posted very healthy efficiency improvements and even sometimes managed to catch up to last year's Adreno 540 -- something I hadn't expected. Qualcomm's new Adreno 630 raises the bar in terms of peak performance, however the promises of increased efficiency have not materialised in the commercial hardware as the performance boost comes at a cost of increased power. Effectively, when looking at sustained workloads, the Snapdragon 845 isn't any faster than the Snapdragon 835 in its GPU department. Fortunately for Qualcomm, they're still in the lead and this is not a deal-breaker for the Galaxy S9. While the performance advantage of the Snapdragon 845 variant over the Exynos 9810 variant is something we could live with, the battery life results of the Exynos is definitely a deal-breaker.

An anonymous reader quotes a report from AnandTech: A half-hour power outage at Samsung's fab near Pyeongtaek, South Korea, disrupted production and damaged tens of thousands of processed wafers. Media reports claim that the outage destroyed as much as 3.5% of the global NAND supply for March, which may have an effect on flash memory pricing in the coming weeks. The outage happened on March 9 and lasted for about 30 minutes, according to a news story from Taiwain-based TechNews that cites further South Korean reports. The report claims that the outage damaged 50,000 to 60,000 of wafers with V-NAND flash memory, which represent 11% of Samsung's monthly output. The report further estimates that the said amount equates to approximately 3.5% of global NAND output, but does not elaborate whether it means wafer output or bit output. Samsung uses its fab near Pyeongtaek to produce 64-layer V-NAND chips used for various applications. The fab is among the largest flash production facilities in the world and therefore any disruption there has an effect on the global output of non-volatile memory. Meanwhile, since production lines have not been damaged and the fab is back online, the significance of such an effect is limited.

The Khronos Group, a consortium of hardware and software companies, has announced that the Vulkan graphics technology is coming to Apple's platforms, allowing games and apps to run at faster performance levels on Macs and iOS devices. From a report: In collaboration with Valve, LunarG, and The Brenwill Workshop, this free open-source collection includes the full 1.0 release of the previously-commercial MoltenVK, a library for translating Vulkan API calls to Apple's Metal 1 and 2 calls, as well LunarG's new Vulkan SDK for macOS. Funding the costs of open-sourcing, Valve has been utilizing these tools on their applications, noting performance gains over native OpenGL drivers with Vulkan DOTA 2 on macOS as a production-load example. Altogether, this forms the next step in Khronos' Vulkan Portability Initiative, which was first announced at GDC 2017 as their "3D Portability Initiative," and later refined as the "Vulkan Portability Initiative" last summer. Spurred by industry demand, Khronos is striving for a cross-platform API portability solution, where an appropriate subset of Vulkan can act as a 'meta-API'-esque layer to map to DirectX 12 and Metal; the holy grail being that developers can craft a single Vulkan portable application or engine that can be seamlessly deployed across Vulkan, DX12, and Metal supporting platforms.

An anonymous reader shares a report: To begin the year, Intel's Indian website has published a small number of details regarding Intel's first 'Intel with Radeon RX Vega Graphics' processor. Within the table of overclockable processors, accompanying the Core i9, Core i7-X and 8th Generation K processors is listed the Intel Core i7-8809G, a quad core processor with two sets of graphics options listed. The Core i7-8809G is not a part that Intel has formally announced in a press release, but on Intel's overclocking webpage here it as listed as being a quad-core processor with hyperthreading, supporting a 3.1 GHz base frequency, having an 8 MB L3 cache, a 100W 'Target' TDP, and supporting two channels of DDR4-2400. Intel lists both sets of graphics: the integrated graphics (iGPU, or IGP) as 'Intel HD Graphics 630', and the package graphics (pGPU) as 'Radeon RX Vega M GH Graphics'.

Nvidia has announced the Titan V, the "world's most powerful PC GPU." It's based on Nvidia's Volta, the same architecture as the Nvidia Tesla V100 GPUs behind Amazon Web Service's recently launched top-end P3 instances, which are dedicated to artificial-intelligence applications. From a report: A mere 7 months after Volta was announced with the Tesla V100 accelerator and the GV100 GPU inside it, Nvidia continues its breakneck pace by releasing the GV100-powered Titan V, available for sale today. Aimed at a decidedly more compute-oriented market than ever before, the 815 mm2 behemoth die that is GV100 is now available to the broader public. [...] The Titan V, by extension, sees the Titan lineup finally switch loyalties and start using Nvidia's high-end compute-focused GPUs, in this case the Volta architecture based V100. The end result is that rather than being Nvidia's top prosumer card, the Titan V is decidedly more focused on compute, particularly due to the combination of the price tag and the unique feature set that comes from using the GV100 GPU. Which isn't to say that you can't do graphics on the card -- this is still very much a video card, outputs and all -- but Nvidia is first and foremost promoting it as a workstation-level AI compute card, and by extension focusing on the GV100 GPU's unique tensor cores and the massive neural networking performance advantages they offer over earlier Nvidia cards.

Slashdot reader overheardinpdx shares a video from the SC17 supercomputing conference where Bruce Tulloch from BitScope "describes a low-cost Rasberry Pi cluster that Los Alamos National Lab is using to simulate large-scale supercomputers." Slashdot reader mspohr describes them as "five rack-mount Bitscope Cluster Modules, each with 150 Raspberry Pi boards with integrated network switches." With each of the 750 chips packing four cores, it offers a 3,000-core highly parallelizable platform that emulates an ARM-based supercomputer, allowing researchers to test development code without requiring a power-hungry machine at significant cost to the taxpayer. The full 750-node cluster, running 2-3 W per processor, runs at 1000W idle, 3000W at typical and 4000W at peak (with the switches) and is substantially cheaper, if also computationally a lot slower. After development using the Pi clusters, frameworks can then be ported to the larger scale supercomputers available at Los Alamos National Lab, such as Trinity and Crossroads.
BitScope's Tulloch points out the cluster is fully integrated with the network switching infrastructure at Los Alamos National Lab, and applauds the Raspberry Bi cluster as "affordable, scalable, highly parallel testbed for high-performance-computing system-software developers."

Ryan Smith, writing for AnandTech: On the day following what's perhaps one of the greatest (and oddest) product design wins for AMD's Radeon Technologies Group, a second bit of surprising news is coming out of AMD. Raja Koduri, the Senior VP and Chief Architect of the group, who has been its leader since the RTG was formed two years ago, has announced that he is resigning from the company, effective tomorrow. Word of Raja's resignation originally broke via an internal memo penned by Raja and acquired by Hexus. And while AMD will not confirm the validity of the memo, the company is confirming that Raja has decided to leave the company.

An anonymous reader quotes a report from CNBC: Tesla is getting closer to having its own chip for handling autonomous driving tasks in its cars. The carmaker has received back samples of the first implementation of its processor and is now running tests on it, said a source familiar with the matter. The effort to build its own chip is in line with Tesla's push to be vertically integrated and decrease reliance on other companies. But Tesla isn't completely going it alone in chip development, according to the source, and will build on top of AMD intellectual property. On Wednesday Sanjay Jha, CEO of AMD spin-off GlobalFoundries, said at the company's technology conference in Santa Clara, California, that the company is working directly with Tesla. GlobalFoundries, which fabricates chips, has a wafer supply agreement in place with AMD through 2020. Tesla's silicon project is bounding ahead under the leadership of longtime chip architect Jim Keller, the head of Autopilot hardware and software since the departure of Apple veteran Chris Lattner in June. Keller, 57, joined Tesla in early 2016 following two stints at AMD and one at Apple. Keller arrived at Apple in 2008 through its acquisition of Palo Alto Semiconductor and was the designer of Apple's A4 and A5 iPhone chips, among other things. More than 50 people are working on the initiative under Keller, the source said. Tesla has brought on several AMD veterans after hiring Keller, including director Ganesh Venkataramanan, principal hardware engineer Bill McGee and system circuit design lead Dan Bailey.

Reader joshtops writes: Today Intel is launching its new 8th Generation family of processors, starting with four CPUs for the 15W mobile family. There are two elements that make the launch of these 8th Gen processors different. First is that the 8th Gen is at a high enough level, running basically the same microarchitecture as the 7th Gen. But the key element is that, at the same price and power where a user would get a dual core i5-U or i7-U in their laptop, Intel will now be bumping those product lines up to quad-cores with hyperthreading. This gives a 100% gain in cores and 100% gain in threads. Obviously nothing is for free, so despite Intel stating that they've made minor tweaks to the microarchitecture and manufacturing to get better performing silicon, the base frequencies are down slightly. Turbo modes are still high, ensuring a similar user experience in most computing tasks. Memory support is similar -- DDR4 and LPDDR3 are supported, but not LPDDR4 -- although DDR4 moves up to DDR4-2400 from DDR4-2133. Another change from 7th Gen to 8th Gen will be in the graphics. Intel is upgrading the nomenclature of the integrated graphics from HD 620 to UHD 620, indicating that the silicon is suited for 4K playback and processing.

Intel has confirmed the existence of a new processor family called Ice Lake that will be made on Intel's 10nm+ process. The company published basic information on the Ice Lake architecture on their codename decoder. AnandTech reports: This is an unexpected development as the company has yet to formally detail (let alone launch) the first 10nm Core architecture -- Cannon Lake -- and it's rare these days for Intel to talk more than a generation ahead in CPU architectures. Equally as interesting is the fact that Intel is calling Ice Lake the successor to their upcoming 8th generation Coffee Lake processors, which codename bingo aside, throws some confusion on where the 14nm Coffee Lake and 10nm Cannon Lake will eventually stand. As a refresher, the last few generations of Core have been Sandy Bridge, Ivy Bridge, Broadwell, Haswell, Skylake, with Kaby Lake being the latest and was recently released at the top of the year. Kaby Lake is Intel's third Core product produced using a 14nm lithography process, specifically the second-generation '14 PLUS' (or 14+) version of Intel's 14nm process.

Working purely on lithographic nomenclature, Intel has three processes on 14nm: 14, 14+, and 14++. As shown to everyone at Intel's Technology Manufacturing Day a couple of months ago, these will be followed by a trio of 10nm processes: 10nm, 10nm+ (10+), and 10++. On the desktop, Core processors will go from 14 to 14+ to 14++, such that we move from Skylake to Kaby Lake to Coffee Lake. On the Laptop side, this goes from 14 to 14+ to 14++/10, such that we move from Skylake to Kaby Lake to Coffee Lake like the desktops, but also that at some time during the Coffee Lake generation, Cannon Lake will also be launched for laptops. The next node for both after this is 10+, which will be helmed by the Ice Lake architecture.

Nate Oh, writing for AnandTech: Today Intel subsidiary Movidius is launching their Neural Compute Stick (NCS), a version of which was showcased earlier this year at CES 2017. The Movidius NCS adds to Intel's deep learning and AI development portfolio, building off of Movidius' April 2016 launch of the Fathom NCS and Intel's later acquisition of Movidius itself in September 2016. As Intel states, the Movidius NCS is "the world's first self-contained AI accelerator in a USB format," and is designed to allow host devices to process deep neural networks natively -- or in other words, at the edge. In turn, this provides developers and researchers with a low power and low cost method to develop and optimize various offline AI applications. Movidius's NCS is powered by their Myriad 2 vision processing unit (VPU), and, according to the company, can reach over 100 GFLOPs of performance within an nominal 1W of power consumption. Under the hood, the Movidius NCS works by translating a standard, trained Caffe-based convolutional neural network (CNN) into an embedded neural network that then runs on the VPU. In production workloads, the NCS can be used as a discrete accelerator for speeding up or offloading neural network tasks. Otherwise for development workloads, the company offers several developer-centric features, including layer-by-layer neural networks metrics to allow developers to analyze and optimize performance and power, and validation scripts to allow developers to compare the output of the NCS against the original PC model in order to ensure the accuracy of the NCS's model. According to Gary Brown, VP of Marketing at Movidius, this 'Acceleration mode' is one of several features that differentiate the Movidius NCS from the Fathom NCS. The Movidius NCS also comes with a new "Multi-Stick mode" that allows multiple sticks in one host to work in conjunction in offloading work from the CPU. For multiple stick configurations, Movidius claims that they have confirmed linear performance increases up to 4 sticks in lab tests, and are currently validating 6 and 8 stick configurations. Importantly, the company believes that there is no theoretical maximum, and they expect that they can achieve similar linear behavior for more devices. Though ultimately scalability will depend at least somewhat with the neural network itself, and developers trying to use the feature will want to play around with it to determine how well they can reasonably scale. As for the technical specifications, the Movidius Neural Compute Stick features a 4Gb LPDDR3 on-chip memory, and a USB 3.0 Type A interface.

Reader harrisonweber shares a report: This morning AMD introduced their Ryzen PRO processors for business and commercial desktop PCs. The new lineup of CPUs includes the Ryzen 3 PRO, Ryzen 5 PRO and Ryzen 7 PRO families with four, six, or eight cores running at various frequencies. A superset to the standard Ryzen chips, the PRO chips have the same feature set as other Ryzen devices, but also offer enhanced security, 24 months availability, a longer warranty and promise to feature better chip quality. The AMD Ryzen PRO lineup of processors consists of six SKUs that belong to the Ryzen 7, Ryzen 5 and Ryzen 3 families targeting different market segments and offering different levels of performance. As one would expect, the Ryzen 7 PRO models are aimed at workstation applications and thus have all eight cores with simultaneous multithreading enabled, the Ryzen 5 PROmodels are designed for advanced mainstream desktops and therefore have four or six cores with SMT, whereas the Ryzen 3 PRO models are aimed at office workloads that work well on quad-core CPUs without SMT. The specifications of the Ryzen 7 PRO and the Ryzen 5 PRO resemble those of regular Ryzen processors. Meanwhile, the Ryzen 3 PRO are the first chips from the Ryzen 3 lineup and thus give us a general idea what to expect from such products: four cores without SMT operating at 3.1-3.5 GHz base frequency along with 2+8 MB of cache.

AMD has unveiled the first generation of Epyc, its new range of server processors built around its Zen architecture. Processors will range from the Epyc 7251 -- an eight-core, 16-thread chip running at 2.1 to 2.9GHz in a 120W power envelope -- up to the Epyc 7601: a 32-core, 64-thread monster running at 2.2 to 3.2GHz, with a 180W design power. From a report: These chips are built on the same fundamental architecture as the company's Ryzen CPU cores, and they're aimed at the incredibly powerful data center market. AMD's 32-core / 64-thread Epyc CPUs combine four eight-core dies, each connected to the other via the company's Infinity Fabric. According to AMD, this approach is significantly cheaper than trying to pack 32 cores into a single monolithic die -- that approach would leave the company potentially throwing away huge amounts of silicon during its production ramp. The Infinity Fabric is deliberately over-provisioned to minimize any problems with non-NUMA aware software, according to Anandtech. Each 32-core Epyc CPU will support eight memory channels and two DIMMs per channel, for a total maximum memory capacity of 2TB per socket, or 4TB of RAM in a two-socket system. Each CPU will also offer 128 lanes of PCI Express 3.0 support -- enough to connect up to six GPUs at x16 each with room left over for I/O support. That's in a one-socket system, mind you. In a two-socket system, the total number of available PCI Express 3.0 lanes is unchanged, at 128 (64 PCIe 3.0 lanes are used to handle CPU -- CPU communication). Anandtech has a longer writeup with more details on the CPUs power efficiency and TDP scaling. Further reading: ZDNet, press release.

Ian Cutress, writing for AnandTech: At Computex a couple of weeks ago, Intel announced its new Basin Falls platform, consisting of the X299 chipset with motherboards based on it, a pair of Kaby Lake-X processors, and a set of Skylake-X processors going all the way up to eighteen cores, denoting the first use of Intel's enterprise level high core-count silicon in a consumer product. As part of Intel's E3 press release, as well as their presentations at the show, the new Core i9 processors were discussed, along with Intel's continued commitment towards eSports. Intel gave the dates for the new platform as the following: 4, 6, 8 and 10-core parts available for pre-order from June 19th; 4, 6, 8 and 10-core parts shipping to consumers from June 26th; 12-core parts expected to ship in August; and 14, 16 and 18 core parts expected to ship in October.

Ian Cutress, writing for AnandTech: At Computex a couple of weeks ago, Intel announced its new Basin Falls platform, consisting of the X299 chipset with motherboards based on it, a pair of Kaby Lake-X processors, and a set of Skylake-X processors going all the way up to eighteen cores, denoting the first use of Intel's enterprise level high core-count silicon in a consumer product. As part of Intel's E3 press release, as well as their presentations at the show, the new Core i9 processors were discussed, along with Intel's continued commitment towards eSports. Intel gave the dates for the new platform as the following: 4, 6, 8 and 10-core parts available for pre-order from June 19th; 4, 6, 8 and 10-core parts shipping to consumers from June 26th; 12-core parts expected to ship in August; and 14, 16 and 18 core parts expected to ship in October.

With Core i9, the Intel vs. AMD battle rages anew. Announced Tuesday at Computex in Taipei, Intel's answer to AMD's 16-core, 32-thread Threadripper is an 18-core, 36-thread monster microprocessor of its own, tailor-made for elite PC enthusiasts. From a report: The Core i9 Extreme Edition i9-7980XE, what Intel calls the first teraflop desktop PC processor ever, will be priced at (gulp!) $1,999 when it ships later this year. In a slightly lower tier will be the meat of the Core i9 family: Core i9 X-series chips in 16-core, 14-core, 12-core, and 10-core versions, with prices climbing from $999 to $1,699. All of these new Skylake-based parts will offer improvements over their older Broadwell-E counterparts: 15 percent faster in single-threaded apps and 10 percent faster in multithreaded tasks, Intel says. If these Core i9 X-series chips -- code-named "Basin Falls" -- are too rich for your blood, Intel also introduced three new Core i7 X-series chips, priced from $339 to $599, and a $242 quad-core Core i5. All of the new chips are due "in the coming weeks," Intel said. Most of the Core i9 chips will incorporate what Intel calls an updated Intel Turbo Boost Max Technology 3.0, a feature where the chip identifies not just one, but two cores as the "best" cores, and makes them available to be dynamically overclocked to higher speeds when needed. Detailed story at AnandTech and HotHardware.

From a report on AnandTech: In a bit of breaking news this morning, it appears that Intel has decided to cancel their Intel Developer Forum tradeshow going forward, including this summer's expected IDF17. The company says, "Intel has evolved its event portfolio and decided to retire the IDF program moving forward. Thank you for nearly 20 great years with the Intel Developer Forum! Intel has a number of resources available on intel.com, including a Resource and Design Center with documentation, software, and tools for designers, engineers, and developers. As always, our customers, partners, and developers should reach out to their Intel representative with questions." Previously, Intel had stated that there would not be an IDF in China this year. However an IDF was still expected in the US, albeit with a "new format."

From a report on AnandTech: In a bombshell of a press release issued this morning, Imagination has announced that Apple has informed their long-time GPU partner that they will be winding down their use of Imagination's IP. Specifically, Apple expects that they will no longer be using Imagination's IP in 15 to 24 months. Furthermore the GPU design that replaces Imagination's designs will be, according to Imagination, "a separate, independent graphics design." In other words, Apple is developing their own GPU, and when that is ready, they will be dropping Imagination's GPU designs entirely. This alone would be big news, however the story doesn't stop there. As Apple's long-time GPU partner and the provider for the basis of all of Apple's SoCs going back to the very first iPhone, Imagination is also making a case to investors (and the public) that while Apple may be dropping Imagination's GPU designs for a custom design, that Apple can't develop a new GPU in isolation -- that any GPU developed by the company would still infringe on some of Imagination's IP. As a result the company is continuing to sit down with Apple and discuss alternative licensing arrangements, with the intent of defending their IP rights.

Ian Cutress, writing for AnandTech: Intel's 8th Generation Core microarchitecture will remain on the 14nm node. This is an interesting development with the recent launch of Intel's 7th Generation Core products being touted as the 'optimization' behind the new 'Process-Architecture-Optimization' three-stage cadence that had replaced the old 'tick-tock' cadence. With Intel stringing out 14nm (or at least, an improved variant of 14nm as we've seen on 7th Gen) for another generation, it makes us wonder where exactly Intel can promise future performance or efficiency gains on the design unless they start implementing microarchitecture changes.

An anonymous reader shares an AnandTech report: Thanks to some sleuthing from various readers, AMD has accidentally let the cat out of the bag with regards to the official Ryzen launch date. While they haven't specifically given an exact date, the talk to be given by AMD at the annual Game Developer Conference (GDC) says the following: "Join AMD Game Engineering team members for an introduction to the recently-launched AMD Ryzen CPU followed by advanced optimization topics." The GDC event runs from February 27th to March 3rd, and currently the AMD talk is not on the exact schedule yet, so it could appear any day during the event (so be wary if anyone says Feb 27th). At this time AMD has not disclosed an exact date either, but it would be an interesting time to announce the new set of Ryzen CPUs right in the middle of both GDC and Mobile World Congress which is also during that week. It would mean that Ryzen news may end up being buried under other GDC and smartphone announcements.

An anonymous reader quotes a report from Ars Technica: In the last four or five years, Intel's "Next Unit of Computing" (NUC) hardware has evolved from interesting experiments to pace cars for the rest of the mini desktop business. Mini PCs represent one of the few segments of the desktop computing business that actually has growth left in it, and every year the NUC has added new features that make it work for a wider audience. This year's models, introduced alongside the rest of Intel's new "Kaby Lake" processor lineup at CES, include new processors with new integrated GPUs, but that's probably the least interesting thing about them. Thanks to the demise of Intel's "tick-tock" strategy, the processing updates are minor. Kaby Lake chips include smaller performance and architectural improvements than past generations, and the year-over-year improvements have been mild over the last few years. The big news is in all the ways you can get bytes into and out of these machines. There are two Core i3 models (NUC7i3BNK and NUC7i3BNH), two Core i5 models (NUC7i5BNK and NUC7i5BNH), and one Core i7 model (NUC7i7BNH) -- that last one is intended to replace the older dual-core Broadwell i7 NUC and not the recent quad-core "Skull Canyon" model. The Core i3 and i5 versions come in both "short" and "tall" cases, the latter of which offers space for a 2.5-inch laptop-sized SATA hard drive or SSD. The i7 version only comes in a "tall" version. Like past NUCs, all five models offer two laptop-sized DDR4 RAM slots and an M.2 slot for SATA and PCI Express SSDs (up to four lanes of PCIe 3.0 bandwidth is available). Bluetooth and 802.11ac Wi-Fi is built-in. As for the rest of the NUCs' features, Intel has drawn a line between the Core i3 model and the i5/i7 models. All of the boxes include four USB 3.0 ports (two on the front, two on the back), a headphone jack, an IR receiver, an HDMI 2.0 port, a gigabit Ethernet port, a microSD card slot, a dedicated power jack, and a new USB-C port that can be used for data or DisplayPort output (the dedicated DisplayPort is gone, and this port can't be used to power the NUCs). In the i5 and i7 models, the USB-C port is also a full-fledged Thunderbolt 3 port, the first time any of the smaller dual-core NUCs have included Thunderbolt since the old Ivy Bridge model back in 2012.

Reader joshtops writes: Ars Technica has reviewed the much-anticipated Intel Core i7-7700K Kaby Lake, the recently launched desktop processor from the giant chipmaker. And it's anything but a good sign for enthusiasts who were hoping to see significant improvements in performance. From the review, "The Intel Core i7-7700K is what happens when a chip company stops trying. The i7-7700K is the first desktop Intel chip in brave new post-"tick-tock" world -- which means that instead of major improvements to architecture, process, and instructions per clock (IPC), we get slightly higher clock speeds and a way to decode DRM-laden 4K streaming video. [...] If you're still rocking an older Ivy Bridge or Haswell processor and weren't convinced to upgrade to Skylake, there's little reason to upgrade to Kaby Lake. Even Sandy Bridge users may want to consider other upgrades first, such as a new SSD or graphics card. The first Sandy Bridge parts were released six years ago, in January 2011. [...] As it stands, what we have with Kaby Lake desktop is effectively Sandy Bridge polished to within an inch of its life, a once-groundbreaking CPU architecture hacked, and tweaked, and mangled into ever smaller manufacturing processes and power envelopes. Where the next major leap in desktop computing power comes from is still up for debate -- but if Kaby Lake is any indication, it won't be coming from Intel. While Ars Technica has complained about the minimal upgrades, AnandTech looks at the positive side: The Core i7-7700K sits at the top of the stack, and performs like it. A number of enthusiasts complained when they launched the Skylake Core i7-6700K with a 4.0/4.2 GHz rating, as this was below the 4.0/4.4 GHz rating of the older Core i7-4790K. At this level, 200-400 MHz has been roughly the difference of a generational IPC upgrade, so users ended up with similar performing chips and the difference was more in the overclocking. However, given the Core i7-7700K comes out of the box with a 4.2/4.5 GHz arrangement, and support for Speed Shift v2, it handily mops the floor with the Devil's Canyon part, resigning it to history.