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Sun Working to Eliminate Circuit Boards

lokedhs writes "Sun Microsystems is coming out with new chips without connectors. According to the article, this will have a lot of advantages: 'Performance, for instance, could greatly escalate because the speed of transferring data among chips and the number of channels for the transfers would increase. Energy consumption could also decline. Just as important, overall costs could fall, because defective chips could be removed like Scrabble tiles.' This technology will also lead to new CPU's without cache: 'The technique could also allow designers to remove the cache--the large pool of memory currently found on the processor--and put it on a separate chip. Caches were integrated onto processors to amplify bandwidth. Adding cache, however, bumps up manufacturing costs, as it greatly increases the number of transistors. With the bandwidth constraint gone, caches could once again be made independent without it having an impact on performance.'"

349 comments

  1. eh? by the_2nd_coming · · Score: 1, Insightful

    so basically they want to stack the chips? umm, heat?

    --



    I am the Alpha and the Omega-3
    1. Re:eh? by cuzality · · Score: 5, Funny

      so basically they want to stack the chips? umm, heat?

      They should get together with Pringles or Lays -- they've both been doing this for a while...

    2. Re:eh? by wronskyMan · · Score: 2, Informative

      It appears some people have managed to implement chip stacking for faster RAM among other things (check out the prototype pix).

      --
      --- You shall know the truth, and the truth shall make you mad- Neal (not Cowboy) Boortz
    3. Re:eh? by neilmoore67 · · Score: 4, Interesting

      so basically they want to stack the chips? umm, heat?

      It has to be said, I think that if Sun are seriously thinking of producing such chips then it must be a moderately good idea (they're not monkeys after all), so I wouldn't write it off on the basis of heat concerns.

      --
      You've probably noticed that people's noses get bigger as they get older. That's because old people are huge liars.
    4. Re:eh? by PaintyThePirate · · Score: 1

      Ram doesn't generate much heat, so it can be stacked without cooling. Current CPUs are giving off over a hundred watts, and by the time this technology comes along, it will be much more than that. I suppose that one large waterblock could cover the CPU, cache chip, northbridge, southbridge, etc if they were next to each other. If they were stacked, it would be much more difficult.

    5. Re:eh? by Anonymous Coward · · Score: 0

      Wondering if this is basically trying to copy the thunder of Silicon on Chip (SOC) concept on mobile devices... Think Infenion, Think Texas Instruments, is it now Think Sun?.....
      Multiple processors and related peripherals on a single chip is Nothing *new* for mobile environment, only kinda difference sun wants to make is to server/workstation/destop environment!

    6. Re:eh? by Total_Wimp · · Score: 4, Informative

      so basically they want to stack the chips? umm, heat?

      Re-read article. It's not a stack. They make reference to scrabble tiles as a comparison.

      Even if it were a stack liquid cooling built directly into the stack, ala the internal combustion engine, could handle the heat effectively. Probably more effectively then our current heat sink technology.

      TW

    7. Re:eh? by Anonymous Coward · · Score: 2, Funny
      They should get together with Pringles or Lays

      As long as they don't bring olestra into the mix.

    8. Re:eh? by andreyw · · Score: 1

      I was more thinking of a patchwork of chips, sandwiched in-between two metal plates, for grounding and cooling purposes.

    9. Re:eh? by Gilk180 · · Score: 1

      This isn't at all what they are trying to do. It is the exact opposite. Sun is trying to create a technology that raises the bandwidth the processor has with the outside world to the point that things like cache can be REMOVED from the chip, not added to it.

      The immediate effects would be smaller on-chip caches and faster communications between processors on multi-processor machines.

    10. Re:eh? by Anonymous Coward · · Score: 0

      SOC stands for "System on a Chip" and thousands of embedded systems companies you and I have never even heard of with names that translate to somethinkg like like Golden Bridge or Everlasting Sun design SOC systems every day. I think your analysis may be missing something.

    11. Re:eh? by njcoder · · Score: 3, Insightful
      Sometimes I think Sun could announce they found an affordable and easily accessible cure for cancer and the slashdot crowd would harp on them for contributing to the overpopulation problem.

      They have 5-6 years to work on this whole idea. Every once in a while, people have to go into completely different directions. The engineers at sun are not idiots. Do the people on here actually believe that they're not going to deal with these types of problems that are mentioned here?

    12. Re:eh? by Phisbut · · Score: 1
      Sometimes I think Sun could announce they found an affordable and easily accessible cure for cancer and the slashdot crowd would harp on them for contributing to the overpopulation problem.

      Are you saying that overpopulation is good??? Cause if you are... ... ... *annoyed grunt*

      --
      After 3 days without programming, life becomes meaningless
      - The Tao of Programming
    13. Re:eh? by Timothy+Brownawell · · Score: 1
      It has to be said, I think that if Sun are seriously thinking of producing such chips then it must be a moderately good idea (they're not monkeys after all), so I wouldn't write it off on the basis of heat concerns.
      Unless, of course, they're doing it to try to live up to their name... but then just think how cool a stack of white-hot chips would look...

      Tim

    14. Re:eh? by chunkymunky · · Score: 1

      "but then just think how cool a stack of white-hot chips would look..."

      yeah, not very!

      not even a waffer thin fan, mr creosote?

    15. Re:eh? by Anonymous Coward · · Score: 0

      Yes. As a matter of fact, everyone who works for Sun is a stupid idiot, and so are you for believing their lies.

      Please, just die or something.

    16. Re:eh? by fitten · · Score: 1

      Could we then put a bunch of them in a big ball full of water with some small nativity type scene in it and shake it like a Snow Globe while it's running? :)

      Or... how about putting a bubbler in there with something more viscous than water and watch it like a lava lamp? :)

      Or... can I have them in my fish tank where I can watch the fish swim and compute at the same time? :)

  2. Heat... by MojoRilla · · Score: 3, Informative

    With so many chips so close together, they are certainly going to have heat problems.

    Interesting technology, thought.

    1. Re:Heat... by SatanicPuppy · · Score: 4, Insightful

      Heat is solvable with next generation cooling (i.e peltier or cryo...or just a really big freaking fan) but the performance increase will have to validate the extra effort.

      The great thing about circuit boards is that they're cheap and easy to replace, so the maintenance gains they're talking about are not as great as they claim. It's also a VERY well understood tech; Sun takes a substantial risk by going in a totally different direction. It will be interesting to see how it plays out.

      --
      ad logicam Claiming a proposition is false because it was presented as the conclusion of a fallacious argument.
    2. Re:Heat... by Xenobane · · Score: 0

      You could always leave your pringles in open air.

    3. Re:Heat... by hcetSJ · · Score: 2, Informative
      They mention this (although they don't really address the issue):
      One of the chief difficulties in developing the technology comes from the environment where computer chips live. Heat and vibration in this environment can cause chips to get out of the precise alignment needed for proximity communication. Sun is currently tinkering with different techniques and different packages to prevent, or correct, these effects.
      --

      This side up.
    4. Re:Heat... by networkBoy · · Score: 1

      Heat is solvable with next generation cooling (i.e peltier or cryo...or just a really big freaking fan)


      The peltier is not cooling at all. It is only heat transfer (as opposed to dissapation). While it may present a cool surface to the chip, that won't last long at all. Cryo is impractable, as is air over heatsinks(you'll need a heatsink big enough that it would obviate the size gains from the elimination of the PCB. Which leaves us with water cooling. This has been successfully employed by several major manufacturers (CRAY, NEC) for super computers. Just my 2c
      -nB

      --
      whois gawk date unzip strip find touch finger mount join nice man top fsck grep eject more yes exit umount sleep dump
    5. Re:Heat... by essreenim · · Score: 1

      Although Im not really interesste in DARPA's ambitions here, (they ultimately just want to beat the Japanese who have come ahead of them with their NEC based supersomputer) Im not sure of why they are focussing on cache. The end performance gain is surely not as great as it would be if you could develop say for example a true optical bus and permanent data store. For example, Lenslett (an Israeli company developed an optical processor but it has to be used in tandem with circuit board bus etc.

    6. Re:Heat... by Anonymous Coward · · Score: 0

      These are sparcs we're talking about. They don't go that fast and thusly don't produce as much heat.

    7. Re:Heat... by upsidedown_duck · · Score: 1

      With so many chips so close together, they are certainly going to have heat problems.

      It's still a 2-D plane (I think), so it's nothing that a long heatsink and case fans can't handle.

      --
      -- "Makes Little Debbie look like a pile of puke!" - Moe Szyslak
    8. Re:Heat... by upsidedown_duck · · Score: 1

      Heat and vibration in this environment can cause chips to get out of the precise alignment needed for proximity communication.

      My car just uses large screws and spacers to maintain alignment, I'm sure CPUs can use the same tried and true technology.

      --
      -- "Makes Little Debbie look like a pile of puke!" - Moe Szyslak
    9. Re:Heat... by SILIZIUMM · · Score: 1

      Mabye I don't see it, but isn't water cooling some form of heat transfer too ? Just like fans are sucking hot air out (can we say heat transfer too?) ?

    10. Re:Heat... by shufler · · Score: 1

      Then they'll go stale.

    11. Re:Heat... by Googo · · Score: 1

      However, as you stack chips, you'll have to hope that the heat generation is on the outer edges of the chips and not in the middle otherwise there would probably be a nice large buffer area with which the heat generation may be faster than heat removal causing the chips to still burn up.

    12. Re:Heat... by fikx · · Score: 1

      This gets rid of circuits (removing an extra piece) instead of replacing it with somethign else. If I read the article right, chips talk to each other directly without having to physically touch a wire. no wires needed. The only hard part is the chips have to be physically close to each other and stay there. If they can figure out a way to hold 'em still (like how tiles are held in a scrabble board) that is as cheap or cheaper than printed circuits, then they've got something better. Seems do-able to me, and the benefits are great.

      --
      AB HOC POSSUM VIDERE DOMUM TUUM
    13. Re:Heat... by RickL · · Score: 3, Interesting

      Perhaps the chips could interlock like puzzle pieces. This has an additional advantage of increasing the surface area, potentially allowing even more signals.

    14. Re:Heat... by johnhennessy · · Score: 4, Interesting

      Heat is really only a by-product of the problem. The main problem is power consumption. If you have a big enough fan you can cool anything (within reason) but who is going to buy a CPU that sucks 1KW (which is the way the power issues are leading).

      FYI: The power issue is only going to get worse at smaller geometries.

      Roughtly: Power = Switching Power + Leakage Power + Others.

      The two we are interested in here is the Switching Power and the Leakage power. Up until now Switching power has been the greedy party, but when geometries shrink down to 90nm and below, leakage power really kicks in.

      IBM and AMD have done some nifty stuff with strained silicon and silicon on insolutor to try and reduce the leakage power (and therefore the heat).

      So heat really will not be solved by just taking it away faster - because there's a whole lot more of it lurking around the corner, to fix the heat issue, you have to fix the cause not the symptom.

      --
      [ Monday is a terrible way to spend one seventh of your life. ]
    15. Re:Heat... by Psycho77 · · Score: 1

      I can imagine 2 devices, that you put close to each other, and the cpu dont know which memory use =P

    16. Re:Heat... by stephentyrone · · Score: 1

      They're focusing on cache because cache sucks. Half the transistors on a modern processor are devoted to cache; get the cache off the chip, and you can shrink your die size, increase yield, and do everything much cheaper. A modern graphics processor, for example, has about the same transistor count as a modern CPU, but no cache at all; as a result, it's raw processing power is greater (but it spends more time on data access).

    17. Re:Heat... by HokieJP · · Score: 1

      Circuit boards are cheap and easy to make, but I don't buy that they are easy to replace. Since almost everything is surface mounted to the board, the chips are non-trivial to remove. Thus, it's generally cheaper to replace the whole thing.

      If your northbridge or southbridge goes bad today, you buy a new mainboard. In this respect, eliminating the circuit board would be an improvement if you could just replace the chip that failed.

    18. Re:Heat... by GunFodder · · Score: 1

      "Have you tried staples?"

    19. Re:Heat... by Smidge204 · · Score: 1

      Oh, the components are actually very easy to remove. Much easier wth surface mount than with the old solder-through types. Just get yourself a good paint scraper or a wide chisle and you'll have a nice clean PCB in a few minutes!

      =Smidge=

    20. Re:Heat... by newpath4com · · Score: 0

      Seems like they could construct the chips with numerous little open channels running thru, sort of like a ant farm. In fact, I believe the ants design their hives for that very purpose, cooling. So if these new chips were riddled with these interconnected cooling "pipes" then a forced air system pushing/pulling air thru the chip would do a magnificent job, and UNIFORM. Whatever it takes to make my engine work is okay usa by me! www.newpath4.com/icyhot.htm Peltier and heat sinks on the outside would round out the solution. Of course, if someone with their THINKING CAP on was to add a tiny refrigeration unit to pre-cool the air flow... hehehe there would be an interesting speed change from the air going IN to the air going OUT as the air molecules would be expanding to get th hell out the other side. Would be both active AND passive cooling then. A pulling fan on the exhaust side would be preferred over a pushing fan; the fan morot oops motor wouldn't heat the incoming air that way. The molecular expansion of the cooling air could actually be used to drive a tiny turbine assembly that would power the system, sort of like a closed loop cannibal but no one would do that because it reeks of perpetual motion... but IT IS NOT. It is simply using the heat energy gain from the hot chips as the Power Source of the cooling system, that's all. Another way of using the chip's heat energy would be to turn a tiny generator that would generate extra current to power the chip, greatly extending the new PC's battery life. Or an alternator, whatever. Yeah. Chips supplying their own power after initial crank up WOOD BE REALLY COOL. Signed, Woody Riley Just send me the royalty check care of my ex!

    21. Re:Heat... by tedgyz · · Score: 1

      I'll admit, I did not RTFA. With that out of the way, I can think of some really cool (heh) cooling concepts.

      I'm guessing, instead of 10s or 100s of pins, the chips will have 2-8 pins for power. What if they designed a standard power socket that is watertight. Then, immerse your scrabbleboard of chips directly into your non-conductive, cooling fluid.

      --
      "No matter where you go, there you are." -- Buckaroo Banzai
    22. Re:Heat... by Anonymous Coward · · Score: 0

      If your northbridge or southbridge goes bad today, take out the heat gun, dial in the appropriate amount of heat, grab ahold of the chip, and carefully heat up the chip until the solder balls melt and the chip comes off.

      Guys at work do this all the time for surface-mount stuff. I was shocked myself when I saw it, as I was told the same thing, surface mounts are impossible to remove.

      I think the removed chip is pretty much worthless after that though so you'd better be damn sure that's the problem.

    23. Re:Heat... by HokieJP · · Score: 1

      Good point, but at the end of your operation, you have a motheboard that's missing a chip. You kinda forgot step 2. Given that you just said that the procedure tends to destroy the chip, I don't think one can just reverse it to put the new chip on.

  3. Oversimplified by Anonymous Coward · · Score: 2, Interesting

    This idea has merit, but the explanation is oversimplified. Moving the cache 2 centimeters from on top of the processor to a separate chip may be feasible, but it will increase latency (increasing the number of clockcycles a cache fetch takes and re-affirming a need for an on-chip cache to cache the "cache"). Other applications of this technology (like the fact that any part with issues can be easily replaced) seem more relevant.

    1. Re:Oversimplified by Anonymous Coward · · Score: 0

      I'm thinking the tech moves the cache a bit less than 2cm to the side - I'm thinking more like .1mm *down*. At a minimum, there will probably be the equivalent of a couple gates of delay, but the point is to have a exceptionally wide bus to mitigate the extra delay.

      The IBM series POWER5 MultiChipModule (MCM) shows what you need to do if you have seriously large caches (36MB of cache per core). Think of this tech as the poor-man's equivalent of that approach.

    2. Re:Oversimplified by maraist · · Score: 5, Interesting

      Shouldn't be a problem.. Have you seen the latency on modern Cache implementations? We're already at a BEST case of 2 clock delays with minimal concurrency. We're seeing 8 and even 16 clock cycle delays for L2 / L3 caches. Cache has always been hierarchical.. The lowest latency is always very small.. What this technology provides is effectively extraction of L2 cache with the complete transparenc y of adding L3 cache.. Think 128Meg L3 cache 8Meg L2 cache; something completely impractical for regular general CPU design.. Since you can "upgrade" your cache by replacing a peer-chip, now you can pay-as-you-go.. Spend a thousand dollars a year, upgrading one cache chip at a time.. And we've seen what's happened with the SDRAM market once commodetized. Pretty soon SDRAM may dissapear completely, being replaced by (albeit high power) gigabyte SRAM L4 modules.

      If cost effective, and if they can get past the alignment issues, this is spectacular.

      --
      -Michael
    3. Re:Oversimplified by upsidedown_duck · · Score: 5, Funny

      Since you can "upgrade" your cache by replacing a peer-chip, now you can pay-as-you-go.

      Wow, were back to my old 386 PC!

      --
      -- "Makes Little Debbie look like a pile of puke!" - Moe Szyslak
    4. Re:Oversimplified by Anonymous Coward · · Score: 0

      The point of the parent post wasn't that this technology was bad, it was that you'll never eliminate on-chip cache. On-chip cache will always be expensive, unupgradeable... ...ultra-fast, and totally necessary.

      I do agree that this paves the way for upgradeable L2/L3 caches, however, and I also agree about how exciting that is.

    5. Re:Oversimplified by Salsaman · · Score: 3, Insightful

      My interpretation of the article is that it suggests that it could do a bit more than what you discuss. With such technology you could read much larger chunks of data at a time. Rather than being limited to 32/64/128 bit data, you could have a huge data bus. So you are not just reducing the latency, you are also increasing the throughput of the system.

    6. Re:Oversimplified by Anonymous Coward · · Score: 0

      Now that's weird. I've been looking through the processor optimization manuals provided by both Intel and AMD, and they both state that they both have supported hit-under-miss functionality in their L1 cache subsystems since the sixth generation of x86 cores (i.e. PPro, P2, P3, K6). Of course, being an in-order retire architecture, you can only run so many instructions before the cache miss catches up with the instruction window... I suppose Intel is trying to patch this sort of thing up with HyperThreading (giving a second instruction stream, thus allowing _some_ execution even under a terrible, horrible cache miss).

      Also, think of how many tag bits you're going to spend with a 128 megabyte L3 cache, even if you make it direct mapped instead of set-associative. Or even just the 8-meg L2 cache. From what I've been told, some of the really sick HPPA chips (you know, the ones with a total of 32 megabytes or so of inclusive cache stacked in two levels, on-chip?) have an obscenely long latency even if you get a hit from the L2 cache. (Though I'll admit that those chips are obviously intended for many-ways multiprocessor systems with a hub topography to the local node's SDRAM, making an obscenely big high-latency L2 cache a reasonable proposition...)

  4. Without connectors? by magefile · · Score: 0

    Pedant mode on:

    They want chips without connectors to communicate with each other? Is that even possible?

    This post brought to you by the Slashdot Association of Pedants.

    1. Re:Without connectors? by hparker · · Score: 5, Informative

      Think of it as lots of itty bitty low power radio transmitters and receivers.

      Sounds clever to me. Electrical engineers have been constantly fighting unwanted interference in their circuits. Now they will be listening for it.

    2. Re:Without connectors? by interiot · · Score: 4, Informative

      The article mentions "capacitive coupling". Here is the relevant WikiPedia entry, and here's a paper on the specifics at Sun.

    3. Re:Without connectors? by pjcreath · · Score: 2, Funny
      Electrical engineers have been constantly fighting unwanted interference in their circuits. Now they will be listening for it.

      ...as will your friendly neighborhood competitor, spy organization, etc. And you thought the Tempest effect was bad.

    4. Re:Without connectors? by interiot · · Score: 2, Informative
      A summary....

      Multiple communications channels between chips can be used. Each channel uses an individual pad slightly embedded in each chip, and the pads in each chip have to be physically aligned to some extent. This has two advantages... because the pads are done on-die and not outside the chip, the pads can be two orders of magnitude smaller than external pins. Also, the pins are protected from electrostatic discharge. The summary at the end of the article says:

      • Our 350nm CMOS test chip demonstrates 16 channels operating simultaneously, each communicating pseudo random patterns at a rate of 1.35 Gbps, for an aggregate bandwidth of 21.6 Gbps.
      In other words, it looks pretty viable...
    5. Re:Without connectors? by WormholeFiend · · Score: 3, Funny

      I work in a Faraday Cage, you insensitive cl... err... you insightful... uh...

    6. Re:Without connectors? by DnsZero · · Score: 0
      They want chips without connectors to communicate with each other? Is that even possible?


      That's the whole point of the fsckin article! Holy shit, how did that get modded informative?

      Oh... Equal Oppoturnity Employment strikes slashdot! See, we've got "special" people just like McDonalds.

      Only we don't make BigMac sauce out of 'em.
    7. Re:Without connectors? by Googo · · Score: 1

      If it were lots of itty bitty radio transceivers, I would expect alot more interference than from pcb traces.

    8. Re:Without connectors? by pclminion · · Score: 1
      Think of it as lots of itty bitty low power radio transmitters and receivers.

      It isn't like that at all. Try using a capacitor plate as an antenna. Doesn't work too well, does it?

      This technique uses electric fields to couple signals without using wires. That's all. There is no antenna, there is no carrier wave, there is no modulation scheme. It's a capacitor. And we've used capacitors to couple oscillating signals for nearly a hundred years. It's called a "high pass filter."

      The only thing that makes this story interesting whatsoever is the fact that they can produce so many of these things in such close proximity to each other and align them so perfectly.

    9. Re:Without connectors? by memmel2 · · Score: 1

      Umm sounds likes they need
      stochastic resonance man to the rescue !!

      Seriously stochastic techniques may be very useful here especially to help with the alignment problem.
      <p>
      If they add a little noise to the system then it will be less susceptable to misaligment. Think of a bunch of tuning forks sitting around a piano as a two year old jumps up and down on it while your playing bach by very lightly hammering the strings.

      Mike

  5. Wireless Communcation by Anonymous Coward · · Score: 4, Interesting

    What they need, instead is VioletTooth (wireless chip-to-chip communcations). That way, they won't have to worry about alignment problems and such!

    1. Re:Wireless Communcation by kpansky · · Score: 2, Insightful

      Im pretty sure thats nothing like what we need. We have protocols for short range RF communication that dont require careful alignment of the transmitter and receiver. Thats old hat. But to do what sun and other companies are proposing you would require a few dedicated chips for every few connections between individual components. The advantages of requiring alignment is allowing very low power since you dont need a strong signal and not requiring any sort of arbitration. Sort of like whispering a question to your neighbor in a classroom instead of raising your hand, waiting, and asking the professor what the last word of the last slide was.

      --

      --Kevin
    2. Re:Wireless Communcation by upsidedown_duck · · Score: 1

      What they need, instead is VioletTooth (wireless chip-to-chip communcations).

      It would be amusing to open up a computer case to see miniature microwave transmission towers on each chip with little now-sterile gnats who got fried while resting on the dish.

      --
      -- "Makes Little Debbie look like a pile of puke!" - Moe Szyslak
    3. Re:Wireless Communcation by Asic+Eng · · Score: 1
      It's an interesting thought - however if all these "pins" are transmitting in parallel, how do you tell one bit apart from the other?

      Imagine you have a 32bit data bus - in every single clock cycle, each of the 32 pins can change their state. If you receive a 0 from one pin, and a 1 from the other, how do you tell them apart?

      You can solve the problem by putting the data into a frame, building a checksum and discarding the frame - but that only helps if frame collisions are rare, if every single frame has collisions (which would be frequent in the data bus example) that won't work.

      So you can switch to less frames at the same time - but then you can just put the transmitters a bit further apart, and you don't need the protocol overhead.

      Also if you add a protocol layer to the communication, you need some sort of bit sequence, just to transfer a single piece of data (e.g. id1, id2, id3, data). You can use bursts (first the id, then a number of data bits) but you must add some overhead.

      An alternative approach might be to use different frequencies for the transmitters. E.g. if you have 4 different frequencies you'd assign these alternatingly to neighbouring pins: pin1 = f1, pin2 = f2, pin3 = f3, pin4 = f4 and then pin5 = f1, pin6 = f2 etc.

    4. Re:Wireless Communcation by kpansky · · Score: 3, Informative

      The solution to these problems are simple: you make the transmitters low enough power that they dont interfere with each other. From the Sun document I believe that the total power of each individual transmitter was on the order of 1-10 picojoules. That is precisely the reason alignment is such a prime concern - if the chips shift you have the wrong transmitters talking to the wrong receiver.

      --

      --Kevin
    5. Re:Wireless Communcation by stienman · · Score: 1

      That way, they won't have to worry about alignment problems and such!

      Yeah, instead they can worry about interference and remote listening.

      -Adam

    6. Re:Wireless Communcation by Y2 · · Score: 1
      The solution to these problems are simple: you make the transmitters low enough power that they dont interfere with each other.

      TANSTAAFL. Lower transmitter power means more sensistive receivers, which means more sensitivity to the "wrong" transmitter as well as the "right" one.

      From the Sun document I believe that the total power of each individual transmitter was on the order of 1-10 picojoules.

      Er, check those units. Picowatts, perhaps?

      That is precisely the reason alignment is such a prime concern - if the chips shift you have the wrong transmitters talking to the wrong receiver.

      I'm imagining/speculating a learning cycle, sort of a lower-level POST, during which each chip learns which path leads to what neighboring I/O channel. Press the big reset button and get a really deep reset!

      --
      "But all your emitter and collector are belong to me!"
    7. Re:Wireless Communcation by GunFodder · · Score: 1

      That's right, now that your processor is prone to Van Eck phreaking even your computer has to wear a tin-foil hat!

    8. Re:Wireless Communcation by slorge · · Score: 1

      all I can see in this discussion is a cardboard box with a bunch of chips thrown in it. monitor, keyboard, mouse, speakers, etc all wireless, too. Makes the job of a pc tech real easy. Show up onsite with the new chip, open the box and fish around until you find the chip you need to replace, like a junk drawer. upgrade your ram? just throw it in the box.

      --
      Some people are like slinkys. They're useless, but it puts a smile on your face to push them down the stairs.
  6. Didn't say to get rid of circuit boards by Anonymous Coward · · Score: 4, Informative

    Did you even read the article before posting it here. The article talked about eliminating the pin that is used to house the chip. Due to the size of the pins, it limits the number of I/O paths a chip can expose to the motherboard. Instead they can implement transmitter/receivers using capacitive inductence to increase the I/O paths a chip can expose. Thereby increasing the bandwith a chip can utilize.

    1. Re:Didn't say to get rid of circuit boards by Anonymous Coward · · Score: 2, Funny
      You mean this article?

      "There is a huge need for higher-bandwidth kind of chips," Robert Drost, a senior researcher at Sun Labs, said at an open house last week. "Rather than have the chips soldered onto a printed circuit board, the printed circuit board is taken out of the system."

    2. Re:Didn't say to get rid of circuit boards by Anonymous Coward · · Score: 0

      Of course they didn't read it. It's a long-revered slashdot tradition that the australopitheceines chime in first with FUD: "they won't be able to dissipate the heat," etc. *sigh* "News for Nerds?" Unfortunately, that isn't 90% of our audience.

    3. Re:Didn't say to get rid of circuit boards by networkBoy · · Score: 5, Insightful

      implement transmitter/receivers using capacitive inductence


      Ha! That's the funniest mis-use of electronics terms I've seen in quite a while.
      Yeah I know this is OT/FB but what the hell.
      -nB

      --
      whois gawk date unzip strip find touch finger mount join nice man top fsck grep eject more yes exit umount sleep dump
    4. Re:Didn't say to get rid of circuit boards by Anonymous Coward · · Score: 1, Funny

      It is strikingly funny. Makes me wonder if they were planning a flux capacitive coupling.
      Moreover if capacitance and and inductance have opposite signs then would a capacitive inductance coupling be manifestly real (1/j *j =1)? If it is purely real can it transmit information?

    5. Re:Didn't say to get rid of circuit boards by Anonymous Coward · · Score: 0

      Capacitive inductance, hmm
      isn't that what a wire is?

    6. Re:Didn't say to get rid of circuit boards by Lord+Ender · · Score: 1

      With no pins, how do the chips get pwer? Or will it be EM powered, like RFID tags?

      --
      A slashdotter who didn't build his own computer is like a Jedi who didn't build his own lightsaber.
    7. Re:Didn't say to get rid of circuit boards by bobthemuse · · Score: 1

      Ha! That's the funniest mis-use of electronics terms I've seen in quite a while. Yeah I know this is OT/FB but what the hell.

      How about a better explanation, for those of use that haven't studied EE? What do the terms mean, and why is it funny when they're put together?

    8. Re:Didn't say to get rid of circuit boards by Anonymous Coward · · Score: 1, Informative

      Capacitance and inductance are inverse properties of electronic devices. You can have either one, the other, or neither (in the case of purely resistive devices). Having both would be analagous to rotating both clockwise and counterclockwise. (?!)

    9. Re:Didn't say to get rid of circuit boards by beswicks · · Score: 4, Insightful

      I'm guessing the joke in that in terms of EE, capactiance and inductance are kind of opposites of each other. Because:

      An indutcotor, is like a heavy train, it takes time to get it moving, but when it is moving it takes time to change it. So it is very good at blocking AC signals (they try to move back and forward at high speed, ie constantly changing) but passing DC.

      A capacitor is like a condom, you can fill it, and empty it but you cannot go through it, however it is possible to pass an alternating signal to your partner though it during sex. So they are good at passing AC signals and blocking DC.

      God, I hope thats the right way round.

    10. Re:Didn't say to get rid of circuit boards by Milancu · · Score: 1

      I think we don't know yet what the real coupling mechanism is, but I believe that the author meant "capacitive induction", which is ambiguous but not incorrect.

      "if capacitance and and inductance have opposite signs then would a capacitive inductance coupling be manifestly real (1/j *j =1)?"

      Magnetic or inductive coupling hasn't necessarily a 90 degrees phase deviation, actually it is often rather "in phase" (real). The same is true for capacitive coupling (for instance, if you take a ceramic capacitor, hold it in the air, and apply a constant voltage referenced to earth to one lead, you can immediatelly sense that voltage on the other lead, as long as you don't take charge out from this second lead).

      Furthermore, in common circuit design, when you want to couple an AC signal and block the DC component, signal is transferred almost without attenuation / phase change as long as this golden rule is respected: "the impedance of the capacitor at the desired signal frequency must be much lower than the impadances in series with it". And yes, you get voltage and current passing through the capacitor, both in phase, and power transferr is acomplished.

    11. Re:Didn't say to get rid of circuit boards by Beryllium+Sphere(tm) · · Score: 1

      There's no need to be so reactive. The phrase really resonated with me.

      In fact, the distinction is imaginary anyway.

      Stop! Put down that phasor!

    12. Re:Didn't say to get rid of circuit boards by fatphil · · Score: 1

      I don't know what to believe in that article - it is quite poorly researched:
      "
      Unfortunately, the pins are rather large to be electrical and mechanical devices. Only a few hundred fit on a package that contains a processor with several million transistors. Bandwidth, thus, is constrained.
      "

      A few hundred? Explain why IBM manage to get more than five _thousand_ pins on their POWER packages.

      FP.

      --
      Also FatPhil on SoylentNews, id 863
  7. Sun developed something? by zaqattack911 · · Score: 4, Funny

    I figured Sun would have laid off their entire R&D department by now :)

    Love,
    Zaq

    1. Re:Sun developed something? by marol · · Score: 0

      Judging from the article, this is just something the marketing department dreamed up anyway.

    2. Re:Sun developed something? by nekoniku · · Score: 3, Funny

      You misplet SCO.

      --
      "It's a wonderful idea. But it doesn't work." -- Tad Danielewski
    3. Re:Sun developed something? by Jahf · · Score: 3, Interesting

      Actually Sun has traditionally stocked R&D even when everything else is tight as McNealy feels the best way to come out of a slump is fighting. On that I'll give him credit ... though alot of other decisions have been flaky lately.

      --
      It is more productive to voice thoughtful opinions (reply) than to judge (moderate) others.
    4. Re:Sun developed something? by Anonymous Coward · · Score: 0

      I think Sun spends more money on R&D than most other companies (which some Sun execs have a problem with, but McNealy insists on)

    5. Re:Sun developed something? by Crazy_MYKL · · Score: 2, Informative

      You misspelled "misspelled".

      --


      <jedi> There is something funny here. You laugh. </jedi>
    6. Re:Sun developed something? by Anonymous Coward · · Score: 0

      You misspelt "irony".

    7. Re:Sun developed something? by Anonymous Coward · · Score: 0

      Nah... I'm still here, although not really R'ing or D'ing, but just reading Slashdot! Plus, I know quite a few others R+D fellows around, too; most of who also mostly spend their time reading Slashdot. Funny, that. I don't know the guys who have time for chip design, though; maybe that's an outsourced group?

    8. Re:Sun developed something? by Anonymous Coward · · Score: 0

      you misspelled "i'm a jackass with no humor"

    9. Re:Sun developed something? by Anonymous Coward · · Score: 0

      You misplet misplet :)

    10. Re:Sun developed something? by Anonymous Coward · · Score: 0

      You leave my daughter out of this!

      -John Pelled

    11. Re:Sun developed something? by Anonymous Coward · · Score: 0

      Nice tpyo.

  8. Anyone watch Stargate? by vaderhelmet · · Score: 2, Funny

    This wireless chips integrated for a purpose thing reminds me of Replicators

    Either way, I'm thrilled and spooked.

    1. Re:Anyone watch Stargate? by Anonymous Coward · · Score: 0

      Stargate? Yeah. All Sun has to do is to hire MacGyver away from the SG-1 team. He could make circuit board-less computers out of aluminum foil and paper clips.

    2. Re:Anyone watch Stargate? by andreyw · · Score: 1

      Yes, but the difference is that you won't have to deal with your computer chewing up everything around in order to propagate itself...

  9. Um...who repairs motherboards anymore? by xxxJonBoyxxx · · Score: 3, Insightful

    Um...who repairs motherboards anymore? At around $100 a pop, most people just get a new one.

    If there's a high-end application for this technology, great, but getting rid of high-end hardware is one of the biggest reasons people are also getting rid of Sun...

    1. Re:Um...who repairs motherboards anymore? by mduckworth · · Score: 3, Insightful

      When things get old they become irreplaceable. I guarantee some mainframe in some bank or something out there somewhere has someone regularly soldering to it ;-) In many cases people repair the motherboards of their old rare computers like Atari's and Amigas. People repair motherboards, but people have a tough time repairing today's technology due to the size. It presents a challenge even to my $200 soldering iron. And I bet you a lot of manufacturers do bother to repair components that come back one way or another - despite the fact that the end users aren't doing the work.

    2. Re:Um...who repairs motherboards anymore? by Baby+Duck · · Score: 1

      "It's never too late to reinvent yourself" -- Pet Shop Boys

      --

      "Love heals scars love left." -- Henry Rollins

    3. Re:Um...who repairs motherboards anymore? by Flying+Purple+Wombat · · Score: 1

      Forget the $200 soldering iron, it doesn't help if you can't see the parts to begin with. My 40 year old eyes just can't deal with SMT components. Even a magnifier doesn't help anymore.

      My opthamologist says it's time for bifocals, maybe that will help.

      --
      If God had meant for man to see the sunrise, He would have scheduled it later in the day.
    4. Re:Um...who repairs motherboards anymore? by kpansky · · Score: 1

      This isn't about repairing motherboards. Actually its about replacing them. Think of the AMD 64. It has a memory controller built in for speed because there aren't enough physical connections to attach a second chip and have it have enough bandwidth. With this, the entire surface of the chip could be filled with thousands of transmitters. Basically, a motherboard is just an extension for the processor so that it can talk with its other important peripherals. Its a bit of an oversimplification, but basically this tech will eventually allow the motherboard to be slowly merged into the individual components.

      --

      --Kevin
    5. Re:Um...who repairs motherboards anymore? by xxxJonBoyxxx · · Score: 1

      If the transition away from motherboards would be "slow" and, as AMD is showing us, there are already other ways to achieve similar benefits with motherboards, why do you tout this tech as a "replacement" for motherboards?

    6. Re:Um...who repairs motherboards anymore? by andreyw · · Score: 1

      Some things are possible to repair - for example, shitty electrolytic capacitors that have blown/about-to-blow.

      I had a bank of electrolytic caps in my 3Com Hub give up the ghost. Thankfully I could find higher-Temp rated ones in the junk I desoldered from a dead CRT.

    7. Re:Um...who repairs motherboards anymore? by kpansky · · Score: 1

      This would be a replacement because more and more of a processor is not "processing". Its largely cache and now starting to do these ancillary functions. All these additions, yes, improve performance. That is at the cost of silicon space. Since the silicon must be perfectly free from defects for a good chip to be produced, the larger the chip the more likely that there will be unpreventable manufacturing defects.

      This is the real issue. If you could break processors into smaller parts, you could dedicate more space to processing data and control circuitry to make that processing more efficient. That is what motherboards do, but at the cost of slow or shared communication with the other chips due to the lack of available connections and thus bandwidth. This technique avoids those problems. It has its own problems, but every technology has its strengths and weaknesses.

      --

      --Kevin
    8. Re:Um...who repairs motherboards anymore? by Total_Wimp · · Score: 1

      Um...who repairs motherboards anymore?

      If there's a high-end application for this technology, great, but getting rid of high-end hardware is one of the biggest reasons people are also getting rid of Sun...


      Actually the article references a big supercomputer bakeoff in 2010. Supercomputers would most definately count as a high-end application where motherboards would be worth repairing, especially if it was a simple procedure and the cost was low, as Sun is proposing this would be.

      TW

    9. Re:Um...who repairs motherboards anymore? by Delphis · · Score: 1

      Do you have too much time on your hands? :)

      --
      Delphis
    10. Re:Um...who repairs motherboards anymore? by andreyw · · Score: 1

      No, I was just really pissed off to come back from school only to realize that none of the four computers in my room had Internet connectivity,

  10. Space by SunCrushr · · Score: 4, Interesting

    One thing is for sure. If they can get this to work and if heat production can be cut down, this would make computing equipment and electronics much smaller. The printed circuit board is one of the big things holding us back from much better electronics miniaturization.

    1. Re:Space by doctormetal · · Score: 3, Insightful

      One thing is for sure. If they can get this to work and if heat production can be cut down, this would make computing equipment and electronics much smaller.

      That is why this kind of technology is used in embeded systems for years. Stack EEPROM and RAM on eachother in one housing to save space.

    2. Re:Space by svirre · · Score: 1

      That is just regular die to die bonding in a multichip module.

      The new thing here is to communicate only through capacative coupling avoiding having to place a huge pad and drivers for it (500-2000um^2 each). Additional bonuses is that you avoid exposing the die to the stresses of the bonding machine, you gain speed as there is much less capacitance and inductance to fight with, and possibly you can achieve a cheaper assembly method.

      Modules with dies communicating this way will propably not be a end user assembly. The assemblies will still be made in a cleanroom.

  11. 10-pt tiles? by !splut · · Score: 5, Funny

    Just as important, overall costs could fall, because defective chips could be removed like Scrabble tiles.

    With my luck I'll get a dead Pentium Z or Q that I just can't get rid of.

    --
    The angel in the oatmeal.
    1. Re:10-pt tiles? by cuzality · · Score: 0, Redundant

      With my luck I'll get a dead Pentium Z or Q that I just can't get rid of ...

      All I got is two 'M's and an 'X'...

    2. Re:10-pt tiles? by Anonymous Coward · · Score: 0

      With my luck I'll get a dead Pentium Z or Q that I just can't get rid of.

      By Zarquon, if only names counted in Scrabble!

    3. Re:10-pt tiles? by weeboo0104 · · Score: 1

      You should have upgraded to the new Quijibo chipset.

      --
      It is easier to build strong children than to repair broken men. -Frederick Douglass
    4. Re:10-pt tiles? by korbin_dallas · · Score: 1

      Hmm, so would a QUIJIBO be a 'Super' computer?

      Or just illegal?
      Or also illegal?

      --
      They Live, We Sleep
    5. Re:10-pt tiles? by shawn(at)fsu · · Score: 1

      At least your be better off than the poor soul who gets a blank...

      --
      500 dollar reward for tip(s) leading to the arrest of the person(s) who stole my sig.
    6. Re:10-pt tiles? by yodaj007 · · Score: 1

      Um, yes, I'd like to buy a vowel.
      'A', please.

      Do I get extra points for playing all seven tiles to the board?

      --
      These aren't the sigs you're looking for.
    7. Re:10-pt tiles? by Inode+Jones · · Score: 1

      MaXiMuM

      You'll need to use a blank for that one.

    8. Re:10-pt tiles? by Inode+Jones · · Score: 1

      Yes, you get a 50 point bonus for using all seven.

      In competitive Scrabble circles, this is called a "bingo" in North America, and a "bonus" in the U.K.

      The highest scores arise by playing all seven tiles through another tile such that two triple word score squares are covered simultaneously. You get the tile values, multiplied by 9, plus 50. You can easily score 149 or more points for a single word this way.

    9. Re:10-pt tiles? by Inode+Jones · · Score: 1

      You need to learn the short Q and Z words.

      For a Q with no U, try any of:

      QAT, QAID, QOPH, QINDAR QINTAR, QANAT, SHEQEL, QWERTY, SUQ, UMIAQ. These are all nouns, and with the exception of SHEQEL, all take an S at the back. The plural of SHEQEL is SHEQALIM. Also, QINDAR takes an alternate plural QINDARKA.

      For a Z, you need to know:

      ZAX, ZEK, ZOA, AZO, FEZ, LEZ, BIZ, WIZ, FEZ, FIZ, ZIN, ZIT, ZOO

      And then MOZO, ORZO, ZOON, ZARF, ZERK, ...

      The real problem is that there are no two letter words containing Q or Z (yet). The same can be said for C and V.

      The foregoing applies to the Official Club and Tournament Word List used in North America. In most of the rest of the world, clubs and tournaments use the union of the North American list and the Official Scrabble Words used in Britain. For those locales, you are permitted to play many more words than I have listed here.

      The North American list is available to members of the National Scrabble Association; an expurgated version can be purchased at your local bookstore in the form of the Official Scrabble Players Dictionary (OSPD).

      With the next release of the OSPD, QI and ZA are expected to be allowed, making the Z and Q much easier to play.

    10. Re:10-pt tiles? by fatphil · · Score: 1

      ZO has been in the dictionary, even small ones, for decades. It's like a yak.

      The more important issue is when WIPQOZN is going to be added to the scrabble dictionary?

      FP

      --
      Also FatPhil on SoylentNews, id 863
  12. Prime Intellect? by enyalios · · Score: 4, Interesting

    Wow, this announcement reminds me of an awesome book I just read: http://www.kuro5hin.org/prime-intellect/mopiidx.ht ml

    1. Re:Prime Intellect? by cuzality · · Score: 2, Funny

      Wow, this announcement reminds me of an awesome book I just read: http://www.kuro5hin.org/....

      kuro5hin link on slashdot? Go fark yourself.

    2. Re:Prime Intellect? by mr_jrt · · Score: 1

      Bah, you beat me to it. It's a great story....well worth the read. ...just need Sun to sort out those dimensional conduits now... ;)

      --
      Boo.
    3. Re:Prime Intellect? by ThePuD · · Score: 0

      i thought the same thing. great book. though, i wish the technology was as advanced as the one described in the book, which uses a "correlation effect" to instantly communicate between transistors by using some kind of intereference between particles at the subatomic level. I take that back, the capcative thing is much better. that way the supercomputers we build with it can't change the mechanics of the entire universe to better implement the three laws.

  13. So now we must wrap the whole computer in tinfoil? by ion_ · · Score: 1

    The technology, called "proximity communication," aims to let one chip transmit signals directly to another next to it, instead of through the tangle of pins, wires and circuit boards employed today.

    So all the communications inside the computer will be implemented with radio waves? It will be even easier for them to eavesdrop all the extremely secret activities I use my computers for. Naturally I cannot tell you what they are, but they are related to a certain Internet service that - under a legitimate- and innocent-looking cover, of course - is designed to harm certain people by making their servers catch fire as well as making their bandwidth bill increase unbelievable amounts.

  14. isolinear chips?? by Anonymous Coward · · Score: 0, Flamebait

    Sounds like the isolinear chips in Star Trek. It is amazing that an idea that was once science fiction is now coming to reality.

    1. Re:isolinear chips?? by Anonymous Coward · · Score: 0
      1. It doesn't sound like the isolinear chips from Star Trek; Nothing sounds like the isolinear chips from Star Trek, because "isolinear chips" is just a bit of meaningless gobbledy-gook made up to sound cool to the dim.
      2. There's nothing amazing about the idea of science fiction ideas becoming reality. It happens with some frequency.
      3. You are a complete tool.

      Hope this helps! Bye!

  15. Power by pjrc · · Score: 3, Insightful
    Something that's probably been lost in the engineer -> marketing -> journalist translation is the need for power to be supplied to the chips.

    Most likely, the capacitive coupling of signals is only targeting chip to chip data signals, not the supply of power to the chips.

    1. Re:Power by Anonymous Coward · · Score: 0

      Two thumping great pads on the bottom of the chip, one for in, one for out. As there are no pins, space on the chip package won't be a problem. As long as the power supply is kept clean, it won't interfere with the capacitive links.

    2. Re:Power by kpansky · · Score: 1

      I think it would be awesome to have the "chip clip". Think of an semi auto magazine with power rails. You slide the chips in like bullets, power it up, and then watch the thing melt itself from the power dissipation.... oh well. Still would be cool to have an "AK-2004" mod computer.

      --

      --Kevin
    3. Re:Power by Kiryat+Malachi · · Score: 2, Insightful

      Clean power supply in an environment with gigahertz switching is a hilariously funny joke, especially when you move off a lab supply (which the Sun guys were almost certainly using) and into the real world with real power supplies.

      Also, there are EMI issues with the specific arrangement you mentioned (side by side pads) relating to something called inductive loops. The skin effect would basically say that all of your highfrequency currents would return along the edges of your big pads, leaving a big loop area which in turn leads to high inductance and large amounts of electromagnetic interference. Better design practice is to have small power pads, where each seperate section of the chip has its input and output placed physically close together in order to minimize loop area.

      --

      ---
      Mod me down, you fucking twits. Go ahead. I dare you.
      (I read with sigs off.)
  16. Even better! by Saeed+al-Sahaf · · Score: 4, Funny

    And in other news, scientists are developing a computer with no electronic parts at all!

    --
    "Who are in control, they are not in control of anything - they don't even control themselves!" - Glen Beck
    1. Re:Even better! by cinnamon+colbert · · Score: 1

      If memory serves, in the 80's, the DoD was developing analog or digital computers based on hydraulics, for fighter planes, so the planes computer capability could survive the emp from a nuclear blast

    2. Re:Even better! by Saeed+al-Sahaf · · Score: 1

      very small tubes and EMP shielding...

      --
      "Who are in control, they are not in control of anything - they don't even control themselves!" - Glen Beck
    3. Re:Even better! by Flying+Purple+Wombat · · Score: 1

      Back in the '70 and '80s, my father was working with "air logic" - computers based on pneumatics. He was doing the work for the DoD, but I don't know the exact application.

      --
      If God had meant for man to see the sunrise, He would have scheduled it later in the day.
    4. Re:Even better! by AJWM · · Score: 1

      Fluidics. Fluid (hydraulic or pneumatic) logic circuits. Actually a rather simple form of such is found (or used to be) in automobile automatic transmissions, to control shifting.

      They tend to be bulky, require a fair bit of power to keep the fluid circulating, and a bit of a pain to assemble (multiple planes with the paths and logic elements cut out). OTOH, with recent advances in micromachining, we may see such more widely used. A processor that can operate in extreme environments (heat of a jet engine or furnace, high radiation, etc) can come in handy.

      --
      -- Alastair
    5. Re:Even better! by haruchai · · Score: 1

      I remember seeing an article a long time ago in one of the american science magazines about an attempt to make microscopic vacuum tubes to replace electronics in hostile environments, especially ones with very high radiation.
      Don't know what came of it as I never heard about it
      again.
      IIRC, this would have been around '93 or so.

      --
      Pain is merely failure leaving the body
  17. Observations from a prototype lab... by drakyri · · Score: 2, Interesting

    Eliminating connectors also removes a problem that pops up in microchips - without connecting wires, you don't have most of the parasitic capacitances that crop up on chips. A capacitor is anything with two metal contacts, so wires (especially parallel wires) cause very small capacitances, usually in the order of several picofarads. The problem is that on microchips, the capacitor values that are being used are generally in that range too, so parasitics can be very problematic.

    Heat transfer is also a problem, but I'm not convinced that it would be so different from current heat considerations. The heat should still spread through the chip, regardless of connectors, and dissapate on the chip's surface. Whether they get overly ambitious with stacking these chips is another question.

  18. Capacitive coupling by Anonymous Coward · · Score: 0

    Does anybody know of any good explanations of how or why capacitive coupling works?

    Also, how close do these chips have to be to each other? Could there be enough of a gap to allow something to cool them down?

    1. Re:Capacitive coupling by slew · · Score: 1

      Basically, capacitive coupling between components is just 1 "plate" of the capacitor is on one device and the other "plate" is on the other device, so if you draw a circuit diagram, it looks like a capacitor in series in the circuit (AC-coupled). The energy/signal is transmitted by one "plate" charging up (or discharging) and having the resultant electric field cross the gap and cause the opposite charge build up on the other side. Since the plates are finite sized and will eventually charge up to the point where you can't detect a difference on the other side, you can't really send a low frequency (stationary) signal across the gap so there is some sort of signal coding being done (which is some overhead on bandwidth).

      Depends on lots of details of the design (e.g. detectable signal-to-noise ratio, interference rejection, desired bandwidth, dielectric permativity, etc) to say how close the "plates" have to be to each other, but my guess is if they want to be really-really close to get the best bandwidth and the lowest signal interference since you want this to be a viable replacement for pins (which is the electromagnetic signal being sent down a metal waveguide which tends to reduce interference instead of broadcasted using an electric field to cross a gap which will tend to broadcast and pickup interference).

      As for things that transmit heat, but don't interefere with electric fields, this is not an easy problem. Most things that conduct heat well also conduct or at least distort electric fields meaning they would probably interfere with the capacitively coupled signal. Also, without good heat conductors, disapation usually requires lots of area (which is something this technique was trying to save).

    2. Re:Capacitive coupling by pclminion · · Score: 1
      Does anybody know of any good explanations of how or why capacitive coupling works?

      Similar charges repel. Thus, if you put two plates very close to each other, and charge one of them up, the resulting electric field will repel the charges in the other plate.

      It's exactly how any other capacitor works. I don't see what's so confusing about this.

  19. Sun by Anonymous Coward · · Score: 0

    What is that property of photons where they some how join then split them and what ever happens to the one will happen to the other, even if it is on the other side of the universe? I don't see why people aren't using this for a mode of communication or to replace wires. But anyway, all this r&d is just going to negate any savings that the "cheaper" chips would have, and there would defiantly still be a way to secure it, otherwise every time someone bumped into your desk you would blue screen.

    1. Re:Sun by pclminion · · Score: 1
      What is that property of photons where they some how join then split them

      That's parametric downconversion

      and what ever happens to the one will happen to the other, even if it is on the other side of the universe?

      That's entanglement, although you're description isn't exactly accurate. Both photons collapse from a superposition into the same quantum state.

      I don't see why people aren't using this for a mode of communication or to replace wires.

      What is the point? There's no particular advantage to it, and it requires fairly advanced equipment. If you're thinking "faster than light" communication, think again. It's not possible, even with entanglement.

  20. Heat? Naw. Here's some better problems. by Arethan · · Score: 4, Insightful

    Dust & dirt. I would imagine that at such low voltage levels, induced current would require a damn near perfect level of alignment between the chip and the "socket". This is admitted in the article. What they don't admit is that it's going to be nearly impossible to get the damn thing in the socket without letting dust or dirt inbetween the chip and the socket.

    And a more interesting topic is their consistent mentioning of taking the cache of the chip. That's a nice dream and all, but where the hell are you going to put it then? Hardwired onto the motherboard? That's going to dramatically increase the cost of mobo's (so they are simply shifting who gets to eat the high sticker price on their products). And what if I buy a quad capable mobo, but only put 2 processors on it, I'm effectively wasting 2 sets of cache, rather than simply wasting 2 cpu sockets, and the sockets are a hell of a lot cheaper than the cache. I suppose you could fix this by going back to COAST (cache on a stick, yeah i know you remember that nasty stuff). But that brings in a whole new problem: These days, cache is only fast because it's so close to the cpu. If they move it off the die, it's just going to be put back on in 2 years because we can't access the cache fast enough ever since we moved it off the die.

    I'm no super computer engineer, but these guys better have an entire family of rabbits they plan on pulling out of their asses or this fucker's gonna flop.

    1. Re:Heat? Naw. Here's some better problems. by Anonymous Coward · · Score: 3, Insightful

      This is probably a fabrication tool - You buy a CPU that happens to be made from a handful of chips stacked and bonded together instead of the current monolithic silicon crystal you currently get. When you assemble it, you still have the contemporary packaging, its just that the manufacturer gets to do a bit more fine tuning with the manufacturing.

      For example, they might be able to tune a process to give higher yields on the cache and have a second process for the logic. Less broken chips, more stuff to sell, and possibly cheaper chips in general.

      Still, I bet this would first be tested out on some of the "big iron" CPU's. Its an extra step, and on cheap commodity CPU's like X86, it seems like a difficult cost to justify. Chips with multi-megabyte caches on the other hand...

    2. Re:Heat? Naw. Here's some better problems. by kpansky · · Score: 3, Interesting

      The thing is cache latency is still for the most part pretty huge. With pipelines as deep as they are, the cache needs to be really huge to prevent stalls that will totally obliterate performance. Now, if you are able to separate the cache physically while not being restricted in the bandwidth between the external cache and processor by a lack of physical pins and the need for arbitration from other chips (the reason why external cache was so terribly slow) by using capacitive connections, well... the game has changed substantially.

      A lot of the reason CPUs have become more and more integrated is simply due to the fact that connecting multiple chips together is the simple fact that there are not enough connections available to keep them separate _and_ fast.

      --

      --Kevin
    3. Re:Heat? Naw. Here's some better problems. by upsidedown_duck · · Score: 5, Interesting

      I would imagine that at such low voltage levels, induced current would require a damn near perfect level of alignment between the chip and the "socket".

      Well, if they invent a very good self-aligning mounting socket, dirt can be dealt with just by being very careful and using one of those air-in-a-can dusters. This technology would be very expensive, initially, so you could even get one of Sun's guys to come out and do it for you.

      That's a nice dream and all, but where the hell are you going to put it then?

      I'd bet they put it nowhere. L2 and L3 caches are a kludge, and, if they really achieve huge chip-to-chip bandwidth, they just might not need the cache hierarchy. This is reminiscent of old CPUs, where the system RAM ran at an acceptably large fraction of the speed of the CPU, so there was no L2 cache at all.

      --
      -- "Makes Little Debbie look like a pile of puke!" - Moe Szyslak
    4. Re:Heat? Naw. Here's some better problems. by addaon · · Score: 1

      Mod parent up. It's an interesting, and probably accurate, idea.

      --

      I've had this sig for three days.
    5. Re:Heat? Naw. Here's some better problems. by Asic+Eng · · Score: 1

      I think you'd have to do the placement in a clean room - just as you would with chip dies today. The article is so short on details, it's hard to tell whether they have no solution yet for all the interesting problems, or whether they just don't want to give it away.

    6. Re:Heat? Naw. Here's some better problems. by Anonymous Coward · · Score: 0

      No cache is hyper optimistic, but the alignment should be that big of a deal, just have the mobo transponders running a chip test that only works if the cpu is optimally placed while micromotors adjust the mounts.

      I'm more curious how big the capacitors that are doing the inductive transmission are relative to cpu pins or Intel's cpu bumps.

    7. Re:Heat? Naw. Here's some better problems. by Anonymous Coward · · Score: 0

      They will most likely make these as a matched assembly. One processor die matched with a cache die mounted face to face in the chip package. This would possibly allow a segmented cache that talks directly to different logic sections of the CPU. This would also greatly icrease yields by shrinking die sizes and separating the testing of the cache from the CPU. You could bin cache units and CPU's indipendantly rather than on the worse characteristic of the combination.

    8. Re:Heat? Naw. Here's some better problems. by dfj225 · · Score: 2, Insightful

      "I'd bet they put it nowhere. L2 and L3 caches are a kludge, and, if they really achieve huge chip-to-chip bandwidth, they just might not need the cache hierarchy. This is reminiscent of old CPUs, where the system RAM ran at an acceptably large fraction of the speed of the CPU, so there was no L2 cache at all."

      To me, it would seem like some sort of cache would still be needed. As I understand things, even if a slow bus was eliminated, it still takes the RAM much longer to look up data than the CPU is capable of reading at. Now, of course one could always use high speed memory like they use for the cache, but this kind of memory is so much more expensive than normal RAM that I doubt it will ever be feasable to have a computer's main memory comprised entirely of very fast cache-like memory.

      --
      SIGFAULT
    9. Re:Heat? Naw. Here's some better problems. by Anonymous Coward · · Score: 0

      You make a good point. Probably some but not all cache would be moved off-chip. Speed-of-light limitations mean you want to keep L1 cache on the chip, near where the data's going to be used. L3 and maybe L2 can go off-chip, where other advantages can be used. Those advantages are: higher yields for a pair of medium sized chips than a single large chip, and different process optimizations for RAM and CPU.

    10. Re:Heat? Naw. Here's some better problems. by Fished · · Score: 3, Insightful

      Dust & dirt. I would imagine that at such low voltage levels, induced current would require a damn near perfect level of alignment between the chip and the "socket". This is admitted in the article. What they don't admit is that it's going to be nearly impossible to get the damn thing in the socket without letting dust or dirt inbetween the chip and the socket.

      It's called a clean room dude, and it's distinctly Old Tech. Granted, this will cut into the vision of pushing this out into the hands of field engineers, but I suspect that Sun is visualizing a "processor assembly" that will plug into an otherwise conventional motherboard. Perhaps in the distant future, that might change, but not now. What this ends up meaning is that they have two separate fabs making smaller chips rather than one fab making gigantic chips. It is much easier to make three or four small chips without errors than one huge chip, so they get higher yields for their processors. This means that they can produce a "processor assembly" with some ridiculous amount of cache and 8 cores for a much lower price than would be possible with conventional tech.


      And a more interesting topic is their consistent mentioning of taking the cache of the chip. That's a nice dream and all, but where the hell are you going to put it then? Hardwired onto the motherboard?

      The whole point of this tech is to directly connect the cache to the processor without putting it on chip. No, it won't be on the MoBo. Instead, it will be on the "processor" - but the "processor" will have multiple chips in it.


      I'm partially speculating here, but I bet that's what's on their mind.

      --
      "He who would learn astronomy, and other recondite arts, let him go elsewhere. " -- John Calvin, commenting on Genesis 1
    11. Re:Heat? Naw. Here's some better problems. by upsidedown_duck · · Score: 1

      As I understand things, even if a slow bus was eliminated, it still takes the RAM much longer to look up data than the CPU is capable of reading at.

      This might be where Niagara enters. This is Sun's newer CPU architecture that has 8 4-thread cores in one package (IIRC). Keep enough threads going at once, and on-chip thread switching and Solaris' (or Linux') kernel thread scheduler keep memory latency at bay. Single-thread performance would be mediocre, but the system would scale really well.

      --
      -- "Makes Little Debbie look like a pile of puke!" - Moe Szyslak
    12. Re:Heat? Naw. Here's some better problems. by Atario · · Score: 1
      This technology would be very expensive, initially, so you could even get one of Sun's guys to come out and do it for you.
      Hmm. Oh, I know -- they could attach the pinless connector to an easy-to-mount package the home user could deal with. Something with a bunch of pins that go in little holes or something.
      --
      "A great democracy must be progressive or it will soon cease to be a great democracy." --Theodore Roosevelt
    13. Re:Heat? Naw. Here's some better problems. by akuma(x86) · · Score: 1

      I'd bet they put it nowhere. L2 and L3 caches are a kludge, and, if they really achieve huge chip-to-chip bandwidth, they just might not need the cache hierarchy. This is reminiscent of old CPUs, where the system RAM ran at an acceptably large fraction of the speed of the CPU, so there was no L2 cache at all.

      L2 and L3 caches are not a kludge. They work to reduce average latency of loads and stores. You can solve the bandwidth problem with better interconnects, but on-die caches will still be there for latency reduction.

    14. Re:Heat? Naw. Here's some better problems. by upsidedown_duck · · Score: 1

      L2 and L3 caches are not a kludge.

      They are there only to address imperfections in the storage media, not as a part of the fundamental design of the computer. I'd bet CPU designers would love to be able to throw out the caches entirely and address main memory with no middle-men. Cache is to CPUs as connection pools are to databases or as JavaScript is to interactive websites (a means to an end, but not the ideal path).

      --
      -- "Makes Little Debbie look like a pile of puke!" - Moe Szyslak
    15. Re:Heat? Naw. Here's some better problems. by akuma(x86) · · Score: 1

      They are there only to address imperfections in the storage media, not as a part of the fundamental design of the computer. I'd bet CPU designers would love to be able to throw out the caches entirely and address main memory with no middle-men. Cache is to CPUs as connection pools are to databases or as JavaScript is to interactive websites (a means to an end, but not the ideal path).

      I understand what you're saying, and I can tell the you probably have a CS and/or Math background. Your comment makes sense in a highly idealized abstract sense, but you can't idealize away things like the laws of physics.

      You see, the speed of light can only travel about 3 centimeters in a nanosecond. Latency is fundamentally limited by the speed of light. You can't get better than that unless all of the laws of physics we have discovered are wrong.

      There are fundamental physical limits to computer design. I suggest reading "The Physics of Information Technology". Look it up on google and/or amazon etc...

  21. Won't work? by Anonymous Coward · · Score: 0

    AMD has put their memory controller on the CPU. Wouldn't that be a step towards reducing the cache needed with mismatching Bus Frequency and Memory Speed?

    Cache isn't what I aim to remove from the equation. My aim is to remove latency through the integration of both the North and South bridge onto the CPU. Then lets remove all the bus frequency and caches in that fashion.

  22. supercomputer use by Anonymous Coward · · Score: 0

    This is a pretty nifty idea really, near as I can decipher it. The idea of a supercomputer is a lot of chips, all grinding away at a complex problem. Two approaches are currently used. This concept would seemingly let you do both, and mix or match on demand to fit the situation. It would also I guess let you use normal (well, wireless enabled) ram for the remote cache.

    1. Re:supercomputer use by Anonymous Coward · · Score: 0

      god, what an asshole you are.

  23. Re:So now we must wrap the whole computer in tinfo by networkBoy · · Score: 1

    Ah!!! So you must work for Gator!
    -nB

    --
    whois gawk date unzip strip find touch finger mount join nice man top fsck grep eject more yes exit umount sleep dump
  24. Dupe by jdb2 · · Score: 5, Informative

    This was posted back in September of last year :

    http://slashdot.org/articles/03/09/22/1055244.shtm l?tid=102&tid=137&tid=187

    jdb2

  25. Wrong by brufleth · · Score: 1, Informative

    It uses capacitance links to communicate instead of a direct wire. "Radio waves" aren't used. Two wires near (depends on currents, frequencies, etc. and in this case we're talking about microns) each other can have effects on each other as if they were linked when operating at high frequencies. Remember that a capacitor looks like a wire at high frequencies and essentially two wires next to each other are connected by a capacitor.

    1. Re:Wrong by maraist · · Score: 4, Informative

      Just to clearify to the un-initiated. It is the exact same technique that allows CMOS transistors to work (the basis of most CPU transistors).

      CMOS-FET = Complementary Metal Oxide Semiconductor - Field Effect Transistor

      That's semiconductors separated by oxide (oxidized silicone or glass) to allow fields derived from differing voltages on either side of the glass to affect conductivity and thereby provide actuatable signals. All this new system does is replace the Oxide with something else; namely the walls of the outside of the chip and the unavoidable air-gap.

      Obviously this alternate medium is not as efficient as normal hyper-thin glass, BUT it's more efficient than transferring physical electrons from silicon to copper and amplifying it such that you can induce a measurable current down the coppy wire several centimeters away. More-over, it's more practical to etch micro-wire paths on the edge of a chip than to manually pin-punch chips like we do today. We can make such signal points smaller and more articulate.

      The ONLY problem (as outlined in the article) is keeping these micro-signals aligned.. If you're off by even half a capacitive cell, then you're fields aren't going to be strong enough, and depending on cell-spacing, you're likely to generate noise to adjacent cells.

      --
      -Michael
    2. Re:Wrong by DraconPern · · Score: 2, Informative

      Alignment is not a problem. You can use automatic cell matching using a reconfigurable IOB. What you need is an array of cells that has more cells than signals, eg, extra cells on both ends. Then set the chips together, and initialize the entire cell array with an alignment pattern (eg. a pattern that has no repeated sequences. The two chips can then read the other chip's pattern and use that information to determine which cells correspond to which signal. You will of course need to have extra cells both horizontally and vertically.

    3. Re:Wrong by HokieJP · · Score: 1

      I call BS.

      That's semiconductors separated by oxide (oxidized silicone or glass) to allow fields derived from differing voltages on either side of the glass to affect conductivity and thereby provide actuatable signals. All this new system does is replace the Oxide with something else; namely the walls of the outside of the chip and the unavoidable air-gap.

      First of all, it's "silicon" for god's sake. Second of all, a capacitor and a transistor aren't the same at all! How are you going to dope the air between two conductors with an N or a P channel?

      BUT it's more efficient than transferring physical electrons from silicon to copper and amplifying it such that you can induce a measurable current down the coppy wire several centimeters away.

      This just doesn't make any sense. The signals are carried on metal when they're inside the chip! Ok, you need to amplify them to take them off-chip, but metal is your primary signal carrier no matter what.

      More-over, it's more practical to etch micro-wire paths on the edge of a chip than to manually pin-punch chips like we do today.

      What do you mean manually pin-punch chips? The wires between the chip and package are spun by a machine, and (if it's soldered at all) the package is soldered onto the board by another machine! Do you really think someone is sitting their manually punching hundreds of pins on millions of CPUs?

    4. Re:Wrong by Anonymous Coward · · Score: 0

      Hunh?

      While we're at it, lets just make the chips out of organic material and grow the connections together using modified stem cells and lizard DNA.

      I want what you've been smoking.

    5. Re:Wrong by maraist · · Score: 1

      While I wasn't completely careful, I don't believe BS is in order.

      Second of all, a capacitor and a transistor aren't the same at all! How are you going to dope the air between two conductors with an N or a P channel?

      I don't see how you can say this.. A Field Effect transistor functions on the principle of the capacitive effect. Yes the NPN/PNP junctions are a separate operation, but the basis of controlling them is through capacitance. Likewise, it is my understanding that the basis of this communication mechanism is fields. All that capacitance needs is a dialectric to inhibit direct current, so what's the problem here? The chips can use non-conductive contact points.

      The signals are carried on metal when they're inside the chip!

      Certainly, but metal does not conduct through semiconductors directly efficiently. The aluminum/copper contact points have several layers of composites to provide a gradual change in material (band gap) condusive to the flow of electrons.

      Every contact point is a discontinuity which causes reflection (noise), and every bend of the metal causes phase shifting (more noise). Thus what I was trying to say (though you are correct in that what I wound up writing is confusing), is that routing the contacts out to an end of the chip and traferring to ever larger contact points until finally reaching the massive external pins, then physically contacting PCB contacts that travel several centimeters, then reversing the process is likely to be a longer trip than a non-conductive purely-field based effect. Yes it's possible that routing the signals through to the capacitive contact points could have their own deficiencies possibly even worse than running outside with standard wires; but my initial impression is that it's a cleaner design.

      Do you really think someone is sitting their manually punching hundreds of pins on millions of CPUs?

      You misunderstood what I meant by "manual".. This implied mechanical operation.. Which a machine by definition does.. This is as opposed to the etching process which is infinitely more precise. The soldering process is one of the main reasons for my above ranting about using external wires. It represents a large reflection point due to non-uniform material.

      --
      -Michael
  26. Pump and Dump? by Anonymous Coward · · Score: 0

    OK, I did not read the announcement, but it sure has the ring of incredulity. It sounds like Sun is desparate for some uplifting press. This faces so many fundamental obstacles it's not even funny. When the printed circuit board came out, the prediction was that it would eliminate connectors. We may stack a few chips, printed circuit boards aren't going away nor are connectors.

    1. Re:Pump and Dump? by Anonymous Coward · · Score: 0

      I'm wearing the Ring of Incredulity, you insensitive clod!

      In case you didn't notice, the entire chip industry changed a few years back from edge-pin packages to ball-grid arrays in order to work on these same problems: higher speed, and higher interconnect counts. So yes, massive changes in chip packaging do happen, and the driving forces are mostly the processor folks.

  27. Re:So now we must wrap the whole computer in tinfo by Anonymous Coward · · Score: 0

    I would worry more about devices that purposefully introduce noise in the same bandwidth your cpu uses to do I/O. Some one could make your computer crash/freeze/hang on command. Or at the very least tamper with it's performance.
    Faraday, may your cage will protect us!

  28. Not enough info by Drewser · · Score: 0

    This article didn't explain a whole lot to me, it was too high level. I was wondering if anyone could explain how using radio waves form one chip to another does not require extra hardware (for transferring and receiving) and if this technology would be more susceptible to interference?

    1. Re:Not enough info by kpansky · · Score: 1

      This doesn't use RF waves (that would mean they were EM waves with frequency in the radio spectrum) per-se. Rather it uses the same effect you can see illustrated with a balloon and someone's hair. Take the balloon and rub it on a shirt and hold it near the hair. The hair should start lifting up to try and touch the balloon even if it never touches it - sending a signal. Also note how it only works when the balloon is really close to the hair and not on the other side of the head. Basically think of that. Not the same thing from a EM perspective as this tech uses since that is static charge, but it is still capacitive and illustrates to a layman how the concept works.

      --

      --Kevin
  29. Same speed need? by grunt107 · · Score: 2, Interesting

    With this connectivity, there would seem to be a need to standardize CPU chip speeds. Otherwise, a multi-CPU system w/disparate chip speeds would need a sophisticated register design to allow the faster chips to 'idle' while the slow one occupies a needed memory address.

    If designed, however, this could allow admins to assign quickie chips to the OLTP (or DSS batch loads @ night) systems, and the slower CPUs to the less intensive tasks (like sys admin).

    1. Re:Same speed need? by Daniel+Ellard · · Score: 1
      It's no coincidence that Sun is also working on "clockless" chips.

      --
      Disclaimer: I work for a company, but I don't speak for them.
  30. Security by nxcho · · Score: 3, Insightful

    Wow. It will be even easier to bug a computer, just drop a survailiance device in it, or near it (preferably with a small flashing led on it, to the Mission Impossible soundtrack).

    --
    When asked why, the answer is almost always: "It's 2014".
    1. Re:Security by Mateito · · Score: 1

      > It will be even easier to bug a computer, just
      > drop a survailiance device in it, or near it

      And how are you going to interpret the signals? Humm?

      The idea is to replace the physical pins with capacitive coupling in order to _increase_ the desity. Ok, so we are already talking about several hundred pins on a modern CPU. If this technology works, that will jump up to a solid thousand. Then you start stacking them.

      So, even if your radio could detect a signal designed to be picked up by an adjacent recieve mere millimetres away, inside a computer case shielded to prevent external interference, it would pick up a mix of several thousand signals, all driven at a multiple or sub-multiple of the system clock and thus unable to be separated by frequency.

      How the hell are you going to get a decodable signal out of that??

    2. Re:Security by nxcho · · Score: 1

      Imagine the mother board(heap) as a stack or a grid of chips, then open your computer and count the number of chips in it (then add a few, it is in the future after all), it wouldnt actually be hard to sneak some kind of survailance device in it (at least easier than to solder a chip onto someones motherboard).
      But it all was a joke anyway.

      --
      When asked why, the answer is almost always: "It's 2014".
    3. Re:Security by pclminion · · Score: 1

      It's actually much easier to listen to signals if they travel through wires. With a wire, there is an actual current flowing over a significant distance, which means the magnetic field of that current will be detectable over a fairly big area. It is true that capacitive coupling produces a very small "displacement current," which isn't a real current but is just a way of describing the effect of electromagnetic induction, but the resulting magnetic field will only exist over a very small region.

  31. The original Green color by phoxix · · Score: 0, Offtopic
    1. Re:The original Green color by Anonymous Coward · · Score: 0

      I know it was offtopic but thanks for the trick, this grey crap is soooo ugly and hard to read. I'd mod you back up if I had any mods points left.

  32. EE obsolete? by Sandman69 · · Score: 1

    Are any of the EE's out there scared about their jobs becoming obsolete? Everything is going to be single chip solutions, not to mention moving away from electronic design into light-wave design ... I just hope I can hold on long enough and retire before any enormous changeover occurs ..

    1. Re:EE obsolete? by Anonymous Coward · · Score: 0
      Uh, isn't this article talking about new R&D in EE!?!


      IMHO it's good to see that there's still some EE work being done.


      The whole field was almost maturing to the point it was turning into assembly-line-manufacturing (layout another chip, ho-hum); or, worse, sorftware-like-programming (verilog, etc).


      It's nice to see that RF stuff is important now.

    2. Re:EE obsolete? by slew · · Score: 1

      I recall how some EEs became dismayed at the advent of each generation of new packaging technology (e.g. moving from DIPs to surface mount technology or ball-grid arrays), and each chip integration step (e.g. gates to MSI to LSI to VLSI to SOC) as being the end of the line and signalling obsolesence, but strangely that never happened and even more EEs are required today than yesteryear and the problems seem to be getting harder too...

      Assuming you studied EE and don't just have an orcad board layout tool class completion certificate, I wouldn't be worried. Electrons in some sense are just lower frequency phonons instead of photons... The principles are the same, although the engineering is a bit different it's all just like RF stuff and off-the-shelf EEs have managed to do RF since the 40's... Engineering is mostly a matter of putting together well understood components to solve a problem, that doesn't change if the components are chips connected by wires or isolinear chips connected by optical fibre.

      But having said that, I'm hoping to retire before quantum transistors become prevalent. That seems like a pretty big nut to crack as opposed to capacitively or optically coupled packaging options. That whole "if you look at it, it will change" aspect of quantum makes me wonder how anything will get debugged. Hooking up the active low-cap Tek scope probe on the board or looking for photon emissison by hot electrons on a chip isn't gonna cut it in the quantum world, but I digress...

      Anyhow...

    3. Re:EE obsolete? by Anonymous Coward · · Score: 0

      Nope... There are always stuff that needed to be done to connect parts at a system level.

      Chip vendors typically constrainted themselve to be thinking at component level. There are vendors that goes the extra mile to the system level (eg. Intel, IBM etc) Things are rarely as simple as they think at the board or system level.

      At the end of the day, there are always power supplies, hardware/software decisions, project management, manufacturing concerns that needs the insight of an engineer.

  33. Lasers? by Asprin · · Score: 1


    Seems like all that capacitive coupling would cause heat and e/m interference problems. Why couldn't you use LED lasers and sensors built onto the chips to optically couple adjacent chips through a simple optical connection? Each side of a square package could have a laser transmitter and a receiver so it could communicate with up to four adjacent chips. Dust in the sensors would be a problem. So would misaligned components. But, that would do the same thing, no?

    Just wondering 'cause, you know, I got nothin' better to do with my morning than armchair-crituique the designs of ACTUAL EEs who know what they are doing. ;)

    --
    "Lawyers are for sucks."
    - Doug McKenzie
    1. Re:Lasers? by ZoolTheNinja · · Score: 2, Insightful

      Well.... You can do that. And you can have a lot more than four interconnects per chips. However the "simple optical connections" are anything but simple. Look into (forgive the pun) photonic switching fabrics for more info. Cray Inc. is looking into optically coupled chips for their Cascade project (DARPA supercompute-off). Sun just thinks capacitive coupling is the way to go. As far as the heat goes... it doesn't generate as much heat as real connections, as little or no current is flowing.

  34. [OFFTOPIC] Explanation of 503s? Post here by Anonymous Coward · · Score: 4, Interesting

    Well, this is offtopic, but there's no place to discuss the problems Slashdot has been experiencing, so why not here? If the admins won't provide an appropriate forum, we have no other choice.

    Does anyone have any idea what's going on here? I can't be the only one who wishes for a front-page story explaining why Slashdot is so amazingly unreliable and broken lately--especially for subscribers who are paying $ for this service.

  35. More than one or two chips by Anonymous Coward · · Score: 2, Interesting

    If you stack chips, then each chip can only communicate with chips right next to it (am I wrong?) So you'd be able to communicate directly with 2-6 chips, otherwise the chips would have to relay through each other, like a daisy chain. Hopefully none of them would break that communication, otherwise you could have a motherboard "chip" relay messages between them all.

  36. "Sun Invents Positronic Brain" by HotNeedleOfInquiry · · Score: 4, Funny

    Let's see, in 2 weeks the've anounced that they were looking a buying Novell and getting rid of circuit boards. I guess a positronic brain will be next.

    --
    "Eve of Destruction", it's not just for old hippies anymore...
    1. Re:"Sun Invents Positronic Brain" by Saeed+al-Sahaf · · Score: 1
      Let's see, in 2 weeks the've anounced that they were looking a buying Novell and getting rid of circuit boards. I guess a positronic brain will be next.

      They are getting out of hardware, buying a software house. What's next is getting rid of all the engineers (everything can be "outsourced"), and hiring a bunch of IP lawyers. We've seen this scenario, right?

      --
      "Who are in control, they are not in control of anything - they don't even control themselves!" - Glen Beck
    2. Re:"Sun Invents Positronic Brain" by upsidedown_duck · · Score: 2, Funny

      I guess a positronic brain will be next.

      Yes, but it will be tied to their stock price, for very hard to explain technical reasons, so some days it will be called a negatronic brain. For the Trekkies out there, Data and Lore are really the same android, just in positronic and negatronic modes. Those scenes where they stand side-by-side...well, a wizard did it.

      --
      -- "Makes Little Debbie look like a pile of puke!" - Moe Szyslak
    3. Re:"Sun Invents Positronic Brain" by jafuser · · Score: 1

      This reminds me of a good short sci-fi story called The Metamorphosis of Prime Intellect, where an evolving artificial intelligence used CPUs that communicated with each other via a "quantum tunnelling" type technology called the "Correlation Effect".

      It's a neat story, which also incorporates Asimov's laws of robotics as a strong basis for the plot.

      --
      Please consider making an automatic monthly recurring donation to the EFF
  37. Important info by hcetSJ · · Score: 5, Informative
    This makes the post make a little more sense, in my opinion (from the article):
    By contrast, proximity communication relies on capacitive coupling--the ability of two electrically charged devices close to each other to interact. Transmitters on one chip can send signals to another. These signals are then amplified. A much higher number of transmitter/receiver pairs than pins can be inserted in a specific area, which allows for more simultaneous connections.
    Can't get rid of the pins without replacing them with something else.
    --

    This side up.
    1. Re:Important info by sean23007 · · Score: 1

      Wait, you didn't assume that was the whole point?

      What's the story if somebody announces their brand new computer, completely free of any connection between components? In fact, I would like to announce my newest invention ...

      A Beowulf cluster of Brand New (TM) Ultra Cool Pin-Free Computers.

      --

      Lack of eloquence does not denote lack of intelligence, though they often coincide.
  38. Alignment by El · · Score: 1

    Couldn't they solve the alignment problem with a tongue-and-groove type arrangement to keep chips from moving relative to each other? I knew all my experience playing with Legos would come in handy some day... now I can snap together my own computer!

    --

    "Freedom means freedom for everybody" -- Dick Cheney

    1. Re:Alignment by Asic+Eng · · Score: 1
      Well assuming they put the chip's transmitters as close to each other as they used to with the pads for the pins - then the accuracy of the placement must be as high as the size of a pad + the distance between 2 pads. If that wasn't the case, the transmitter would align to another receiver.

      If you've ever seen a chip bonded to the carrier you'll know that the distance between pads is very very small - aligning these chips by hand would be impossible. (Also moving an actual chip die manually is difficult - it's easy to do damage, it's a lot easier handling them in plastic packages.)

    2. Re:Alignment by Anonymous Coward · · Score: 0

      As the article says, imagine scrabble tiles. The edges of the tiles have capacitive connections to adjacent tiles instead of printed circuit wires. The goal is to eliminate the pins (or solder balls, these days) and the PCB traces. These add up to a few pico-farads of capacitive load. The time and energy needed to charge that capacitance is saved by the much lower load of the capacitive-coupling to the adjacent tile, which is maybe 1/10th the load.

      There are a couple of problems:

      Differences in heating cause one tile to expand more than adjacent ones, misaligning the connections.

      Since you don't have the PCB to make connections, you have to design the tile to match the adjacent tile. This is OK if you only have 2-6 tiles, but you can't build a structure of 20 or 30 tiles without a more complex way of doing interconnects.

    3. Re:Alignment by Y2 · · Score: 1
      Hmmn, if I put a signal on one particular pair of points, then wiggle the chip with a micromanipulator, I can rapidly find the best alignment of the pair. Repeat this for a second pair and I've located it in two dimensions. Now all the points are aligned and I can lock it down.

      "And then a miracle occurs." - S. Harris

      Can you describe this "lock it down" step in a way that clearly does not cause any motion of the chip?

      --
      "But all your emitter and collector are belong to me!"
    4. Re:Alignment by davecb · · Score: 1
      My understanding is that the chips grow/shrink at the same order of magnitude, as the set is cooled by the same flow of air/refrigerant. Misalignment below an order of mangnitude is dealt with by making the pad sizes non-zero. Which is required by capacitive coupling anyway.

      --dave

      --
      davecb@spamcop.net
    5. Re:Alignment by davecb · · Score: 1
      Er, the glue dries?

      --dave

      --
      davecb@spamcop.net
    6. Re:Alignment by Y2 · · Score: 1
      Er, the glue dries?

      And as it dries, it shrinks, expands, cracks ...

      --
      "But all your emitter and collector are belong to me!"
  39. Practical Wafer-Scale Integration by VernonNemitz · · Score: 1

    Some time back I posted this, of which the the present Slashdot Article reminded me. Some of it sound similar. And some is different, of course.

  40. What about clusters? by rokzy · · Score: 1

    could this make the chips automagically scalable? could adding an extra 1GHz of processing power be like adding an extra stick of RAM?

    this kind of flexibility would be the only point going down this path imo.

    OT: why is slashdot's uptime now a matter of hours?

    1. Re:What about clusters? by Grech · · Score: 1
      >What part of "well regulated" is hard to understand?

      The bit where people forget that at the time the Constitution was penned, the term 'well regulated' was a reference to the idea of 'regular troops', i.e. those that can shoot straight, as specifically opposed to 'irregular troops' (conscript farmers with the accuracy of stormtroopers). The idea was not that the militia should necessarily be a restricted arm of the State, but that the common defense required a militia that can hit what it is aiming at.

      --
      It may not be just, but it is fair, and that is more important.
  41. Sun motherboards by ZoolTheNinja · · Score: 1

    Have you ever tried to go to BestBuy and buy a "motherboard" for a SunFire 6800?

    1. Re:Sun motherboards by xxxJonBoyxxx · · Score: 1

      No I haven't, but in large part that's my point. People are dumping Sun because of all the proprietary crap they need to support their systems. It's the same reason IBM couldn't hold on to the PC market twenty years ago.

    2. Re:Sun motherboards by Gilk180 · · Score: 1

      Actually, IBM didn't hold on to the PC market because they didn't use proprietary crap. The reason other makers could make a PC-compatible system was because IBM used off-the-shelf components. The only proprietary part on the PC was the BIOS and it was easily reverse engineered.

    3. Re:Sun motherboards by xxxJonBoyxxx · · Score: 1

      How is this different? From the customers' perspective, the cool thing about Sun is the *nix OS. However, there are thousands of "makers" (e.g., Linux distributors) out there with a similar, often compatible system. So, I think we agree that Sun isn't holding onto the *nix market because Sun's *nix implementation isn't really that proprietary. However, faced with the choice of buying expensive Sun hardware (or IBM hardware twenty years ago) to to support a similar OS, users choose the discount hardware. That's why Sun is headed down the toilet. Agreed?

    4. Re:Sun motherboards by kin_korn_karn · · Score: 1

      You've obviously never worked with high-end Sun hardware. PC hardware still can't hold a candle to it or any other manufacturer's high end servers for reliability and fault tolerance.

    5. Re:Sun motherboards by xxxJonBoyxxx · · Score: 1

      Pound-for-pound, I'll agree with you. Sun's hardware is top-of-the-line. Dollar-for-dollar, I won't agree, however. If you have unlimited budget, Sun looks good. But, if you need to live the real world, you can get the same job done cheaper with Linux and a few extra PCs.

    6. Re:Sun motherboards by ZoolTheNinja · · Score: 1

      Have you ever worked on high performance systems? I would like to see one that was "non-proprietary". Try passing 100Gbit over an IDE channel, then you can complain about "proprietary crap."

  42. Re:So now we must wrap the whole computer in tinfo by Anonymous Coward · · Score: 0

    I think that they meant "directly" through a conductive substrate, like a thin sheet of the proper material... Radio transmitters would not be practical at all.

    So, the chips would be mounted ON tinfoil themselves and restricted to it. No need to wrap it up.

  43. Fan Noise by Anonymous Coward · · Score: 0

    The heck with their CPU technology! Can't they do something useful, like cut down on the fan noise coming from my Sunblade? :-P

  44. New, Pokesun! Collect them all! by Anonymous Coward · · Score: 0, Offtopic

    Sun Corporation anounced today the release of new Pokesun collectible computer tiles!

    Catch them, arrange them, build a super-computer! But you gotta collect them all!!

  45. Sun Working to Eliminate 504 Errors by Anonymous Coward · · Score: 0

    Maybe the'll work on eliminating the 504's from this farce of a site.

  46. Sounds interesting, but they need not manufacture by tezza · · Score: 2, Interesting
    Looks like they could license this ARM style. There's a helluva lot of cross industry licensing, enforced by the ever popular Patent System.

    As an aside, I guess I'll have to stop Gaff Taping my CPU into the socket.

    --
    [% slash_sig_val.text %]
  47. Re:So now we must wrap the whole computer in tinfo by mattyrobinson69 · · Score: 1

    nope cheap and effective to prevent this from happening:

    just give your computer an earthed tinfoil hat(more of a ski mask really)

    seriously.

  48. They'll revert to wires because... by scorp1us · · Score: 0

    each [sheilded] wire as its own infinante bandwidth. With shared band width (no wires) you run into channel allocation problems which implies bandwidth size problems.

    So while you maight not have 32 wires for a 32 bit bus, you'll have wire, and all the frequencies in between.

    I don't know how they say wireless will be less power consumptive. Even if you bypass the need for a transmitter and reciver, inductance power decreases exponentially with range...

    You mitigate that by putting a shielded wire back in.

    The cable company did this years ago. It's called cable. What Sun is promissing is satalite. And we all know satalite is more expensive in hardware costs.

    You mitigate that

    --
    Slashdot's rate-of-post filter: Preventing you from posting too many great ideas at once.
    1. Re:They'll revert to wires because... by Anonymous Coward · · Score: 0

      It's obvious that you didn't even bother to read the article. I don't want to feed any trolls but since modders are dumb enough to mark the parent "interesting", I guess someone has to reply.

      There's no shared bandwidth like some other wireless communication. Capacitive coupling makes it so that each coupling is a separate channel on its own. It's somewhat like you form numerous number of capacitor between two chips - each capacitor forms a separate channel just like pins, only it's much more (2 orders of magnitude) denser and requires less power, and wastes less chip surface.

    2. Re:They'll revert to wires because... by SubliminalLove · · Score: 3, Insightful

      It is so lucky for Sun that Slashdot exists to bring together ignorant people from all over the world to tell them what their professional engineers have been unable to figure out. I'll bet no one down there had considered the fact that wireless transmission is different than wire-based transition. Hopefully some of their people are reading this, and the R&D department can get right on with dismantling the project.

      Seriously, I keep clicking the 'read comments' button hoping to read something interesting. Instead, I see a dozen posts by people who read the headline, think 'well that won't work!', and post about it. If you came up with it in half a second, do you think you're the first person to have that very original thought? Come on.

      "They think airplanes will be faster? Ha. They've completely forgotten to take headwinds into account. "

    3. Re:They'll revert to wires because... by scorp1us · · Score: 1

      "And in the year 2000 we'll all have flying cars."

      "Experts" of often wrong. Look at how he was quoted in the article. They acknowlege that they don't have a clue if it'll work or not.

      --
      Slashdot's rate-of-post filter: Preventing you from posting too many great ideas at once.
    4. Re:They'll revert to wires because... by upsidedown_duck · · Score: 1

      each [sheilded] wire as its own infinante bandwidth.

      Where will the signal decoder go on the CPU? It would essentially be a co-processor CPU fanning out to all the inputs on the main CPU and would likely introduce its own latencies and bottlenecks.

      --
      -- "Makes Little Debbie look like a pile of puke!" - Moe Szyslak
    5. Re:They'll revert to wires because... by civilizedINTENSITY · · Score: 1

      Actually its because of limitations of the bandwidth of the physical connections that they are looking at this. Parasitic capacitance is the most wellknown limiting effect. Bandwidth is simply defined as the difference between the highest and lowest frequency that a channel passes. Natural processes that act as filters will limit the bandwidth.

    6. Re:They'll revert to wires because... by be-fan · · Score: 1

      Wow. You actually tried to argue something this complex, entirely by analogy??!

      And it's spelled infinite.

      --
      A deep unwavering belief is a sure sign you're missing something...
  49. Seeing as they have pretty much eliminated profit by trailerparkcassanova · · Score: 0, Troll

    I would expect the elimination of connectors and circuit boards to follow.

  50. Advances in Artificial Organs... by Vexler · · Score: 1

    Maybe they could come up with a man who doesn't need a brain, and who lives without a pulse.

    Oh, wait, they did. Sorry, Darl.

  51. Crosstalk anyone? by Anonymous Coward · · Score: 0

    Ok, they are using "capacitive coupling" and amplified voltages
    purportedly to communicate...if the bandwidth is that high, and a bank of these things is supposed to work together, how are they going to prevent crosstalk?

    I'm having a hard time picturing a bank of 10cpus/cache/IO chips
    stacked together working without interfering with each other...

    Of course I must just be pessimistic...

    "There is no ecache problem...pay no attention to the man behind the curtain..."

    1. Re:Crosstalk anyone? by pclminion · · Score: 1
      if the bandwidth is that high, and a bank of these things is supposed to work together, how are they going to prevent crosstalk?

      Crosstalk is a magnetic effect between wires. There are no wires here, and hence no significant current, and hence no magnetic field. (Yes, for you EM geeks, there is "displacement current", in other words, magnetic induction due to the fluctuating electric field, but it's going to be miniscule.)

      The only issue would be field spread at the edges of the capacitive region, but that could be minimized with careful placement.

  52. Seymour Cray on cache ... by Triumph+The+Insult+C · · Score: 1

    "You can't fake memory bandwidth that isn't there."

    --
    vodka, straight up, thank you!
  53. Just like Legos by Phat_Tony · · Score: 2, Interesting

    Maybe the next step is for all the components to come in lego bricks. The self-organizing bus won't care what order you put them together in, so whenever you add a component (50 GB flash drive, GPU, firewire ports, ect.) you just click it on somewhere, and it adds it into the system.

    --
    Can anyone tell me how to set my sig on Slashdot?
  54. Sun should get some priorities. by TempusMagus · · Score: 3, Insightful

    Sun is the company I hate to hate. They have some of the brightest people in-house and create some amazing tech and ALWAYS seem to crap the bed on the business side. What good is a beautiful baby boy when it ends up being still-born? Man, I wish IBM just officially turn them into an R&D department.

    --
    -_-
    1. Re:Sun should get some priorities. by rjstanford · · Score: 1

      Sun is the company I hate to hate. They have some of the brightest people in-house and create some amazing tech and ALWAYS seem to crap the bed on the business side. What good is a beautiful baby boy when it ends up being still-born? Man, I wish IBM just officially turn them into an R&D department

      Hey, they're still miles ahead of TI... There's a company that screwed up the business side of pretty much every consumer or small-biz accessible product they've ever made. I mean, semis are one thing, but some of their products (heck, just look at the old 99/4A) were way ahead of their time. Pity that they couldn't market their way out of a paper bag...

      --
      You're special forces then? That's great! I just love your olympics!
  55. Oh that's great by Jedi1USA · · Score: 1

    Now when the guy downstairs fires up the microwave your computer can go ape shit along with the wireless network.

    --
    My old sig was REALLY stoopid.
  56. Could have many benefits by panurge · · Score: 3, Informative
    Although they don't specify how this will work, it seems likely that the pins could be replaced with much larger conductors for power, ground and heat removal. With the existing multi-hundred-pin chips, many of those pins are for power and ground and have to connect to individual circuit board layers. Power devices, with few I/O connections, can devote an entire side of the package to ground or Vcc.

    As for the technique of capacitive coupling, that is how signals used to pass through low voltage amps virtually since the triode tube. The technique has been used for isolation amplifiers for many years. The signal on one side of the voltage barrier is digitised in some way (perhaps just PCM) and transmitted across a voltage barrier using very small capacitors, to where it is decoded. In some cases, power for the input side is also transmitted by capacitive coupling across the barrier.

    Because the transmitting and receiving side of the capacitors is so tiny and the electric field therefore so constrained, it is not going to be possible to read the signals with an external aerial.

    I believe Philips, among others, earlier suggested using LEDs and photodiodes along the edges of packages, but appart from requiring power they could only be unidirectional. Capacitive coupling itself absorbs begligible power and can be fully bidirectional.

    --
    Panurge has posted for the last time. Thanks for the positive moderations.
    1. Re:Could have many benefits by Big_Breaker · · Score: 1

      MOSFETs, the basis for most input stages of modern ampifiers have a capacitive plate as their input. This capacitive plate creates a voltage that sucks charge carriers into a voltage "pit" on the opposite side. Filling in the voltage pit allows current to flow like turning on a switch.

      MOSFETS are used extensively in electronics. In fact except for gain stages in amplifiers the alternative, bipolar junction transistors, are almost never used.

      The concept of using a capacitive connection to pass a signal is old hat really.

    2. Re:Could have many benefits by NorwBlue · · Score: 1

      They do say they are trying to loose the pins, but there is NO reason they will remove the pins for power. And why should they? If they put, like, 4 pins in the bottom they also have a mechanism for aligning the chips.

  57. You need cooling and shielding by Engineer-Poet · · Score: 5, Informative
    (I searched all the comments for "crosstalk" and "RFI" and didn't come up with any hits... hope I'm not redundant before this is posted.)

    The problem with capacitive connections is that you are, for all intents and purposes, using small radio links. This causes several issues to come to the fore:

    • Your immunity to cross-talk goes down. Misalignment will exacerbate these problems.
    • Capacitive receivers will also be able to pick up local RF fields. The computer will be much more vulnerable to external interference than it was before.
    • The computer will also radiate much more than it did before, creating more RFI and leaking information that might be crucial (like crypto keys).
    Making the chips the meat in a sandwich with metal sheets for the bread would help this a lot, because tightly coupled ground planes attenuate both radiation and reception. As long as you're putting a ground plane on top of the assembly it might as well do double duty as a cooling device, though I wonder what effect the heat-transfer compounds would have on transmission and crosstalk.
    1. Re:You need cooling and shielding by Austerity+Empowers · · Score: 3, Interesting

      Ground planes alone would just help capture all that leaked RF energy and unhelpfully put it on your power supply return (which also can pick up outside interference and help screw with your chip sandwhich). Stuff can be done about this but you'd still have to have an off chip board with the right set of filters etc.

      Instead of screwball stuff I think it'd be more helpful to simply find ways to drastically reduce the number of pins required. Most of these chips are huge because of the 128 signal wide memory/data busses, N control/configuration pins, big address busses etc. Much of this can be replaced with comparatively fewer high speed links.

      What I'd rather see is parallel busses being replaced by very high speed serial links (all patented to hell and back of course), perhaps one link per expected peripheral (memory, adjunct processor, i/o bus, video bus, etc.). One could build a very cheap PCB that could almost be hand assembled. The problem is that each peripheral would also have to be compatible with the link. No one builds DDRs with SERDES links for example...

      80% of the boards I've designed have been pratically identical in terms of core functionality, but they've been completely different in implementation because of the differing interfaces.

    2. Re:You need cooling and shielding by carn1fex · · Score: 1

      Further I wonder how this system will consume less power than moving through the copper as they claim.. Even if they shield the case well i think there will be tons of internal RFI from crosstalk, requiring a pretty high signal to noise ratio to keep communication stable, i.e more power consumption. Bit error rates will increase likewise the faster they try to make these things. Sounds very cool tho, wish i was working on it:)

      --

      ---------

      No matter how thin you slice it, its still baloney.

    3. Re:You need cooling and shielding by CaptainPinko · · Score: 1

      # Capacitive receivers will also be able to pick up local RF fields. The computer will be much more vulnerable to external interference than it was before. # The computer will also radiate much more than it did before, creating more RFI and leaking information that might be crucial (like crypto keys). Sorry, but can't both these problems be marginalized by adding some extra shielding to the case much like some modders already do with foam to minimize sound? Hell couldn't you combine both together? Or what about making server racks into Faraday cages? That would help except for the few times when you serfice them physically?

      --
      Your CPU is not doing anything else, at least do something.
    4. Re:You need cooling and shielding by Dr.+Kinbote · · Score: 1

      > The problem with capacitive connections is that
      > you are, for all intents and purposes, using small
      > radio links

      No, you're not. There are coupling capacitors
      in nearly every input stage of nearly every
      audio device. Are these "radio links", too?

    5. Re:You need cooling and shielding by HokieJP · · Score: 1

      Well, your case already is a Faraday cage (unless you've built one of those wood cases). It's not perfect, of course, since it has holes in it, but if you make the holes smaller you increase your heat problems.

      Anyway, the problem would be other sources of RF interference inside the case itself. Your video card, for instance.

    6. Re:You need cooling and shielding by HokieJP · · Score: 1

      Well, your typical computer bus runs at several hundred MHz. Your typical audio amplifier handles a range between 20Hz and 20KHz, or somewhere in that neighborhood. So, one is operating in the RF range, and the other isn't.

    7. Re:You need cooling and shielding by Dr.+Kinbote · · Score: 1

      No. Whether or not you radiate substantially
      depends on the frequency and the geometry of your
      system. In this case, you don't.

    8. Re:You need cooling and shielding by Usagi_yo · · Score: 2, Informative
      Small directional radio links, thats why cross talk is not a major concern. The distance from one aligned pin to the other would effectivly be 1/100 the distance of adjacent pins. Thats effectively, not physically.

      No, won't radiate much more then before. We're using way less power to "transmit" then we were "driving".

      Sun is also working on pin to pin connections between large packages and open air optical connections between packages.

      But who cares, everybody says sun isn't going to make it, is bleeding away money and is on it's death bed. Groklaw thinks Sun is evilincarnate two (M$ being 1). And we're just stooges for M$.

    9. Re:You need cooling and shielding by Beryllium+Sphere(tm) · · Score: 1

      I'm not a EE but I'd expect less RF radiation/injection in a single closely spaced capacitor than in a PCB trace.

  58. Re:So now we must wrap the whole computer in tinfo by Anonymous Coward · · Score: 0

    I might be misunderstanding the article, but I did read it. "Radio waves" aren't being used, for one thing. And for another, the link is so sensitive to alignment (and presumably range) that small amounts of vibration confuse things. I don't think someone is going to eavesdrop.

  59. Wrong Wrong by Anonymous Coward · · Score: 0

    _Any_ alternating current will cause electromagnetic radiation. When current changes in a capacitor, it creates an electric field, which creates a magnetic field, which creates an electric field, and so forth. Although it may not use "radio waves" specifically, it is the unavoidable byproduct of AC.

    Oh, and our computers (save acryllic cases and such) are already encased in faraday cages. We've been wrapping them in "tinfoil" for years and years, and for the exact same reasons.

    1. Re:Wrong Wrong by brufleth · · Score: 0

      Way to back me up. I said radio waves aren't used and as you pointed out they are not. Also if you do things using matched pairs then you'll kill the signal through deconstructive interference so this is something that can be and is avoided.

    2. Re:Wrong Wrong by Gilk180 · · Score: 1

      Many people use 'radio waves' to denote any communication using wireless em not in the visible range, even if it isn't technically the right frequency to be radio waves.

    3. Re:Wrong Wrong by Anonymous Coward · · Score: 0

      To your corners busters.
      Time for a bit of mediation.
      This is more of a language usage issue than anything. When one refers to radio waves it is quite appropriate that the listener may assume you are referring to the entire electo-magnetic spectrum. That's quite a normal assumption. However, it is also quite acceptable that the speaker may be referring to shortwave radio, broadcast television or AM and FM radio frequencies specifically. This is not about right and wrong, it is simply a fact that the English language permits a degree of ambiguity in this particular case and there's nothing wrong with that.
      Okay? We clear on the ground rules?
      Alright now gloves up, I want a clean fight and I don't want any hitting below the belt.
      Ah, yes there's nothing left to fight about. Oh well. You can still call each other names.
      Here's I'll start it.
      Fuck you both, you two morons.
      Fun, huh?

  60. dammit by Anonymous Coward · · Score: 0

    and they just trained me on the wire bonder last week

  61. And if you're too lazy to use Google... by jdb2 · · Score: 3, Informative

    ...here's the paper that was presented at the conference referenced in the above post :

    http://research.sun.com/async/Publications/KPDiscl osed/sml2003-0241/sml2003-0241.pdf

    jdb2

  62. Hasnt anyone heard of waveguides? by Anonymous Coward · · Score: 0

    Have a carrier frequency of 30 GHz and use waveguides.

    1. Re:Hasnt anyone heard of waveguides? by swschrad · · Score: 1

      hmmm, two million transistors in the CPU, each consisting of junctions that look like diodes... you know, there is going to be stray voltage all over hell and gone if you feed this chip sandwich by putting it in the path of a few hundred watts of gigahertz RF. I smell substrate cooking.....

      --
      if this is supposed to be a new economy, how come they still want my old fashioned money?
  63. the problem with all this is... by Anonymous Coward · · Score: 0

    You describe the current cache situation pretty well. But this SUN BS article claims that it won't be necessary. That you won't need multiple levels of cache, so no cache chip.

    This article is just complete BS. They're marketing their stock now.

    SUN is not going to suddenly change from a workstation company to a chip technology company.

  64. Getting back in focus by Anonymous Coward · · Score: 0

    I like the concept. It seems Sun is slowly getting on track again.

  65. yes, water cooling is just transfer by Anonymous Coward · · Score: 1, Insightful

    The difference is water cooling can move heat a significant distance. Peltiers cannot. Peltiers move some heat a short distance, and then throw in more heat of their own into that small area. In short, they suck. They have very few practical uses. That's why you don't see them around much.

    1. Re:yes, water cooling is just transfer by networkBoy · · Score: 0, Redundant

      The difference is water cooling can move heat a significant distance. Peltiers cannot. Peltiers move some heat a short distance, and then throw in more heat of their own into that small area. In short, they suck. They have very few practical uses. That's why you don't see them around much.

      yeah, what he said. I was not clear enough in my inital argument against peltiers, this clarifies that nicely. Another solution may be heat pipes as they have several qualities that are positive in this environment (no open water for one).
      -nB

      --
      whois gawk date unzip strip find touch finger mount join nice man top fsck grep eject more yes exit umount sleep dump
  66. have fun at it, sun by swschrad · · Score: 1

    early crays did this by layering chip on chip with metallic layer welding between the GaAs nuggets. that's why crays had to run in freon baths or liquid air. this can be expected to raise the price of sun servers built with that type of layering technology. substantially.

    isn't the market moving in the opposite direction, towards demanding cheap commodity solutions?

    just asking....

    --
    if this is supposed to be a new economy, how come they still want my old fashioned money?
  67. write-only memory? by peter303 · · Score: 1

    Isnt chips without connectors like write-only memory?

  68. use the enemy and win. by twitter · · Score: 4, Interesting
    The article is talking about using capacitive coupling, not RF, though the two are related. The idea is to build the transmitters and the receivers directly onto the chip in place of wire connection pads. They can be much smaller, so you go from having hundreds of connectors to having thousands all much faster than wires. Interestingly enough, this exploits one of the main problems of wire signal transmission, field generation. As you may know, the longer the wire the harder it is to switch, which is why you still have sub 100MHz wire busses like PCI and people use fiber optics to move data long distances. The Sun approach has the potential to speed things up by several orderer of magnitude compared to wires.

    This is a very cool idea and it's the kind of thing I expect from Sun. Once it's stated, the solution almost looks obvious. While there's lots of work needed to make the idea practical, I admire the way they took a big noise problem and used it to propagate signal. It's too bad they are run by someone who thinks that they are going to make their money by licensing software instead of selling chips and licenses to very cool and real inventions.

    --

    Friends don't help friends install M$ junk.

    1. Re:use the enemy and win. by Anonymous Coward · · Score: 0

      Well, here's an interesting opinion from someone who "knows how it is" with Sun. At least most of the time.

    2. Re:use the enemy and win. by Anonymous Coward · · Score: 0

      man, you trolls have too much time on your hands.

  69. Benefits beyond computers by Billy+the+Mountain · · Score: 3, Interesting

    I wonder if this could lead to new treatments of spinal injuries? Say you could place a chip intervening between a severed spinal cord. Instead of having to physically attach all those millions of nerve endings, you could have the chip do it by proximity, and carry the signals on past the gap.

    BTM

    --
    That was the turning point of my life--I went from negative zero to positive zero.
    1. Re:Benefits beyond computers by pclminion · · Score: 2, Informative
      Say you could place a chip intervening between a severed spinal cord. Instead of having to physically attach all those millions of nerve endings, you could have the chip do it by proximity, and carry the signals on past the gap.

      Nerve cells already work this way. There is no physical contact between the axons and dendrites. They come very, very close to each other. A potential wave (electric pulse) travels from the nerve soma down the axon, where it causes a huge number of neurotransmitter-filled vacuoles to migrate to the cell membrane. These vacuoles open and release the neurotransmitters into the synaptic gap, where they are carried, purely by diffusion, to the receptor of the adjacent dendrite. There they bind to the dendrite surface and initiate a new, distinct electric pulse in the receiving cell.

      In other words, nerve cells work quite a bit like this "capacitive coupling" technology, except instead of using electric fields they use chemical agents to transmit signals.

      Your nervous system is partially electrical in nature, but signals are propogated between cells by chemicals, not electric pulses!

    2. Re:Benefits beyond computers by IdahoEv · · Score: 1

      The hard part is keeping the loose, cut ends of the nerve cells from dying and withering away.

      --
      I stole this sig from someone cleverer than me.
  70. How is the Heat Saved by Anonymous Coward · · Score: 0

    I see it can reduce pin space problems but fail to see why it should reduce heat A TX/RX pair, and an amplifier, required in place of every pin? A transfer across a soldered connection does not in itself create any heat.

    1. Re:How is the Heat Saved by Anonymous Coward · · Score: 0

      >transfer across a soldered connection does not in itself create any heat.

      Do you even realize what makes the heat? Moving electrons. ;p So heck yes pushing them along a very long wire (even a pin & circuit is long compared to on chip distances) at a voltage high enough to detect them at the target makes heat. Sun's method has much smaller connections and much less distance.

  71. Probably using RFID or LED to transmit data by Anonymous Coward · · Score: 0

    Obviously it's something like fiber optics using cheap ever-lasting LEDs to transmit data. However it could also use RFID. Much lower power and higher bandwidth capacity.

    JA-MSP

  72. Re:FUCK JEWS by Anonymous Coward · · Score: 0

    Ironically, without Americans there would be no September 11th. Ironically, without Muslims there would be no September 11th. This is a meaningless statement. Without Jews there would have been no mass genocide in WWII, also. The situation in the Middle East is the result of years of complex political developments that you clearly don't understand much of - Zionism was largely a reaction to European anti-Semitism, and large scale settlement in the Palestinian Protectorate began as anti-Semitism grew in Europe, leading up to the formation of Israel after World War II. The Islamic population continues to be unhappy over a tiny slice of land that they don't want to share, and the conflict is fueled by extremists on both sides. Well, actually, many Palestinians these days would be content to share (i.e. two-state solution or something comparable) apparently, but the extremists and the incompetent government on both sides won't seem to let that happen.

  73. More Star Trek Technology come to life... by martinbogo · · Score: 1

    Hmm .. independent chips, that communicate using capacitive inductance?

    Isolinear chips anyone?

    --
    "Don't worry about the problems you have in mathematics, I assure you mine are much greater." - Einstein c.1919
  74. Old News by Anonymous Coward · · Score: 0

    This is a Dupe .

  75. Read the technical paper and patent by Animats · · Score: 2, Interesting
    The news article is useless. Read the technical paper and the patent

    Sun is not "coming out with new chips without connectors". Sun has demonstrated a new kind of interconnect in a lab. They might use it in a DoD funded supercomputer project. Maybe.

    You're not going to "stack chips like Scrabble tiles". The unpackaged chips have to be aligned within a few microns and held in position. That's going to be done in an IC packaging facility. The result will be a multi-chip module, a single package containing several chips.

    Multi-chip modules have been around for a long time. The Pentium Pro, for example, was a multi-chip module. There's a multi-chip module Linux computer in a single package from ETRAX. Multi-chip modules are expensive and hard to manufacture, and they're generally used only when you need to combine chips that couldn't be manufactured on the same substrate, like a fast CPU and flash memory. They usually cost more than the chips packaged individually. That's why this isn't a mainstream technology.

    This new approach might revive the multi-chip module market. Might. This has to become a cheap process before it will be used outside the supercomputer world. A whole generation of automated assembly machinery has to be developed to assemble and align chips in multi-chip modules before this is more than a demo technology. But this looks more promising than the way multi-chip modules are currently made. If it becomes cheaper to put two chips in one package than to put two chips in two packages, this is a significant development. Otherwise, not.

    1. Re:Read the technical paper and patent by mt-biker · · Score: 1

      Thanks for the clarification and the info. Hey Mods, why isn't the parent rated +5?

      What I'm wondering is if this will lead to "3-D' chips - several layers of chips glued together and working together as a single chip. That would seem like a sure way to substantially increase performance...

    2. Re:Read the technical paper and patent by Animats · · Score: 1
      This particular technology won't lead directly to 3D chips, because the chips have to overlap face to face for this to work. 3D stacking requires that you get signals out the bottom of the chip, which requires something like a through-hole to get through the substrate.

      There are various schemes for stacking chips, but they all suffer from heat, cost, and yield problems. Stacking chips doesn't reduce cost, so it's not something the semiconductor industry pursues aggressively. Sure, you could probably make smaller RAM packages. What fraction of your computer's case volume is taken up by RAM now? 1%? That's why it's not a high priority.

  76. For everyone bitching about OSS and by PotatoHead · · Score: 2, Interesting

    its negative effect on the market, read this one again and be happy.

    OSS is bringing down the overall value of computing, which is a good thing for all of us. The increased competition means the big players must begin to really innovate of die slow. The stuff we use everyday should be cheap. Intel did its job on the hardware side of things, OSS is working hard on the Software side.

    This is the Sun I am used to seeing. I have said before, their value is in their people --nice to see them putting it to use. :)

  77. Re:Important info - Updated by smokin_juan · · Score: 0, Offtopic

    Didn't you just assume it was terrorism? Geez man, get with the times.

  78. Perhaps... by T-Ranger · · Score: 1

    Sun should be working on making their very expensive UltraSparc chips as fast as ultra cheep Intel and AMD processors.

  79. cache issues by dinog · · Score: 2, Insightful
    I was under the apparently idiotic idea that the problems with off chip cache were not so much bandwith, which is relatively easy to increase by adding more lines, but rather the latency, which is (to use a technical term) a BE-otch to decrease.

    Dean G.

    "I have a great mind to believe in Christianity for the mere pleasure of fancying I may be damned."-- some guy named George

  80. Re:[OFFTOPIC] Explanation of 503s? Post here by Anonymous Coward · · Score: 2, Funny

    It's only a special service given to subscribers. All of us freeloaders have to put up with the normal, always-on service.

  81. sound to me by Anonymous Coward · · Score: 0

    Sound to me like serialize data and some sort of packetize communications between the chips (TCP?)

    Gee, does each chip then has it own IP address? that sure will use up all the IPv4 address space.

  82. Links to articles? by rapett0 · · Score: 1, Offtopic

    I don't know if this is related...but the links between stories after you choose an article are gone, forcing me to have to go back to the homepage to get to the next article. I had a couple ideas. Did they not do some hardware upgrades not long ago? If so, maybe they are forcing stress testing on them to see whats wrong? Or maybe they sold out and are going for front page hits circa 1999. I always noticed in the subsections you could not traverse articles and always had to go back to the main page, maybe thats why. Anyway, /. /.'ing itself seems like cybersuicide.

  83. Alignment by davecb · · Score: 2, Interesting
    Hmmn, if I put a signal on one particular pair of points, then wiggle the chip with a micromanipulator, I can rapidly find the best alignment of the pair. Repeat this for a second pair and I've located it in two dimensions. Now all the points are aligned and I can lock it down.

    Pretty much the same way one aligns a glass fibre in it's termination point...

    --dave

    --
    davecb@spamcop.net
  84. all you need is cache by poot_rootbeer · · Score: 1

    their consistent mentioning of taking the cache of the chip. That's a nice dream and all, but where the hell are you going to put it then?

    With the abolishment of mainboard bottlenecks, who needs cache anymore? It'll be just as fast to pull data from main memory every time you need it.

    1. Re:all you need is cache by Jhan · · Score: 1
      With the abolishment of mainboard bottlenecks, who needs cache anymore? It'll be just as fast to pull data from main memory every time you need it.

      Uhm? Everyone?

      The reason for caches isn't that the CPU <-> memory interconnect is slow, it's that the memory itself is very, very slow compared to the insane rates at which modern CPUs process data.

      --

      I choose to remain celibate, like my father and his father before him.

  85. Re:[OFFTOPIC] Explanation of 503s? Post here by DeVilla · · Score: 3, Informative
    The appropriate forum is here.

    However, it's probably not a place to discuss it unless you have something to contribute to resolving it.

  86. Re:[OFFTOPIC] Explanation of 503s? Post here by zombiestomper · · Score: 5, Funny

    The next 503 error will be ready soon, but subscribers can beat the rush and see it early!

  87. Re:[OFFTOPIC] Explanation of 503s? Post here by MegaFur · · Score: 1

    Uh... I have nothing to contribute, but I can't resist the opportunity to post here anyway. :-)

    Yeah, I got some 503 errors trying to access slashdot about 20 min ago. It was especially weird for me because I haven't been to slashdot or tried to access it in any way for over a month. And the first time I do, what do I get? A slashdotted slashdot.

    --
    Furry cows moo and decompress.
  88. Prime Intellect by bobv-pillars-net · · Score: 1
    --
    The Web is like Usenet, but
    the elephants are untrained.
  89. Uber-cache by supabeast! · · Score: 1

    Reading between the lines, I think that this could be a ploy by Sun to solve some of their biggest problems-the high prices and late deliveries caused by producing chips with huge cache sizes-which would be a boon for Sun in the marketplace. No longer would Sun be losing the performance wars due to the delays inherent in producing chips with eight-megabytes of cache, instead a generic Ultrasparc chip could just have an appropriate chip stored externally. This would allow Sun to serve a greater variety of customers at a lower cost because it could sell the exact same chip in servers with 512k, 2MB, 4MB, and 10MB of cache as opposed to having the different chip lines it does now.

  90. Sun's research paper about this by CTho9305 · · Score: 2, Informative

    There is a research paper here that gives a lot more information than the article linked (ironically enough, I happened to be reading it yesterday). They address many of the issues people have brought up (alignment, dust, etc.), and the paper really isn't a hard read.

    They actually have a bunch of interesting papers in the parent directory here, mostly covering stuff about asynchronous/clockless computing.

  91. smash by ciderbob · · Score: 2, Funny

    I've managed to 'Eliminate Circuit Boards' without even trying in the past. I need a better soldering iron... and to control my temper

  92. what ever happened to by fred+fleenblat · · Score: 1

    the idea of using fiber optic connections between chips? far less latency over long distances, no heat or capacitive coupling problems, no noise, incredible bandwidth, only one connection instead of 900+ little metal dots.

  93. Impressive. by nycsubway · · Score: 1

    Impressive, green one.

    If these chips can do what they say, it will be very very nice.

  94. Re:So now we must wrap the whole computer in tinfo by pclminion · · Score: 1
    So all the communications inside the computer will be implemented with radio waves?

    No. A wave is a combination of an electric and a magnetic field. This capacitive coupling relies exclusively on the electric field. Yes, Maxwell's equations state that a fluctuating electric field induces a magnetic field, but the field is small.

    Theoretically, a very small amount of radiation could escape in a radial direction from the gap between the capacitor plates. But this is true of any type of capacitor.

    The chip is not using "radio waves" to communicate. It is using an electric field.

    By the way, it is very simple to spy on signals in wires, because the current flowing in a wire produces a magnetic field. This can be detected without tapping the wire.

    In other words, I can already spy on your computer if I have sophisticated enough equipment.

  95. Wow. by pclminion · · Score: 1, Flamebait
    Of all the articles I've ever read on Slashdot, this one takes the cake as far as demonstrating the utter ignorance about electromagnetism by the majority of people here.

    I admit it's a tough field (hehe) to really get a grasp on, but seriously... Don't comment with false authority on things you barely understand.

  96. Ugly File Chooser by Anonymous Coward · · Score: 0

    So will they fix that ugly ass file chooser that we are stuck with in Linux?

    That has to be one of my biggest gripes. It really sucks. This is one area, and I admit it's a small one, that Windows does a better job. I just hate the damn thing. That component has to go.

    I hate the look. I hate the non relative pathing. I hate the fact that once I start typing I've lost info. It's a total piece of crap.

  97. jamming... by Lodragandraoidh · · Score: 1

    Wouldn't such a design be jammable?

    I don't know about you, but I like the idea that my machines will keep chugging away barring a massive EMP.

    I would hate to turn on my blender, and have my server go insane...

    --

    Lodragan Draoidh
    The more you explain it, the more I don't understand it. - Mark Twain
    1. Re:jamming... by pclminion · · Score: 1
      Wouldn't such a design be jammable?

      Far less jammable than a system using wires (i.e. antennas!)

      There's a reason we put out computers inside grounded metal cases, you know.

    2. Re:jamming... by Lodragandraoidh · · Score: 1

      I was just thinking that the wires are passing electrical current - and any induction/radio frequencies are secondary - unless outside radio waves induce a destructive amount of electrical current (not likely, unless you have a handy nuclear bomb lying around - or a very powerful jammer).

      On the other hand, since these chips use inductance to generate radio waves for the purpose of communication, couldn't a lesser amount of electromagnetic radiation possibly induce spurious signals?

      That is the tack I was taking with this...

      --

      Lodragan Draoidh
      The more you explain it, the more I don't understand it. - Mark Twain
    3. Re:jamming... by pclminion · · Score: 1
      On the other hand, since these chips use inductance to generate radio waves for the purpose of communication, couldn't a lesser amount of electromagnetic radiation possibly induce spurious signals?

      I see the source of the misunderstanding. There are two kinds of inductance: electrical and magnetic. We're talking electrical inductance here. Quite simply, charge builds up on one plate and physically repels the charges from the other plate.

      This has nothing to do with radio waves. To produce a wave you need an antenna, and capacitor plates are about as far from antennas as you can get.

      In order to interfere with this system you would have to either hit it with very intense radiation -- and any such radiation would have a similar jamming effect on a traditional system with wires -- or, you would have to somehow introduce an interfering electric field into the region between the capacitor plates, which is nearly impossible to do without getting extremely close to the device.

      It will be susceptible to jamming, but to no higher degree than any other system is susceptible.

    4. Re:jamming... by Lodragandraoidh · · Score: 1

      That answers my misunderstanding of the new technology's functionality. This also explains the need to align the devices very accurately - much as the magnets and windings in an electric generator/motor are aligned.

      Thanks,

      --

      Lodragan Draoidh
      The more you explain it, the more I don't understand it. - Mark Twain
  98. Interlocking chips by Smallpond · · Score: 4, Funny

    Sun service engineer: I'm trying to fix this CPU, but all I have is sky pieces, anyone have a piece with a little bit of a boat?

  99. Good for hobbyists by heroine · · Score: 2, Interesting

    It would be good for hobbyists in that the shift to tighter pins and ball grid arrays is making it extremely expensive to fabricate single circuit boards. Imagine buying a bunch of ASICs from digikey, stacking them together with duct tape, and instantly having a custom circuit board. The sides of the chips would only need transmit, recieve, and clock plates.

    In manufacturing, the trend is still to integrate more and more on a single die. The cache will still be on the CPU but in addition, so will the system memory, graphics chip, and power supply. One day the 120V AC power cord will plug directly into the CPU.

  100. Difference? by Anonymous Coward · · Score: 0
    I figured Sun would have laid off their entire R&D department by now

    Them being Sun, how could you tell?

  101. computer parts scrabble by flmngbrd · · Score: 0

    lets see...
    CPU plus cache times triple points equals 492 points.
    oh yeah? raid array, cpu, 802.11g, gigabit NIC, dual ATI X800s times triple points equals OWNED BITOCH!!!

    ___________________ Check out really bad kung fu videos @ http://shittykungfu.com

  102. lowering th bar by wardk · · Score: 1

    gee, I thought Sun was about eliminating Linux. guess they've lowered the bar.

  103. Hexagonal Chips by MonkeyBoyo · · Score: 1

    I think this is a really cool idea. You bond you chips to some sort of substrate that that provides power and some rudimentary i/o. Then most of the chip-to-chip data flows through capacitive coupling of their edges.

    If you use square chips then each chip can talk to only 4 neighbors. However if the chips are hexagons then there are 6 neighbors which ups the grid bandwidth.

  104. Serial links? by argent · · Score: 3, Insightful

    I must say I'm skeptical about going to serial links for things like memory access. If you go from a 256 bit parallel bus running at 800 MHz to a serial link, your motherboard traces are going to have to carry a signal at something like 200 GHz to get the same bandwidth. Your circuit board is going to need to be a millimeter-wave waveguide, and what are you going to make the transducers shoveling that data over the motherboard out of? You can generate 100 GHz-THz carriers using Gunn diodes, but that's not a signal.

    You'd need optical links, and not very long ones. It probably wouldn't reduce the cost of the motherboard, anyway.

    1. Re:Serial links? by Anonymous Coward · · Score: 0

      Not with current manufacturing technology, anyway. I surely don't need to remind you that mfg tech has always been the limiting factor in hardware design and production.

    2. Re:Serial links? by tjb · · Score: 1

      If you go from a 256 bit parallel bus running at 800 MHz to a serial link, your motherboard traces are going to have to carry a signal at something like 200 GHz to get the same bandwidth

      You're assuming a 1-bit/symbol serial link using nothing but TTL logic, when really, that's just a horrible way to transport data from a spectral- efficiency standpoint.

      By using, say, a differential pair and a 64-QAM modem (in the strict modulator/demodulator sense) we can get 5-bits per clock. But really, we can probably do even better than that, given the short distances involved.

      The SNR is there to transport the data very fast in a reasonable physical bandwidth and the cost of the logic to do the transmission and receiving is getting cheaper. I wouldn't be suprised to see this approach take hold in the next 5 years or so.

      Tim

    3. Re:Serial links? by argent · · Score: 1

      OK, let's be insanely optimistic and say you're getting 10 bits per clock. You're still talking 20 GHz to get the same bandwidth as a 800 MHz FSB today.

      It may be possible, but it's NOT going to lead to significantly cheaper motherboards. That's what I found dubious in the original posting: One could build a very cheap PCB that could almost be hand assembled. I really don't think this will lead to that kind of savings.

    4. Re:Serial links? by Austerity+Empowers · · Score: 1

      Ok, first I'm insinuating what would be more practical from a sytem design perspective, not proposing a solution on existing technology. It happens existing technology is damn close though.

      Second, wireless communication by means of mutual capacitance is reasonably serial in itself, by clever design you may be able to simultaneously communicate with some small number of chips (on the order of 10s), but it's still reasonably serial. I think it would however be harder to get high bandwidth wireless serial links to be as fast and reliable as wired links.

      Third I'm not sure about your numbers, but I'm in telecomm not computers. An 800MHz FSB is actually a 200Mhz bus sampled 4x during a single clock period. The bus, I think, is 64-bits wide and is bi-directional. At best, ignoring turn around times etc., I see a bandwidth of 51.2Gbits/sec, which corresponds to the number Intel claims. This can be realized today with about 5 serial links. I'm thinking of a driver on Xilinx FPGAs that I just happen to be using today, I'm sure there are others maybe better, but it supports 10.135Gbit/s as is imminently designable on a PCB even with very long trace lengths.

      That 800MHz FSB in fact connects to the north bridge, which aggregates traffic from the DDR Bus, AGP bus and PCI busses that is bound to the CPU. Instead, why not give one serial link to each memory (usually at least 4, often more), one to AGP and another to PCI? You're still perfectly modular and have a far simpler PCB that you can still "mix and match" assuming everyome supports the same protocols.

      Fundamentally I think Sun has a good idea but the wrong implementation. It would seem what is needed is a standardized, unburdened serial link standard, and a standardized protocol for data transfer across it for compute oriented applications. Sun however probably wishes to own the IP and make money from it, so this isn't in their interests.

    5. Re:Serial links? by argent · · Score: 1

      The memory bus is the big problem. You can probably get the same aggregate bandwidth for memory by having a lot of memory slots and populating all of them from the start. HP does that for their high-end servers.

      The problem is that this is an expensive approach for a couple of reasons.

      First, you need a lot of slots. Most cheap PCs (assuming the goal of this is to cut costs to the point where you can hand-build a board, it's got to be something useful at the low end) only have a few memory slots, and the count has gone down over time: my old 486 had 16 SIMM slots, most of the PII and PIII boxes I've seen have had 4, and most PCs with DIMMs only have 2 or 3. Some only have one, though people tend to want room for expansion. Which brings us to...

      Second, even if you have lots of slots you generally don't want to populate them all at once. It's cheaper to buy one large DIMM and add another later than to buy two and throw them away when you upgrade.

      As a tool for peripheral interconnect (to replace your PCI and AGP slots) it's a great idea. Use Sun's design to put fast RAM stagger-stacked on your CPU with a nice fat bus, then run serial links to the peripherals.

      wireless communication by means of mutual capacitance is reasonably serial in itself

      Well, any individual link is serial, yes, but having direct chip-chip links lets you use lots of them. Have a look at the original paper. They're talking about hundreds of links between the chips.

      I didn't realise that PC busses were still only 64-bit, though. 64-bits is pretty narrow for a processor bus: Alphas have used 128-bit busses since EV4... 128 bit busses on graphics cards are pretty normal, and I believe 256 bit isn't unknown.

    6. Re:Serial links? by Austerity+Empowers · · Score: 1

      I was speaking in terms of the design of memory chips themselves, each of them supporting a 10G link for example could today, support compatible bandwidth from the current parallel bus approach and do bank switching in a number of ways.

      You could still build a "DIMM-like" module to plug in on board, so your module density would be comparable if you wanted, or throw down your "scrabble" chips singly. Either one works, and has an exact parallel to the more far fetched Sun approach. Let's face it, the real bottleneck in ANY system is memory, they're slow. I can see us building a scrabble board (out of FR4 instead of silicon), where each tile is a big serial link that speaks some common language. You could lay down "words" of memory that take 4 tiles, or one at a time. Each specific technology probably has it's own wants.

      128-bit wide and 256-bit wide busses on video cards do exist and are always to memories, and memories these days are 16-bit wide each even for Alpha's, and ganged together in parallel. So the bandwidth to each device is quite replaceable by a serial link.

      I did not see a paper attached in the article, and the article itself seemed the usual level of gee-whiz that I'd expect. I saw what seemed to be fact (packaging bottleneck for ASICs) with some things that seemed to be under investigation "there is a noticeable change in voltage levels at the receiver" to wild speculation about scrabble tiles and chips. I can't quite make the leap from what they COULD be talking about that would allow for a multitde of "wireless" links, to "dropping chips in like scrabble tiles". As far as I know if you have two circuits communicating by some electric field between them, you either a) have to use enough power that one can talk to the other through a large area or b) have to place them very close together. When someone says they have two "wireless" circuits communicating by mutual capacitance, I think of two networks placed so closely together that the air (or silicon) between them forms an adequate dielectric that they act like a capacitor has been placed in series between them. To do this in silicon you'd really need to place the CPU "pad" very close to the cache "pad", far more precicely than could be done in the field. The benefits I see are tangible, you could build flavors of a chip with various cache sizes without a complete relayout and requalification of the ASIC, but not revolutionary to us end users. In fact technology to do this also exists today but remains unused (www.sychip.com used to do this, and may still in some form). I'm interested in reading a paper written by an engineer if you know where it is, but the article sounds just way too gee-whiz for me to take seriously and the /. title makes it worse =/

      I am aware of a few DARPA projects where they are building these "chip sandwhiches" but they're all made in a semiconductor fab, and the yields aren't too great.

      So maybe this technology they're coming up with isn't too bad from the standpoint of helping build a more flexible processor design, I don't see that you'll have a scrabble computer though, or that us end-users will see much benefit. We'll still have to buy a CPU with some amount of cache built on, and still have to have PCBs to connect the CPU to everything else. And they're still going to be beasts to design.

    7. Re:Serial links? by argent · · Score: 1

      The paper was pointed to in one of the messages on /. - and you realy ought to look it up (I don't seem to have the address in history on this machine), because it seems we're talking at cross-purposes. It doesn't seem to make any claims about replacing the motherboard, it's really talking about building faster multi-chip modules by using stacks of silicon in direct contact rather than placing the silicon on carriers and wiring them together.

  105. Re:[OFFTOPIC] Explanation of 503s? Post here by Anonymous Coward · · Score: 0

    Read here for what the problem is and a work-around..

  106. Does this sound familiar to anyone else by jjhall · · Score: 1

    Sometime last year there was an article pointing to The Metamorphosis of Prime Intellect. I couldn't find the Slashdot article in the archives, but here is the story: http://www.kuro5hin.org/prime-intellect/

    To sum up the point of my reference, they made full processors with only 3 pins for power, and the chips used the "Correlation Effect" to communicate with each other. I immediately thought of this story when I read this article.

    A good store nonetheless. Just goes to show that sometimes Science Fiction isn't too far stretched from Science, given enough time.

    Jeremy

  107. How many points for spelling W-I-N-D-O-W-S? by Anonymous Coward · · Score: 0
    Of course, you'd leave yourself open to someone trying to get rid of a bunch of consonents. Say, B, S, and D....

    I just couldn't resist :-)

  108. Nothing to do with printed circuit boards by JonKatzIsAnIdiot · · Score: 2, Informative

    This technology pertains more to chip manufacture than motherboard manufacture. The alignment difficulties alone will prevent this from being seen in the field. According to the research paper, the scientists first aligned the chips using a 10x stereo microscope, then used a Vernier measurement system to align them to within a few microns. There's no way that process will be seen outside of a lab or manufacturing plant.

    What this will let chip makers do is to manufacture the cpu and cache on separate silicon wafers, then stack them together and package them as a unit. The researchers claim a speed of 21.6 Gigabits/second using a 4x4 matrix of transmitters. Perhaps we'll see processors being sold with X Gig of memory on-board, with X being the amount of memory that can be manufactured in the same space as the CPU. Perhaps additional processors could be stacked together as well. Imagine putting 4 CPU's and 4 Gig of memory into a spot on a motherboard that takes 1 CPU today. You will still need a printed circuit board to connect to the circuitry that handles the external devices, ports, slots, etc.

  109. Re:Alignment - truncated tetrahedrons by mikael · · Score: 1

    There was once an article about a guy who had filed a patent on a novel shape of brick. One problem was that any garden patio or driveway could deform due to flooding and heavy objects. Various solutions including placing layers of clay, cement and sand below ordinary shapes bricks. His solution was to have bricks in the shape of truncated tetrahedrons; take a tetrahedron and clip off two adjacent edges. This will leave two rectangle aligned at 90 degrees to each other. Placed side by side, the bricks would lock each other into shape, and thereby prevent any deformation.

    --
    Vintage computer adverts: http://www.vintageadbrowser.com/computers-and-software-ads
  110. Tesla power distribution system? by michaelmalak · · Score: 1

    If the chips are to be as pinless as a Scrabble tile, how will they be powered?

  111. Wow by srenker · · Score: 1

    Sun could get rid of the computers altogether and be really efficient!

    --
    My new /. login is fabu10u$.
  112. Re:[OFFTOPIC] Explanation of 503s? Post here by scruffy · · Score: 1
    Would you rather see the 503s or this color scheme?

    Your opinion might be different, but to me, it's a close call.

  113. Lies, Damn Lies, and News.com articles by mr_mischief · · Score: 1
    "Although the performance of processors has steadily increased in the past 20 years, the performance of the input-output paths that connect these chips to the rest of the computer hasn't, resulting in well-documented bottlenecks" is not quite right.

    Bus speeds haven't kept pace with processor speeds, to be sure. However, saying they haven't increased is completely untrue. Whether or not you can say the the improvements in bus speeds have failed to increase "steadily" is a matter of what scale one is using to measure the improvements. From 8 bits at under 5 megahertz to 64 bits at 1.6 gigahertz is quite an improvement.

    Perhaps the improvements haven't been steady enough for News.com, but steadiness isn't the point. The overall improvement is. There's more improvement desired, to be sure. Which is better: watching bus speeds improve "steadily", or to watch a breakthrough occur so that bus speeds once again match processor speeds? That's one breakthrough not likely to happen -- at least not any time soon. However, such a breakthrough would be much better than improvement at a pointless steady rate.

  114. Back in the Olde Days... by Gigantic1 · · Score: 1
    Back in the olde days when I was a whipper-snapper engineer...coupling signals between counductors on a circuit board was reffered to as "Electromagnetic Induction" and all sorts of methods were used to prevent it: grounding, shielding, trace-crossing, mini Faraday Cages, etc..

    Now...it seems like someone wants to use the property to couple signals. Coooool!!!! Let's work with nature instead of against her! However, this will be one hell of a feat of Physics to pull off on a large Multi-chip Module: something that Physicists and PHd EEs can really sink thier teeth in to. Good to see some real neet analytical science comming back to basic circuit design.

  115. Huh? by Anonymous Coward · · Score: 0

    Looks like Sun has returned to their well-deserved place as *the* den for executive-level crack-smoking.

  116. HAL 9000 by sstidman · · Score: 1

    Does anyone else read this and have visions of the HAL 9000? Here's another picture in case the first one gets Slashdotted.

    --
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  117. Re:[OFFTOPIC] Explanation of 503s? Post here by yodaj007 · · Score: 1

    Dude, you've got to plug your computer in...

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  118. Question about tin-foil hats by satans_advocate · · Score: 1

    The tin-foil hat is a much discussed, and from what I can gather, much needed item in the counter-geek apparrel. Unfortunately, I can't seem to find any tin foil in the country in which I live, only aluminium foil.

    So my question to the geek community is (and it's a technical question) ... To avoid the government/illuminati mind control waves, does the foil have to be tin? Or will aluminium suffice? And if aluminium is not suitable, what can be done? It's impossible to find tin foil here, and tin cans are not very malleable, so shaping them into a hat presents new difficulties, besides which the tin can is mostly steel anyway.

    Your answers are greatly appreciated.

  119. Great, but how's this going to affect test? by Anonymous Coward · · Score: 0

    Im an Electrical Engineer for a large government contractor and right now im currently working on Support&Test systems for one of our programs. My main job right now is to come up with ways to easily test surface mounted chips such as BGA's (Ball Gate Array). The old generation of IC's which had pins that ran through the PC board lent themselves well to testing because we could just lay the PCB on a "bed of nails" which would probe the pins on the backside of the PCB. With surface mounted chips this isnt so, there are no pins to probe and so JTAG created IEEE 1149.1 which is boundary scan testing, basically build the test circuitry into the IC itself. This proved very usefull, but it quickly became apparent that it had a big shortcomming, it only supported digital I/O and you would be hard pressed to find circuits now a days that arnt mixed signal (ie Analog + Digital). So an update to 1149.1 was made to allow analog probing called 1149.4. Only problem is, nobody has adopted it yet! Why you ask? Well because nobody has made software to easilly support it. And why is that? Well because nobody has shown much interest DUE TO THE LACK OF SOFTWARE! So as you can see we are currently stuck in the chicken and the egg scenario.

    When you are dealing with Mil-spec testing such I, your worst nightmare is a non-repeatable failure. That is something went wrong but you don't know what and you cant make it happen again. When you toss up something into space, it has to work the first time EVERY time, no second chances in my line of business. I could only imagine the nightmares the poor sap would have who has to test one of these things. Surface mount is bad enough, but now they are introducing a myraid of external sources of error to the soup when the signals relay on inductance and capacitance which probably isnt much higher than the parasitic levels. I can only help they keep us test guys in the back of thier mind during R&D

  120. Pardon my french B***S***. by rew · · Score: 1

    A single wire is currently used to transfer say 400Mbps. So you use 128 of them to get 6.4 gB per second of bandwidth to your main memory. (that's beyond the cache!)

    If you'd use wireless, and you'd use the 2.4Ghz "band" there is on the order of 2.4Gbits per second of bandwidth. If you stretch it a bit, you'd be able to get about 2.4 Gbytes per second. Use more bandwidth, and you'd be able to get enough for ONE cpu and ONE memory, but no SMP. And you still need your cache.

    Now while the first CPU is communicating with it's main memory, you want the second CPU to do the same to a separate memory. Well, they are going to interfere if you don't channel the data trhough those copper guides, commonly called wires....

    Note that when you put conductors on a PCB, you get to send more signals just a couple of cm further. But with wireless, you would "spoil" a whole sphere for other uses. Nah. This won't go far.